TCAD for Si, SiGe and GaAs Integrated Circuits
Author : G. A. Armstrong
Publisher :
Page : pages
File Size : 11,73 MB
Release : 2007
Category : Computer-aided design
ISBN :
Author : G. A. Armstrong
Publisher :
Page : pages
File Size : 11,73 MB
Release : 2007
Category : Computer-aided design
ISBN :
Author : C. K. Maiti
Publisher :
Page : pages
File Size : 12,71 MB
Release : 2007
Category : Computer-aided design
ISBN :
The 2005 International Technology Roadmap for Semiconductors (ITRS) predicts that the use of Technology computer-aided design (TCAD) will provide as much as a 40 per cent reduction in technology development costs by reducing the number of experimental lots and shortening development time for the semiconductor industry. In a highly competitive manufacturing environment, one needs to take the full advantage of the predictive power of TCAD to reduce cost and time for product development. Currently, process and device simulation has established itself as an indispensable tool for developing and optimising device and microelectronic process technologies in the R & D phase. With the device compact model parameter extraction for circuit analysis, TCAD can be extended into manufacturing for advanced process control and parametric yield analysis. Each chapter ensures coverage of up-to-date TCAD research results for state-of the-art devices and a comprehensive list of seminal references. In summary, this book fills a gap in the literature in a rapidly evolving field, as it blends together a wide ranging description of TCAD activities in Si, SiGe and GaAs materials, technology, device and their applications. An extensive reference list provided in each chapter will help the reader identify the key stages in the development of TCAD from early research through to its integration in current manufacturing
Author : G.A. Armstrong
Publisher : IET
Page : 457 pages
File Size : 26,27 MB
Release : 2007-11-30
Category : Technology & Engineering
ISBN : 0863417434
The first book to deal with a broad spectrum of process and device design, and modeling issues related to semiconductor devices, bridging the gap between device modelling and process design using TCAD. Presents a comprehensive perspective of emerging fields and covers topics ranging from materials to fabrication, devices, modelling and applications. Aimed at research-and-development engineers and scientists involved in microelectronics technology and device design via Technology CAD, and TCAD engineers and developers.
Author : Chinmay K. Maiti
Publisher : CRC Press
Page : 275 pages
File Size : 27,78 MB
Release : 2021-06-29
Category : Science
ISBN : 1000404935
Anticipating a limit to the continuous miniaturization (More-Moore), intense research efforts are being made to co-integrate various functionalities (More-than-Moore) in a single chip. Currently, strain engineering is the main technique used to enhance the performance of advanced semiconductor devices. Written from an engineering applications standpoint, this book encompasses broad areas of semiconductor devices involving the design, simulation, and analysis of Si, heterostructure silicongermanium (SiGe), and III-N compound semiconductor devices. The book provides the background and physical insight needed to understand the new and future developments in the technology CAD (TCAD) design at the nanoscale. Features Covers stressstrain engineering in semiconductor devices, such as FinFETs and III-V Nitride-based devices Includes comprehensive mobility model for strained substrates in global and local strain techniques and their implementation in device simulations Explains the development of strain/stress relationships and their effects on the band structures of strained substrates Uses design of experiments to find the optimum process conditions Illustrates the use of TCAD for modeling strain-engineered FinFETs for DC and AC performance predictions This book is for graduate students and researchers studying solid-state devices and materials, microelectronics, systems and controls, power electronics, nanomaterials, and electronic materials and devices.
