2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems
Author :
Publisher :
Page : pages
File Size : 41,34 MB
Release : 2009
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ISBN : 9781509069842
Author :
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Page : pages
File Size : 41,34 MB
Release : 2009
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ISBN : 9781509069842
Author : Components, Packaging, and Manufacturing Technology Society
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Page : 256 pages
File Size : 44,54 MB
Release : 2009
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ISBN : 9781424444489
Author :
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Page : 258 pages
File Size : 23,45 MB
Release : 2009
Category : Electronic packaging
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Page : pages
File Size : 10,11 MB
Release : 2009
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ISBN : 9781424456468
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Page : pages
File Size : 46,90 MB
Release : 2013
Category : Electronic packaging
ISBN : 9781479907052
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Page : pages
File Size : 37,82 MB
Release : 2013
Category : Electronic packaging
ISBN : 9781467325363
Author :
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Page : 314 pages
File Size : 13,90 MB
Release : 2011
Category : Electronic packaging
ISBN : 9781424494002
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Page : pages
File Size : 40,76 MB
Release : 1979
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Page : 0 pages
File Size : 48,89 MB
Release : 2014
Category : Electronic packaging
ISBN : 9781479936410
Author : Manho Lee
Publisher : Springer
Page : 286 pages
File Size : 34,16 MB
Release : 2014-05-11
Category : Technology & Engineering
ISBN : 9401790388
Through Silicon Via (TSV) is a key technology for realizing three-dimensional integrated circuits (3D ICs) for future high-performance and low-power systems with small form factors. This book covers both qualitative and quantitative approaches to give insights of modeling TSV in a various viewpoints such as signal integrity, power integrity and thermal integrity. Most of the analysis in this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered.