Surface Insulation Resistance Handbook


Book Description




Metric Handbook


Book Description

Significantly updated in reference to the latest construction standards and new building types Sustainable design integrated into chapters throughout Over half of the entire book has now been updated since 2015 Over 100,000 copies sold to successive generations of architects and designers This book belongs in every design office. The Metric Handbook is the major handbook of planning and design data for architects and architecture students. Covering basic design data for all the major building types it is the ideal starting point for any project. For each building type, the book gives the basic design requirements and all the principal dimensional data, and succinct guidance on how to use the information and what regulations the designer needs to be aware of. As well as buildings, the Metric Handbook deals with broader aspects of design such as materials, acoustics and lighting, and general design data on human dimensions and space requirements. The Metric Handbook is the unique reference for solving everyday planning problems.




HVAC and Chemical Resistance Handbook for the Engineer and Architect


Book Description

The title is misleading until you check out the contents. It is all about HVAC and more. This compilation has organized data frequently used by Mechanical Engineers, Mechanical Contractors and Plant Facility Engineers. The book will end the frustration on a busy day searching for design criteria.




Metric Handbook


Book Description

For each building type, the book gives basic design requirements, principal dimensional data and details of relevant building regulations. The book also contains information on broader aspects of design applicable to all building types, such as materials, acoustics and lighting, and data on human dimensions and space requirements. Significantly updated, the new edition of this work focuses on sustainable design practice to make projects competitive within a green market.




The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects


Book Description

The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is the work of the European network ELFNET which was founded by the European Commission in the 6th Framework Programme. It brings together contributions from the leading European experts in lead-free soldering. The limited validity of testing methods originating from tin-lead solder was a major point of concern in ELFNET members' discussions. As a result, the network's reliability group decided to bring together the material properties of lead-free solders, as well as the basics of material science, and to discuss their influence on the procedures for accelerated testing. This has led to a matrix of failure mechanisms and their activation and, as a result, to a comprehensive coverage of the scientific background and its applications in reliability testing of lead-free solder joints. The ELFNET Book on Failure Mechanisms, Testing Methods, and Quality Issues of Lead-Free Solder Interconnects is written for scientists, engineers and researchers involved with lead-free electronics.




Electronic Materials Handbook


Book Description

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.




Soldering Handbook For Printed Circuits and Surface Mounting


Book Description

Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.










The Electrical Engineering Handbook


Book Description

The Electrical Engineer's Handbook is an invaluable reference source for all practicing electrical engineers and students. Encompassing 79 chapters, this book is intended to enlighten and refresh knowledge of the practicing engineer or to help educate engineering students. This text will most likely be the engineer's first choice in looking for a solution; extensive, complete references to other sources are provided throughout. No other book has the breadth and depth of coverage available here. This is a must-have for all practitioners and students! The Electrical Engineer's Handbook provides the most up-to-date information in: Circuits and Networks, Electric Power Systems, Electronics, Computer-Aided Design and Optimization, VLSI Systems, Signal Processing, Digital Systems and Computer Engineering, Digital Communication and Communication Networks, Electromagnetics and Control and Systems.About the Editor-in-Chief...Wai-Kai Chen is Professor and Head Emeritus of the Department of Electrical Engineering and Computer Science at the University of Illinois at Chicago. He has extensive experience in education and industry and is very active professionally in the fields of circuits and systems. He was Editor-in-Chief of the IEEE Transactions on Circuits and Systems, Series I and II, President of the IEEE Circuits and Systems Society and is the Founding Editor and Editor-in-Chief of the Journal of Circuits, Systems and Computers. He is the recipient of the Golden Jubilee Medal, the Education Award, and the Meritorious Service Award from the IEEE Circuits and Systems Society, and the Third Millennium Medal from the IEEE. Professor Chen is a fellow of the IEEE and the American Association for the Advancement of Science.* 77 chapters encompass the entire field of electrical engineering.* THOUSANDS of valuable figures, tables, formulas, and definitions.* Extensive bibliographic references.