Author : Patty Pei-Ling Chang-Chien
Publisher :
Page : 422 pages
File Size : 42,61 MB
Release : 2002
Category : Electrical engineering
ISBN :
Author :
Publisher :
Page : 652 pages
File Size : 28,66 MB
Release : 2003
Category : Dissertations, Academic
ISBN :
Author : Oliver Brand
Publisher : John Wiley & Sons
Page : 512 pages
File Size : 26,61 MB
Release : 2015-04-22
Category : Technology & Engineering
ISBN : 352767635X
Part of the AMN book series, this book covers the principles, modeling and implementation as well as applications of resonant MEMS from a unified viewpoint. It starts out with the fundamental equations and phenomena that govern the behavior of resonant MEMS and then gives a detailed overview of their implementation in capacitive, piezoelectric, thermal and organic devices, complemented by chapters addressing the packaging of the devices and their stability. The last part of the book is devoted to the cutting-edge applications of resonant MEMS such as inertial, chemical and biosensors, fluid properties sensors, timing devices and energy harvesting systems.
Author : Yung-cheng Lee
Publisher : World Scientific
Page : 363 pages
File Size : 32,42 MB
Release : 2018-01-03
Category : Technology & Engineering
ISBN : 9813229373
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author : Daniel Lu
Publisher : Springer
Page : 974 pages
File Size : 48,67 MB
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 3319450980
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : John H. Lau
Publisher : Springer
Page : 381 pages
File Size : 11,87 MB
Release : 2019-04-03
Category : Technology & Engineering
ISBN : 9811372241
Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.
Author : Joachim Burghartz
Publisher : Springer Science & Business Media
Page : 471 pages
File Size : 13,20 MB
Release : 2010-11-18
Category : Technology & Engineering
ISBN : 1441972765
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Author : Richard Coles
Publisher : CRC Press
Page : 370 pages
File Size : 22,93 MB
Release : 2003-08-15
Category : Technology & Engineering
ISBN : 9780849397882
The protection and preservation of a product, the launch of new products or re-launch of existing products, perception of added-value to products or services, and cost reduction in the supply chain are all objectives of food packaging. Taking into consideration the requirements specific to different products, how can one package successfully meet all of these goals? Food Packaging Technology provides a contemporary overview of food processing and packaging technologies. Covering the wide range of issues you face when developing innovative food packaging, the book includes: Food packaging strategy, design, and development Food biodeterioation and methods of preservation Packaged product quality and shelf life Logistical packaging for food marketing systems Packaging materials and processes The battle rages over which type of container should be used for which application. It is therefore necessary to consider which materials, or combination of materials and processes will best serve the market and enhance brand value. Food Packaging Technology gives you the tools to determine which form of packaging will meet your business goals without compromising the safety of your product.
Author : Rao Tummala
Publisher : McGraw Hill Professional
Page : 979 pages
File Size : 49,37 MB
Release : 2001-05-08
Category : Technology & Engineering
ISBN : 0071500596
LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing
Author : Reza Ghodssi
Publisher : Springer Science & Business Media
Page : 1211 pages
File Size : 22,33 MB
Release : 2011-03-18
Category : Technology & Engineering
ISBN : 0387473181
MEMs Materials and Processes Handbook" is a comprehensive reference for researchers searching for new materials, properties of known materials, or specific processes available for MEMS fabrication. The content is separated into distinct sections on "Materials" and "Processes". The extensive Material Selection Guide" and a "Material Database" guides the reader through the selection of appropriate materials for the required task at hand. The "Processes" section of the book is organized as a catalog of various microfabrication processes, each with a brief introduction to the technology, as well as examples of common uses in MEMs.
