ULSI Science and Technology, 1991
Author : John M. Andrews
Publisher :
Page : 962 pages
File Size : 19,1 MB
Release : 1991
Category : Integrated circuits
ISBN :
Author : John M. Andrews
Publisher :
Page : 962 pages
File Size : 19,1 MB
Release : 1991
Category : Integrated circuits
ISBN :
Author : Hisham Z. Massoud
Publisher : The Electrochemical Society
Page : 686 pages
File Size : 31,90 MB
Release : 1997
Category : Computers
ISBN : 9781566771306
Author : Richard E. Novak
Publisher : The Electrochemical Society
Page : 642 pages
File Size : 45,70 MB
Release : 1996
Category : Technology & Engineering
ISBN : 9781566771153
Author : Iqbal Ali
Publisher : The Electrochemical Society
Page : 294 pages
File Size : 46,68 MB
Release : 1997
Category : Science
ISBN : 9781566771726
Author : Kenneth A. Jackson
Publisher : John Wiley & Sons
Page : 210 pages
File Size : 23,88 MB
Release : 2008-11-21
Category : Technology & Engineering
ISBN : 3527611797
Silicon is the most important material for the electronics industry. In modern microelectronics silicon devices like diodes and transistors play a major role, and devices like photodetectors or solar cells gain ever more importance. This concise handbook deals with one of the most important topics for the electronics industry. World renowned authors have contributed to this unique overview of the processing of silicon and silicon devices.
Author : Howard R. Huff
Publisher : The Electrochemical Society
Page : 894 pages
File Size : 34,7 MB
Release : 1998
Category : Technology & Engineering
ISBN : 9781566771931
Author :
Publisher :
Page : 894 pages
File Size : 28,52 MB
Release : 1998
Category : Semiconductors
ISBN :
Author : Dennis N. Schmidt
Publisher : The Electrochemical Society
Page : 454 pages
File Size : 50,1 MB
Release : 1994
Category : Technology & Engineering
ISBN : 9781566770415
Author : Richard B. Fair
Publisher : Academic Press
Page : 441 pages
File Size : 26,12 MB
Release : 2012-12-02
Category : Technology & Engineering
ISBN : 0323139809
This is the first definitive book on rapid thermal processing (RTP), an essential namufacturing technology for single-wafer processing in highly controlled environments. Written and edited by nine experts in the field, this book covers a range of topics for academics and engineers alike, moving from basic theory to advanced technology for wafer manufacturing. The book also provides new information on the suitability or RTP for thin film deposition, junction formation, silicides, epitaxy, and in situ processing. Complete discussions on equipment designs and comparisons between RTP and other processing approaches also make this book useful for supplemental information on silicon processing, VLSI processing, and integrated circuit engineering.
Author : B.E. Deal
Publisher : Springer Science & Business Media
Page : 505 pages
File Size : 44,75 MB
Release : 2013-11-09
Category : Science
ISBN : 1489915885
The first international symposium on the subject "The Physics and Chemistry of Si02 and the Si-Si02 Interface," organized in association with the Electrochemical Society, Inc. , was held in Atlanta, Georgia on May 15- 20, 1988. This symposium contained sixty papers and was so successful that the sponsoring divisions decided to schedule it on a regular basis every four years. Thus, the second symposium on "The Physics and Chemistry of Si02 and the Si02 Interface was held May 18-21, 1992 in St. Louis, Missouri, again sponsored by the Electronics and Dielectrics Science and Technology Divisions of The Electrochemical Society. This volume contains manuscripts of most of the fifty nine papers presented at the 1992 symposium, and is divided into eight chapters - approximating the organization of the symposium. Each chapter is preceded with an introduction by the session organizers. It is appropriate to provide a general assessment of the current status and understanding of the physics and chemistry of Si02 and the Si02 interface before proceeding with a brief overview of the individual chapters. Semiconductor devices have continued to scale down in both horizontal and vertical dimensions. This has resulted in thinner gate and field oxides as well as much closer spacing of individual device features. As a result, surface condition, native oxide composition, and cleaning and impurity effects now provide a much more significant contribution to the properties of oxides and their interfaces.