EDA for IC Implementation, Circuit Design, and Process Technology


Book Description

Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.







RF Circuit Design


Book Description

Summarizes the schemes and technologies in RF circuit design, describes the basic parameters of an RF system and the fundamentals of RF system design, and presents an introduction of the individual RF circuit block design. Forming the backbone of today's mobile and satellite communications networks, radio frequency (RF) components and circuits are incorporated into everything that transmits or receives a radio wave, such as mobile phones, radio, WiFi, and walkie talkies. RF Circuit Design, Second Edition immerses practicing and aspiring industry professionals in the complex world of RF design. Completely restructured and reorganized with new content, end-of-chapter exercises, illustrations, and an appendix, the book presents integral information in three complete sections: Part One explains the different methodologies between RF and digital circuit design and covers voltage and power transportation, impedance matching in narrow-band case and wide-band case, gain of a raw device, measurement, and grounding. It also goes over equipotentiality and current coupling on ground surface, as well as layout and packaging, manufacturability of product design, and radio frequency integrated circuit (RFIC). Part Two includes content on the main parameters and system analysis in RF circuit design, the fundamentals of differential pair and common-mode rejection ratio (CMRR), Balun, and system-on-a-chip (SOC). Part Three covers low-noise amplifier (LNA), power amplifier (PA), voltage-controlled oscillator (VCO), mixers, and tunable filters. RF Circuit Design, Second Edition is an ideal book for engineers and managers who work in RF circuit design and for courses in electrical or electronic engineering.




Design of 3D Integrated Circuits and Systems


Book Description

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.




Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation


Book Description

This volume features the refereed proceedings of the 17th International Workshop on Power and Timing Modeling, Optimization and Simulation. Papers cover high level design, low power design techniques, low power analog circuits, statistical static timing analysis, power modeling and optimization, low power routing optimization, security and asynchronous design, low power applications, modeling and optimization, and more.




Nanoelectronic Circuit Design


Book Description

This book is about large-scale electronic circuits design driven by nanotechnology, where nanotechnology is broadly defined as building circuits using nanoscale devices that are either implemented with nanomaterials (e.g., nanotubes or nanowires) or following an unconventional method (e.g., FinFET or III/V compound-based devices). These nanoscale devices have significant potential to revolutionize the fabrication and integration of electronic systems and scale beyond the perceived scaling limitations of traditional CMOS. While innovations in nanotechnology originate at the individual device level, realizing the true impact of electronic systems demands that these device-level capabilities be translated into system-level benefits. This is the first book to focus on nanoscale circuits and their design issues, bridging the existing gap between nanodevice research and nanosystem design.




Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology


Book Description

The second of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology thoroughly examines real-time logic (RTL) to GDSII (a file format used to transfer data of semiconductor physical layout) design flow, analog/mixed signal design, physical verification, and technology computer-aided design (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability (DFM) at the nanoscale, power supply network design and analysis, design modeling, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on 3D circuit integration and clock design Offering improved depth and modernity, Electronic Design Automation for IC Implementation, Circuit Design, and Process Technology provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.




Three Dimensional System Integration


Book Description

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.




Built-in Fault-Tolerant Computing Paradigm for Resilient Large-Scale Chip Design


Book Description

With the end of Dennard scaling and Moore’s law, IC chips, especially large-scale ones, now face more reliability challenges, and reliability has become one of the mainstay merits of VLSI designs. In this context, this book presents a built-in on-chip fault-tolerant computing paradigm that seeks to combine fault detection, fault diagnosis, and error recovery in large-scale VLSI design in a unified manner so as to minimize resource overhead and performance penalties. Following this computing paradigm, we propose a holistic solution based on three key components: self-test, self-diagnosis and self-repair, or “3S” for short. We then explore the use of 3S for general IC designs, general-purpose processors, network-on-chip (NoC) and deep learning accelerators, and present prototypes to demonstrate how 3S responds to in-field silicon degradation and recovery under various runtime faults caused by aging, process variations, or radical particles. Moreover, we demonstrate that 3S not only offers a powerful backbone for various on-chip fault-tolerant designs and implementations, but also has farther-reaching implications such as maintaining graceful performance degradation, mitigating the impact of verification blind spots, and improving chip yield. This book is the outcome of extensive fault-tolerant computing research pursued at the State Key Lab of Processors, Institute of Computing Technology, Chinese Academy of Sciences over the past decade. The proposed built-in on-chip fault-tolerant computing paradigm has been verified in a broad range of scenarios, from small processors in satellite computers to large processors in HPCs. Hopefully, it will provide an alternative yet effective solution to the growing reliability challenges for large-scale VLSI designs.




Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization