2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA).
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Page : pages
File Size : 30,45 MB
Release : 2022
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ISBN : 9781665409230
Author :
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Page : pages
File Size : 30,45 MB
Release : 2022
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ISBN : 9781665409230
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Page : pages
File Size : 17,18 MB
Release : 2020
Category : Integrated circuits
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Page : 0 pages
File Size : 14,13 MB
Release : 2021
Category : Integrated circuits
ISBN : 9781665419345
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Page : 0 pages
File Size : 11,93 MB
Release : 2023
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Page : 0 pages
File Size : 20,35 MB
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Author : IEEE Staff
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Page : 0 pages
File Size : 50,32 MB
Release : 2024-04-22
Category : Technology & Engineering
ISBN :
Chiplet Heterogeneous Integration Sensors Security and Encryption neuromorphic computing Quantum Computing Heterogeneous Integration Dielectric Stacking and Interface Engineering Advanced Packaging BEOL Oxide Semiconductor evices Compute inmemory storage Silicon Lifecycle Management Open Source Hardware
Author : International Symposium on VLSI Technology, Systems and Applications. 1993, Taibei
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Page : 386 pages
File Size : 34,89 MB
Release : 1993
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ISBN : 9780780309784
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Page : pages
File Size : 50,80 MB
Release : 2019
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ISBN : 9781728109428
Author : IEEE Staff
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Page : 0 pages
File Size : 27,55 MB
Release : 2023-04-17
Category :
ISBN :
Chiplet Heterogeneous Integration Sensors Security and Encryption neuromorphic computing Quantum Computing Heterogeneous Integration Dielectric Stacking and Interface Engineering Advanced Packaging BEOL Oxide Semiconductor Devices Compute in memory storage Silicon Lifecycle Management Open Source Hardware
Author : IEEE Staff
Publisher :
Page : pages
File Size : 27,2 MB
Release : 2021-04-19
Category :
ISBN : 9781665430142
Low power CMOS and embedded memory, Foundry technology, RF & THz process, device and integration technology, Standalone memory DRAM, FLASH, emerging memory technology, Advanced process modules e g gate stack, junction, strain channel engineering, low R contact, low C spacer ILD, interconnect technology, ALE and selective deposition, etc , Nanopatterning Multiple patterning, Directed Self Assembly, EUV, etc , Power and analog IC device and technology, Advanced CMOS process and devices Ge, SiGe, III V, FinFET, GAA nanowires nanosheets, Low dimensional materials and devices experiments and simulations, Material, process and device modeling, TFT and organic electronics, MEMS, imagers and sensors, Advanced manufacturing technology, metrology and yield, Reliability physics, characterization and test, Advanced packaging and 2 5D 3D Integration, Photonics and Beyond CMOS Technology, Energy harvesting technology, Wearable and loE enabling technologies, Neuromorphic devices and materials