The Printed Circuit Designer's Guide To... Thermal Management


Book Description

Thermal management is one of the fastest-growing areas of the PCB segment, far outpacing the projected growth for the overall industry. While demand was originally driven by high-power telecommunication and mil-aero applications, it has rapidly expanded to include automotive, consumer electronics, and medical sectors.Written by Anaya Vardya, this book serves as a desk reference for designers on the most current thermal management techniques and methods from a PCB fabrication perspective, including a case study on an extreme mixed-technology design. Vardya also shares considerations designers should discuss with their PCB fabricators to ensure manufacturability, cost-effective solutions, and successful product launches.PCB designers and design engineers, both new and veteran, will learn how to "beat the heat" by gaining a thorough understanding of thermal management design processes.







The Art of Software Thermal Management for Embedded Systems


Book Description

This book introduces Software Thermal Management (STM) as a means of reducing power consumption in a computing system in order to manage heat, improve component reliability and increase system safety. Readers will benefit from this pragmatic guide to the field of STM for embedded systems and its catalog of software power management techniques. Since thermal management is a key bottleneck in embedded systems design, this book focuses on root cause of heat in embedded systems: power. Since software has an enormous impact on power consumption in an embedded system, this book urges software engineers to manage heat effectively by understanding, categorizing and developing new ways to reduce static and dynamic power consumption. Whereas most books on thermal management describe mechanisms to remove heat, this book focuses on ways for software engineers to avoid generating heat in the first place.




PCB Design Guide to Via and Trace Currents and Temperatures


Book Description

A very important part of printed circuit board (PCB) design involves sizing traces and vias to carry the required current. This exciting new book will explore how hot traces and vias should be and what board, circuit, design, and environmental parameters are the most important. PCB materials (copper and dielectrics) and the role they play in the heating and cooling of traces are covered. The IPC curves found in IPC 2152, the equations that fit those curves and computer simulations that fit those curves and equations are detailed. Sensitivity analyses that show what happens when environments are varied, including adjacent traces and planes, changing trace lengths, and thermal gradients are presented. Via temperatures and what determines them are explored, along with fusing issues and what happens when traces are overloaded. Voltage drops across traces and vias, the thermal effects going around right-angle corners, and frequency effects are covered. Readers learn how to measure the thermal conductivity of dielectrics and how to measure the resistivity of copper traces and why many prior attempts to do so have been doomed to failure. Industrial CT Scanning, and whether or not they might replace microsections for measuring trace parameters are also considered.




Advanced Materials for Thermal Management of Electronic Packaging


Book Description

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.




Thermodynamics and Heat Power, Eighth Edition


Book Description

Building on the last edition, (dedicated to exploring alternatives to coal- and oil-based energy conversion methods and published more than ten years ago), Thermodynamics and Heat Power, Eighth Edition updates the status of existing direct energy conversion methods as described in the previous work. Offering a systems approach to the analysis of energy conversion methods, this text focuses on the fundamentals involved in thermodynamics, and further explores concepts in the areas of ideal gas flow, engine analysis, air conditioning, and heat transfer. It examines energy, heat, and work in relation to thermodynamics, and also explores the properties of temperature and pressures. The book emphasizes practical mechanical systems, and incorporates problems at the end of the chapters to advance the application of the material. What’s New in the Eighth Edition: An emphasis on a systems approach to problems More discussion of the types of heat and of entropy Added explanations for understanding pound mass and the mole Analysis of steady flow gas processes, replacing the compressible flow section The concept of paddle work to illustrate how frictional effects can be analyzed A clearer discussion of the psychrometric chart and its usage in analyzing air conditioning systems Updates of the status of direct energy conversion systems A description of how the cooling tower is utilized in high-rise buildings Practical automotive engine analysis Expanded Brayton cycle analysis including intercooling, reheat, and regeneration and their effect on gas turbine efficiency A description of fins and how they improve heat transfer rates Added illustrative problems and new homework problems Availability of a publisher’s website for fluid properties and other reference materials Properties of the latest in commercial refrigerants This text presents an understanding of basic concepts on the subject of thermodynamics and is a definitive resource for undergraduate students in engineering programs, most specifically, students studying engineering technology.




Thermodynamics and Heat Power, Ninth Edition


Book Description

The ninth edition of Thermodynamics and Heat Power contains a revised sequence of thermodynamics concepts including physical properties, processes, and energy systems, to enable the attainment of learning outcomes by Engineering and Engineering Technology students taking an introductory course in thermodynamics. Built around an easily understandable approach, this updated text focuses on thermodynamics fundamentals, and explores renewable energy generation, IC engines, power plants, HVAC, and applied heat transfer. Energy, heat, and work are examined in relation to thermodynamics cycles, and the effects of fluid properties on system performance are explained. Numerous step-by-step examples and problems make this text ideal for undergraduate students. This new edition: Introduces physics-based mathematical formulations and examples in a way that enables problem-solving. Contains extensive learning features within each chapter, and basic computational exercises for in-class and laboratory activities. Includes a straightforward review of applicable calculus concepts. Uses everyday examples to foster a better understanding of thermal science and engineering concepts. This book is suitable for undergraduate students in engineering and engineering technology.




Analog Circuit Design


Book Description

Analog circuit and system design today is more essential than ever before. With the growth of digital systems, wireless communications, complex industrial and automotive systems, designers are challenged to develop sophisticated analog solutions. This comprehensive source book of circuit design solutions will aid systems designers with elegant and practical design techniques that focus on common circuit design challenges. The book's in-depth application examples provide insight into circuit design and application solutions that you can apply in today's demanding designs. - Covers the fundamentals of linear/analog circuit and system design to guide engineers with their design challenges - Based on the Application Notes of Linear Technology, the foremost designer of high performance analog products, readers will gain practical insights into design techniques and practice - Broad range of topics, including power management tutorials, switching regulator design, linear regulator design, data conversion, signal conditioning, and high frequency/RF design - Contributors include the leading lights in analog design, Robert Dobkin, Jim Williams and Carl Nelson, among others







Heat Exchanger Design Handbook


Book Description

This comprehensive reference covers important aspects of heat exchangers (HEs): design and modes of operation and practical, large-scale applications in process, power, petroleum, transport, air conditioning, refrigeration, cryogenics, heat recovery, energy, and other industries. This second edition includes over 400 drawings, diagrams, tables, and equations, includes updated material throughout; coverage of the latest advances in HE design techniques; expanded and updated coverage of materials selection; and a look at the newest fabrication techniques.