Advances in Rapid Thermal Processing
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 470 pages
File Size : 35,1 MB
Release : 1999
Category : Technology & Engineering
ISBN : 9781566772327
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 470 pages
File Size : 35,1 MB
Release : 1999
Category : Technology & Engineering
ISBN : 9781566772327
Author : Erin Catherine Jones
Publisher :
Page : 428 pages
File Size : 46,98 MB
Release : 1996
Category :
ISBN :
Author :
Publisher : Newnes
Page : 3572 pages
File Size : 34,94 MB
Release : 2011-01-28
Category : Science
ISBN : 0080932282
Semiconductors are at the heart of modern living. Almost everything we do, be it work, travel, communication, or entertainment, all depend on some feature of semiconductor technology. Comprehensive Semiconductor Science and Technology, Six Volume Set captures the breadth of this important field, and presents it in a single source to the large audience who study, make, and exploit semiconductors. Previous attempts at this achievement have been abbreviated, and have omitted important topics. Written and Edited by a truly international team of experts, this work delivers an objective yet cohesive global review of the semiconductor world. The work is divided into three sections. The first section is concerned with the fundamental physics of semiconductors, showing how the electronic features and the lattice dynamics change drastically when systems vary from bulk to a low-dimensional structure and further to a nanometer size. Throughout this section there is an emphasis on the full understanding of the underlying physics. The second section deals largely with the transformation of the conceptual framework of solid state physics into devices and systems which require the growth of extremely high purity, nearly defect-free bulk and epitaxial materials. The last section is devoted to exploitation of the knowledge described in the previous sections to highlight the spectrum of devices we see all around us. Provides a comprehensive global picture of the semiconductor world Each of the work's three sections presents a complete description of one aspect of the whole Written and Edited by a truly international team of experts
Author : Dim-Lee Kwong
Publisher : The Electrochemical Society
Page : 458 pages
File Size : 24,56 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773157
"Electronics, Dielectric Science and Technology, and High Temperature Materials Divisions."
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 482 pages
File Size : 25,52 MB
Release : 2000
Category : Technology & Engineering
ISBN : 9781566772747
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 472 pages
File Size : 23,78 MB
Release : 2006
Category : Gate array circuits
ISBN : 1566775027
These proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author : V. Narayanan
Publisher : The Electrochemical Society
Page : 367 pages
File Size : 13,81 MB
Release : 2009-05
Category : Gate array circuits
ISBN : 1566777097
This issue of ¿ECS Transactions¿ describes processing, materials and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics include strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 488 pages
File Size : 29,51 MB
Release : 2003
Category : Computers
ISBN : 9781566773966
Author : David Louis Harame
Publisher : The Electrochemical Society
Page : 1242 pages
File Size : 20,52 MB
Release : 2004
Category : Science
ISBN : 9781566774208
Author : Wai Shing Lau
Publisher : World Scientific
Page : 247 pages
File Size : 36,95 MB
Release : 2017-08-23
Category : Technology & Engineering
ISBN : 9813222174
The main focus of this book is ULSI front-end technology. It covers from the early history of semiconductor science & technology from 1874 to state-of-the-art FINFET technology in 2016. Some ULSI back-end technology is also covered, for example, the science and technology of MIM capacitors for analog CMOS has been included in this book.