Author : Jinming Chen
Publisher : Design Media Publishing (Uk) Limited
Page : 0 pages
File Size : 33,26 MB
Release : 2011-02
Category : Box craft
ISBN : 9789881950819
With the help of plans and 3-D models, the latest packaging structures are clearly exemplified in this book. The examples, including 1000 detailed plans and 1000 distinct 3-D models, cover almost every field of package design, from daily necessity packaging to cosmetic packaging, and they will surely serve as practical resources for designers and other readers alike. The unique concepts and methods in this book provide guidance and give designers inspiration and ideas.
Author : Yufeng Jin
Publisher : CRC Press
Page : 232 pages
File Size : 39,13 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1439865973
The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.
Author : Sendpoints Publishing Co Ltd
Publisher : Sendpoints
Page : 0 pages
File Size : 19,11 MB
Release : 2020-04
Category : Design
ISBN : 9789887928485
Structure is an essential element in packing design. Apart from introducing the basic types of packaging structure and basic knowledge, this book focuses on presenting excellent creative packaging works from around the world. Each project selected exemplifies a unique design concept, which is a well of inspiration for readers worldwide. The accompanying DVD contains 60 copyright free and 175 copyrighted templates of packaging structure.
Author : Ephraim Suhir
Publisher : Springer Science & Business Media
Page : 1471 pages
File Size : 43,95 MB
Release : 2007-05-26
Category : Technology & Engineering
ISBN : 0387329897
This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.
Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 832 pages
File Size : 23,95 MB
Release : 2002
Category : Business & Economics
ISBN :
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Author : Daniel Lu
Publisher : Springer
Page : 974 pages
File Size : 33,78 MB
Release : 2016-11-18
Category : Technology & Engineering
ISBN : 3319450980
Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.
Author : M. Datta
Publisher : CRC Press
Page : 564 pages
File Size : 20,73 MB
Release : 2004-12-20
Category : Technology & Engineering
ISBN : 020347368X
Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.
Author : Dr. NGUYEN THI HOP
Publisher : Nguyen Thi Hop
Page : 188 pages
File Size : 48,89 MB
Release : 2021-06-21
Category : Technology & Engineering
ISBN :
One of a few books about the art of packaging in Vietnam, its history, and transformations over time. What is its theoretical framework and implementation in practice? How are the design and the art of packaging in Vietnam impacted by Western thinking on industrial arts and what traditions it is still upholding? What are important developments of modern packaging art in Vietnam? How are the social and economical changes reflected in the packages of consumer goods in the country? And how the new look of these goods create a new consumerism culture in the ex-Stalinism nation? This book sums up what has happened with the aesthetic aspect of packaging in Vietnam, theoretically and practically, in the last half century and tries to answer parts of these questions.
Author : Kit L. Yam
Publisher : John Wiley & Sons
Page : 1368 pages
File Size : 16,25 MB
Release : 2010-01-05
Category : Technology & Engineering
ISBN : 0470541385
The complete and authoritative guide to modern packaging technologies —updated and expanded From A to Z, The Wiley Encyclopedia of Packaging Technology, Third Edition covers all aspects of packaging technologies essential to the food and pharmaceutical industries, among others. This edition has been thoroughly updated and expanded to include important innovations and changes in materials, processes, and technologies that have occurred over the past decade. It is an invaluable resource for packaging technologists, scientists and engineers, students and educators, packaging material suppliers, packaging converters, packaging machinery manufacturers, processors, retailers, and regulatory agencies. In addition to updating and improving articles from the previous edition, new articles are also added to cover the recent advances and developments in packaging. Content new to this edition includes: Advanced packaging materials such as antimicrobial materials, biobased materials, nanocomposite materials, ceramic-coated films, and perforated films Advanced packaging technologies such as active and intelligent packaging, radio frequency identification (RFID), controlled release packaging, smart blending, nanotechnology, biosensor technology, and package integrity inspection Various aspects important to packaging such as sustainable packaging, migration, lipid oxidation, light protection, and intellectual property Contributions from experts in all-important aspects of packaging Extensive cross-referencing and easy-to-access information on all subjects Large, double-column format for easy reference
Author : Richard Coles
Publisher : CRC Press
Page : 370 pages
File Size : 40,49 MB
Release : 2003-08-15
Category : Technology & Engineering
ISBN : 9780849397882
The protection and preservation of a product, the launch of new products or re-launch of existing products, perception of added-value to products or services, and cost reduction in the supply chain are all objectives of food packaging. Taking into consideration the requirements specific to different products, how can one package successfully meet all of these goals? Food Packaging Technology provides a contemporary overview of food processing and packaging technologies. Covering the wide range of issues you face when developing innovative food packaging, the book includes: Food packaging strategy, design, and development Food biodeterioation and methods of preservation Packaged product quality and shelf life Logistical packaging for food marketing systems Packaging materials and processes The battle rages over which type of container should be used for which application. It is therefore necessary to consider which materials, or combination of materials and processes will best serve the market and enhance brand value. Food Packaging Technology gives you the tools to determine which form of packaging will meet your business goals without compromising the safety of your product.
