2019 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)


Book Description

The conference will feature both invited and contributed papers Distinguished researchers will be invited to deliver keynote speeches on technology or circuit trends and significant advances The best contributed papers will be selected for awards All papers will be presented in parallel sessions, including invited talks and focused sessions ICTA will start and conclude with short courses and forums This year s theme is Sensors, Integrated Circuits and Systems for IoT and 5G




2019 IEEE International Conference on Integrated Circuits, Technologies and Applications (ICTA)


Book Description

The conference will feature both invited and contributed papers Distinguished researchers will be invited to deliver keynote speeches on technology or circuit trends and significant advances The best contributed papers will be selected for awards All papers will be presented in parallel sessions, including invited talks and focused sessions ICTA will start and conclude with short courses and forums This year s theme is Sensors, Integrated Circuits and Systems for IoT and 5G




The International Conference on Image, Vision and Intelligent Systems (ICIVIS 2021)


Book Description

This book is a collection of the papers accepted by the ICIVIS 2021—The International Conference on Image, Vision and Intelligent Systems held on June 15–17, 2021, in Changsha, China. The topics focus but are not limited to image, vision and intelligent systems. Each part can be used as an excellent reference by industry practitioners, university faculties, research fellows and undergraduates as well as graduate students who need to build a knowledge base of the most current advances and state-of-practice in the topics covered by this conference proceedings.




Applications in Electronics Pervading Industry, Environment and Society


Book Description

This book provides a thorough overview of cutting-edge research on electronics applications relevant to industry, the environment, and society at large. It covers a broad spectrum of application domains, from automotive to space and from health to security, while devoting special attention to the use of embedded devices and sensors for imaging, communication and control. The book is based on the 2022 ApplePies Conference, held in Genoa, Italy in September 2022, which brought together researchers and stakeholders to consider the most significant current trends in the field of applied electronics and to debate visions for the future. Areas addressed by the conference included information communication technology; biotechnology and biomedical imaging; space; secure, clean and efficient energy; the environment; and smart, green and integrated transport. As electronics technology continues to develop apace, constantly meeting previously unthinkable targets, further attention needs to be directed toward the electronics applications and the development of systems that facilitate human activities. This book, written by industrial and academic professionals, represents a valuable contribution in this endeavor.




Internet of Things enabled Machine Learning for Biomedical Application


Book Description

The text begins by highlighting the benefits of the Internet of Things-enabled machine learning in the healthcare sector, examines the diagnosis of diseases using machine learning algorithms, and analyzes security and privacy issues in the healthcare systems using the Internet of Things. The text elaborates on image processing implementation for medical images to detect and classify diseases based on magnetic resonance imaging and ultrasound images. This book: · Covers the procedure to recognize emotions using image processing and the Internet of Things-enabled machine learning. · Highlights security and privacy issues in the healthcare system using the Internet of Things. · Discusses classification and implementation techniques of image segmentation. · Explains different algorithms of machine learning for image processing in a comprehensive manner. · Provides computational intelligence on the Internet of Things for future biomedical applications including lung cancer. It is primarily written for graduate students and academic researchers in the fields of electrical engineering, electronics and communications engineering, computer science and engineering, and biomedical engineering.







Machine Learning-based Design and Optimization of High-Speed Circuits


Book Description

This book describes machine learning-based new principles, methods of design and optimization of high-speed integrated circuits, included in one electronic system, which can exchange information between each other up to 128/256/512 Gbps speed. The efficiency of methods has been proven and is described on the examples of practical designs. This will enable readers to use them in similar electronic system designs. The author demonstrates newly developed principles and methods to accelerate communication between ICs, working in non-standard operating conditions, considering signal deviation compensation with linearity self-calibration. The observed circuit types also include but are not limited to mixed-signal, high performance heterogeneous integrated circuits as well as digital cores.




TSV 3D RF Integration


Book Description

TSV 3D RF Integration: High Resistivity Si Interposer Technology systematically introduces the design, process development and application verification of high-resistivity silicon interpose technology, addressing issues of high frequency loss and high integration level. The book includes a detailed demonstration of the design and process development of Hr-Si interposer technology, gives case studies, and presents a systematic literature review. Users will find this to be a resource with detailed demonstrations of the design and process development of HR-Si interposer technologies, including quality monitoring and methods to extract S parameters. A series of cases are presented, including an example of an integrated inductor, a microstrip inter-digital filter, and a stacked patch antenna. Each chapter includes a systematic and comparative review of the research literature, offering researchers and engineers in microelectronics a uniquely useful handbook to help solve problems in 3D heterogenous RF integration oriented Hr-Si interposer technology. - Provides a detailed demonstration of the design and process development of HR-Si (High-Resistivity Silicon) interposer technology - Presents a series of implementation case studies that detail modeling and simulation, integration, qualification and testing methods - Offers a systematic and comparative literature review of HR-Si interposer technology by topic - Offers solutions to problems with TSV (through silicon via) interposer technology, including high frequency loss and cooling problems - Gives a systematic and accessible accounting on this leading technology




Emerging Technologies in Biomedical Engineering and Sustainable TeleMedicine


Book Description

This book presents the most recent research and applications in Biomedical Engineering, electronic health and TeleMedicine. Top-scholars and research leaders in the field contributed to the book. It covers a broad range of applications including smart platforms like DietHub which connects patients with doctors online. The book highlights the advantages of Telemedicine to improve the healthcare services and how it can contribute to the homogenization of medicine without any geographical barriers. Telemedicine transforms local hospitals, with limited services, into a node of an integrated network. In this manner, these nodes start to play an important role in preventive medicine and in high-level management of chronic diseases. The authors also discuss the challenges related to “health informatics” and in “e-health management”. The topics of the book include: synchronous and asynchronous telemedicine with deep discussions on e-health applications, virtual medical assistance, real-time virtual visits, digital telepathology, home health monitoring, and medication adherence, wearable sensors, tele-monitoring hubs and sensors, Internet of Things, augmented and virtual reality as well as e-learning technologies. The scope of the book is quite unique particularly in terms of the application domains that it targets. It is a unique hub for the dissemination of state of the art research in the telemedicine field and healthcare ecosystems. The book is a reference for graduate students, doctors, and researchers to discover the most recent findings, and hence, it achieves breakthroughs and pushes the boundaries in the related fields.