Author : Chinmay K. Maiti
Publisher : CRC Press
Page : 438 pages
File Size : 33,68 MB
Release : 2017-03-16
Category : Science
ISBN : 9814745529
This might be the first book that deals mostly with the 3D technology computer-aided design (TCAD) simulations of major state-of-the-art stress- and strain-engineered advanced semiconductor devices: MOSFETs, BJTs, HBTs, nonclassical MOS devices, finFETs, silicon-germanium hetero-FETs, solar cells, power devices, and memory devices. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including design for manufacturing (DFM), and from device modeling to SPICE parameter extraction. The book also offers an innovative and new approach to teaching the fundamentals of semiconductor process and device design using advanced TCAD simulations of various semiconductor structures. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. To extend the role of TCAD in today’s advanced technology era, process compact modeling and DFM issues have been included for design–technology interface generation. Unique in approach, this book provides an integrated view of silicon technology and beyond—with emphasis on TCAD simulations. It is the first book to provide a web-based online laboratory for semiconductor device characterization and SPICE parameter extraction. It describes not only the manufacturing practice associated with the technologies used but also the underlying scientific basis for those technologies. Written from an engineering standpoint, this book provides the process design and simulation background needed to understand new and future technology development, process modeling, and design of nanoscale transistors. The book also advances the understanding and knowledge of modern IC design via TCAD, improves the quality in micro- and nanoelectronics R&D, and supports the training of semiconductor specialists. It is intended as a textbook or reference for graduate students in the field of semiconductor fabrication and as a reference for engineers involved in VLSI technology development who have to solve device and process problems. CAD specialists will also find this book useful since it discusses the organization of the simulation system, in addition to presenting many case studies where the user applies TCAD tools in different situations.
Author : Chinmay K. Maiti
Publisher : CRC Press
Page : 340 pages
File Size : 15,45 MB
Release : 2022-11-17
Category : Technology & Engineering
ISBN : 1000638057
This book deals with 3D nanodevices such as nanowire and nanosheet transistors at 7 nm and smaller technology nodes. It discusses technology computer-aided design (TCAD) simulations of stress- and strain-engineered advanced semiconductor devices, including III-nitride and RF FDSOI CMOS, for flexible and stretchable electronics. The book focuses on how to set up 3D TCAD simulation tools, from mask layout to process and device simulation, including fabless intelligent manufacturing. The simulation examples chosen are from the most popular devices in use today and provide useful technology and device physics insights. In order to extend the role of TCAD in the More-than-Moore era, the design issues related to strain engineering for flexible and stretchable electronics have been introduced for the first time.
Author : Azad, Abul K.M.
Publisher : IGI Global
Page : 676 pages
File Size : 45,83 MB
Release : 2011-11-30
Category : Education
ISBN : 1613501870
"This book presents current developments in the multidisciplinary creation of Internet accessible remote laboratories, offering perspectives on teaching with online laboratories, pedagogical design, system architectures for remote laboratories, future trends, and policy issues in the use of remote laboratories"--Provided by publisher.
Author : Chinmay Kumar Maiti
Publisher : World Scientific
Page : 465 pages
File Size : 12,90 MB
Release : 2016-10-27
Category : Technology & Engineering
ISBN : 9814713090
Micro and nanoelectronic devices are the prime movers for electronics, which is essential for the current information age. This unique monograph identifies the key stages of advanced device design and integration in semiconductor manufacturing. It brings into one resource a comprehensive device design using simulation. The book presents state-of-the-art semiconductor device design using the latest TCAD tools.Professionals, researchers, academics, and graduate students in electrical & electronic engineering and microelectronics will benefit from this reference text.
Author : Hamzah Asyrani Sulaiman
Publisher : Springer
Page : 1063 pages
File Size : 35,64 MB
Release : 2014-11-01
Category : Technology & Engineering
ISBN : 3319076744
This book covers diverse aspects of advanced computer and communication engineering, focusing specifically on industrial and manufacturing theory and applications of electronics, communications, computing and information technology. Experts in research, industry, and academia present the latest developments in technology, describe applications involving cutting-edge communication and computer systems and explore likely future directions. In addition, access is offered to numerous new algorithms that assist in solving computer and communication engineering problems. The book is based on presentations delivered at ICOCOE 2014, the 1st International Conference on Communication and Computer Engineering. It will appeal to a wide range of professionals in the field, including telecommunication engineers, computer engineers and scientists, researchers, academics and students.
Author : Joseph Mun
Publisher : Free Press
Page : 480 pages
File Size : 43,77 MB
Release : 1988
Category : Technology & Engineering
ISBN :