Methods for Testing Wire-bond Electrical Connections
Author : Harry A. Schafft
Publisher :
Page : 28 pages
File Size : 15,67 MB
Release : 1973
Category : Electric connectors
ISBN :
Author : Harry A. Schafft
Publisher :
Page : 28 pages
File Size : 15,67 MB
Release : 1973
Category : Electric connectors
ISBN :
Author : Harry A. Schafft
Publisher :
Page : 64 pages
File Size : 40,6 MB
Release : 1972
Category : Sealing (Technology)
ISBN :
Author : Harry A. Schafft
Publisher :
Page : 144 pages
File Size : 20,48 MB
Release : 1972
Category : Electric connectors
ISBN :
Author :
Publisher :
Page : 17 pages
File Size : 14,54 MB
Release : 1973
Category :
ISBN :
Author : Harry A. Schafft
Publisher : Forgotten Books
Page : 148 pages
File Size : 33,88 MB
Release : 2017-10-29
Category :
ISBN : 9781527910287
Excerpt from Testing and Fabrication of Wire-Bond Electrical Connections: A Comprehensive Survey Appendixes Appendix A. Estimate of Lowest Resonant Frequency of Wire Bonds Appendix B. Expression Relating Four Measures for Pull Rate 8. References Introduction Citations Addresses. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
Author : Preeti S Chauhan
Publisher : Springer Science & Business Media
Page : 254 pages
File Size : 50,53 MB
Release : 2013-09-20
Category : Technology & Engineering
ISBN : 1461457610
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
Author : Harry A. Schafft
Publisher :
Page : 17 pages
File Size : 39,32 MB
Release : 2001
Category : Electric connectors
ISBN :
Author : Harry A. Schafft
Publisher : Forgotten Books
Page : 34 pages
File Size : 40,56 MB
Release : 2018-03-19
Category : Technology & Engineering
ISBN : 9780656600663
Excerpt from Methods for Testing Wire-Bond Electrical Connections Methods OF measurement for semicon ductor materials, process control, and devices, nbs Technical Note 773, Quarterly Rpt. (oct. 1 to Dec. 31, June 1973. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
Author : Harry A. Schafft
Publisher : Forgotten Books
Page : 382 pages
File Size : 38,72 MB
Release : 2018-01-09
Category : Technology & Engineering
ISBN : 9780428658250
Excerpt from Wire-Bond Electrical Connections: Testing, Fabrication and Degradation-a Bibliography, 1957-1971 The author is pleased to acknowledge the Significant contributions made by Elaine C. W. Cohen who assisted in collecting much of the material and performed both expeditiously and cheerfully many of the tedious labors that the compilation of such a bibliography requires. Thanks also go out to Kathryn 0. Leedy, Frank R. Kelly, Terry A. Schultz and especially to Ruth E. Joel for assisting in various stages of the preparation of the bibliography, to Kaye E. Dodson for typing the final draft with such dispatch; and to w. Murray Bullis, Frank P. Oettinger, and George J. Rogers for their assistance with various aspects of the format. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.
Author : Harry A.. Schafft
Publisher :
Page : 55 pages
File Size : 48,62 MB
Release : 1972
Category :
ISBN :