VLSI Test Symposium (VTS), 2014 IEEE 32nd
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Page : pages
File Size : 38,25 MB
Release : 2014
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Page : pages
File Size : 38,25 MB
Release : 2014
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Page : pages
File Size : 12,93 MB
Release : 2014
Category : Integrated circuits
ISBN : 9781479926114
Author : Institute of Electrical and Electronics Engineers (New York, NY)
Publisher :
Page : 293 pages
File Size : 30,71 MB
Release : 2014
Category : Integrated circuits
ISBN : 9781479926121
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Page : pages
File Size : 42,43 MB
Release : 2014
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Author : Nicola Bombieri
Publisher : Springer
Page : 281 pages
File Size : 41,43 MB
Release : 2019-06-25
Category : Computers
ISBN : 3030234258
This book contains extended and revised versions of the best papers presented at the 26th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2018, held in Verona, Italy, in October 2018. The 13 full papers included in this volume were carefully reviewed and selected from the 27 papers (out of 106 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like heterogeneous, neuromorphic and brain-inspired, biologically-inspired, approximate computing systems.
Author : Aida Todri-Sanial
Publisher : CRC Press
Page : 397 pages
File Size : 30,38 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1498710379
Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.
Author : Xin-She Yang
Publisher : Springer Nature
Page : 910 pages
File Size : 50,86 MB
Release : 2022-08-02
Category : Technology & Engineering
ISBN : 9811916071
This book gathers selected high-quality research papers presented at the Seventh International Congress on Information and Communication Technology, held at Brunel University, London, on February 21–24, 2022. It discusses emerging topics pertaining to information and communication technology (ICT) for managerial applications, e-governance, e-agriculture, e-education and computing technologies, the Internet of Things (IoT) and e-mining. Written by respected experts and researchers working on ICT, the book offers a valuable asset for young researchers involved in advanced studies. The work is presented in four volumes.
Author : Xinfei Guo
Publisher : Springer
Page : 208 pages
File Size : 48,92 MB
Release : 2019-06-12
Category : Technology & Engineering
ISBN : 3030200515
This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level. The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery. Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models. Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT.
Author : Jean-Pierre Colinge
Publisher : Cambridge University Press
Page : 269 pages
File Size : 28,39 MB
Release : 2016-04-21
Category : Science
ISBN : 1107052408
A self-contained and up-to-date account of the current developments in the physics and technology of nanowire semiconductor devices.
Author : Michail Maniatakos
Publisher : Springer
Page : 257 pages
File Size : 18,4 MB
Release : 2019-05-16
Category : Computers
ISBN : 303015663X
This book contains extended and revised versions of the best papers presented at the 25th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2017, held in Abu Dhabi, United Arab Emirates, in August 2017. The 11 papers included in this book were carefully reviewed and selected from the 33 full papers presented at the conference. The papers cover a wide range of topics in VLSI technology and advanced research. They address the latest scientific and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) Design. On the occasion of the silver jubilee of the VLSI-SoC conference series the book also includes a special chapter that presents the history of the VLSI-SoC series of conferences and its relation with VLSI-SoC evolution since the early 80s up to the present.