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Thin Films on Silicon

Author : Vijay Narayanan

Publisher :

Page : 550 pages

File Size : 47,47 MB

Release : 2016

Category : Electronic books

ISBN : 9789814740487

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Book Description

"This volume provides a broad overview of the fundamental materials science of thin films that use silicon as an active substrate or passive template, with an emphasis on opportunities and challenges for practical applications in electronics and photonics. It covers three materials classes on silicon: Semiconductors such as undoped and doped Si and SiGe, SiC, GaN, and III-V arsenides and phosphides; dielectrics including silicon nitride and high-k, low-k, and electro-optically active oxides; and metals, in particular silicide alloys. The impact of film growth and integration on physical, electrical, and optical properties, and ultimately device performance, is highlighted."--Publisher's website.



Gallium Nitride And Silicon Carbide Power Devices

Author : B Jayant Baliga

Publisher : World Scientific Publishing Company

Page : 592 pages

File Size : 50,7 MB

Release : 2016-12-12

Category : Technology & Engineering

ISBN : 9813109424

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Book Description

During the last 30 years, significant progress has been made to improve our understanding of gallium nitride and silicon carbide device structures, resulting in experimental demonstration of their enhanced performances for power electronic systems. Gallium nitride power devices made by the growth of the material on silicon substrates have gained a lot of interest. Power device products made from these materials have become available during the last five years from many companies.This comprehensive book discusses the physics of operation and design of gallium nitride and silicon carbide power devices. It can be used as a reference by practicing engineers in the power electronics industry and as a textbook for a power device or power electronics course in universities.



Electronic Materials Handbook

Author :

Publisher : ASM International

Page : 1234 pages

File Size : 50,73 MB

Release : 1989-11-01

Category : Technology & Engineering

ISBN : 9780871702852

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Book Description

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.



Advances in Electronics, Communication and Computing

Author : Akhtar Kalam

Publisher : Springer

Page : 808 pages

File Size : 15,93 MB

Release : 2017-10-27

Category : Technology & Engineering

ISBN : 9811047650

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Book Description

This book is a compilation of research work in the interdisciplinary areas of electronics, communication, and computing. This book is specifically targeted at students, research scholars and academicians. The book covers the different approaches and techniques for specific applications, such as particle-swarm optimization, Otsu’s function and harmony search optimization algorithm, triple gate silicon on insulator (SOI)MOSFET, micro-Raman and Fourier Transform Infrared Spectroscopy (FTIR) analysis, high-k dielectric gate oxide, spectrum sensing in cognitive radio, microstrip antenna, Ground-penetrating radar (GPR) with conducting surfaces, and digital image forgery detection. The contents of the book will be useful to academic and professional researchers alike.



Silicon Nitride for Microelectronic Applications

Author : J. T. Milek

Publisher : Springer Science & Business Media

Page : 124 pages

File Size : 36,25 MB

Release : 2013-03-14

Category : Technology & Engineering

ISBN : 1461596092

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Book Description

This survey is concerned with the use of silicon nitride in the semi conductor and microelectronics industries. The Handbook of Electronic Materials, volume 3, comprises part 1 of this survey and includes preparation and properties information. This report was prepared by Hughes Aircraft Company, Culver City, California under Contract Number F336lS-70-C-1348. The work was admini stered under the direction of the Air Force Materials Laboratory, Air Force Systems Command, Wright-Patterson Air Force Base, Ohio, with Hr. B. Emrich, Project Engineer. The Electronic Properties Information Center (EPIC) is a designated Information Analysis Center of the Department of Defense, authorized to pro vide information to the entire DoD community. The purpose of the Center is to provide a highly competent source of information and data on the electronic, optical and magnetic properties of materials of value to the Department of Defense. Its major function is to evaluate, compile and publish the experi mental data from the world's unclassified literature concerned with the properties of materials. All materials relevant to the field of electronics are within the scope of EPIC: insulators, semiconductors, metals, super conductors, ferrites, ferroelectrics, ferromagnetics, electroluminescents, thermionic emitters and optical materials. The Center's scope includes information on over 100 basic properties of materials; information generally regarded as being in the area of devices and/or circuitry is excluded. v CONTENTS Foreword. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Diffusion Mask Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . '" 11 Glass-to-Metal Seals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Passivation Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 Memory Devices. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41 Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Radiation Hardening Applications . . . . . . . . . . . . . . . •. . . . . . . . .





III-Nitride Semiconductors and Their Modern Devices

Author : Bernard Gil

Publisher : Semiconductor Science and Tech

Page : 661 pages

File Size : 49,42 MB

Release : 2013-08-22

Category : Science

ISBN : 0199681724

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Book Description

All recent developments of nitrides and of their technology are gathered here in a single book, with chapters written by world leaders in the field.



Silicon Nitride for Microelectronic Applications

Author : John T. Milek

Publisher : Springer Science & Business Media

Page : 126 pages

File Size : 41,35 MB

Release : 2013-03-14

Category : Technology & Engineering

ISBN : 1468461621

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Book Description

The large amount of literature on the technology of thin film silicon nitride indi cates the interest of the Department of Defense, NASA and the semiconductor industry in the development and full utilization of the material. This survey is concerned only with the thin film characteristics and properties of silicon nitride as currently utilized by the semiconductor or microelectronics industry. It also includes the various methods of preparation. Applications in microelectronic devices and circuits are to be provided in Part 2 of the survey. Some bulk silicon nitride property data is included for basic reference and comparison purposes. The survey specifically excludes references and information not within the public domain. ACKNOWLEDGEMENT This survey was generated under U.S. Air Force Contract F33615-70-C-1348, with Mr. B.R. Emrich (MAAM) Air Force Materials Laboratory, Wright-Patterson Air Force Base, Ohio acting as Project Engineer. The author would like to acknowledge the assis tance of Dr. Judd Q. Bartling, Litton Systems, Inc., Guidance and Control Systems Division, Woodland Hills, California and Dr. Thomas C. Hall, Hughes Aircraft Company, Culver City, California in reviewing the survey. v CONTENTS Preface. i Introduction 1 Literature Review. 1 Bulk Characteristics 1 Technology Overview. 2 References 4 Methods of Preparation • 5 Introduction • 5 Direct Nitridation Method 8 Evaporation Method • 9 Glow Discharge Method. 10 Ion Beam Method. 13 Sputtering Methods 13 Pyrolytic Methods. 15 Silane and Ammonia Reaction 15 Silicon Tetrachloride and Tetrafluoride Reaction. 24 Silane and Hydrazine Reaction 27 Production Operations. 28 Equipment.



Nitride Ceramics

Author : Alexander A. Gromov

Publisher : John Wiley & Sons

Page : 362 pages

File Size : 47,34 MB

Release : 2015-01-20

Category : Science

ISBN : 3527337555

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Book Description

A comprehensive overview of recent developments in the field of non-oxide ceramics with special emphasis placed on the combustion synthesis of group I-VI nitrides and oxynitrides. To ensure the widest possible perspective, the authors are experts in academia, industry, or government research, and each chapter discusses different synthetic methods and process parameters, as well as important material properties and applications. The result is invaluable reading for researchers and practitioners in the industry as well as those looking for an introduction to the field. It is equally of great interest to chemists and materials scientists as well as engineers working in the area of inorganic and solid-state chemistry, structural and functional materials, catalysis, metallurgy, and electrochemistry.



Molecular Sensors and Nanodevices

Author : John X. J. Zhang

Publisher : Academic Press

Page : 606 pages

File Size : 17,21 MB

Release : 2018-11-19

Category : Technology & Engineering

ISBN : 0128148632

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Book Description

Molecular Sensors and Nanodevices: Principles, Designs and Applications in Biomedical Engineering, Second Edition is designed to be used as a foundational text, aimed at graduates, advanced undergraduates, early-career engineers and clinicians. The book presents the essential principles of molecular sensors, including theories, fabrication techniques and reviews. In addition, important devices and recently, highly-cited research outcomes are also cited. This differentiates the book from other titles on the market whose primary focus is more research-oriented and aimed at more of a niche market. - Covers the fundamental principles of device engineering and molecular sensing, sensor theories and applications in biomedical science and engineering - Introduces nano/micro fabrication techniques, including MEMS, bioMEMS, microTAS and nanomaterials science that are essential in the miniaturization of versatile molecular sensors - Explores applications of nanomaterials and biomaterials, including proteins, DNAs, nanoparticles, quantum dots, nanotubes/wires and graphene in biomedicine