2023 7th IEEE Electron Devices Technology and Manufacturing Conference (EDTM)


Book Description

The EDTM is an EDS technical forum in Asia to engage in the activities within the EDS technical field of interest (FOI) with specific emphasis on device technology, materials, and manufacturing and manufacturing tools The topical area of interest of EDTM, however, not limit to, are as follows 1 engage device makers, suppliers of manufacturing tools and materials, and academia 2 Educate engineers and students by short courses, basic tutorials in local language designed for students 3 encourage and involve more industry participants 4 explore device and technology scaling and more than Moore solutions on process physics and engineering bridging between the devices and materials 5 accelerate innovations in process physics and engineering 6 engage electron devices community to come together to collaborate on research from devices to materials to tools to create new and innovative device technologies







Electronic Engineering and Informatics


Book Description

Electronic engineering and informatics are disciplines which underpin the complex digital technology on which we have all now come to depend. This book presents the proceedings of ICEEI 2023, the 5th International Conference on Electronic Engineering and Informatics, which took place as a hybrid event from 23 to 25 June 2023 in Wuhan, China, with around 150 participating delegates. The conference brought together leading academics, researchers and practitioners from around the world to present recent innovations, trends, and concerns, and discuss practical challenges and solutions. It also gave delegates the opportunity to share their experience and research results and exchange views on all aspects of electronic engineering and informatics. A total of 266 submissions were received for the conference, of which 93 were accepted for presentation and publication after a careful double-blind peer review process. The papers are divided into 3 sections, covering electronic device simulation and system modelling; target recognition and information decision making; and network data processing and security detection. Providing a current overview of advances and research results in the relevant fields, the book will be of interest to those working in all areas of electronic engineering and informatics.




EDTM 2020


Book Description




Applications of Computational Intelligence in Management & Mathematics


Book Description

Computational intelligence consists of those techniques that imitate the human brain and nature to adopt the decision-making approach. This book contains selected papers from the 8th International Conference on Computers, Management and Mathematical Sciences (ICCM) 2022 about fuzzy systems, neural networks and evolutionary computation that can address stochastic environments where reasoning is a significant attribute to derive potential solutions and focus on the business domain's computational aspects. This is a conference proceedings for scholars/students who are using the powerful algorithms, concepts and principles of computational intelligence in a wide spectrum of research cases.




Metal Impurities in Silicon-Device Fabrication


Book Description

A discussion of the different mechanisms responsible for contamination together with a survey of their impact on device performance. The author examines the specific properties of main and rare impurities in silicon, as well as the detection methods and requirements in modern technology. Finally, impurity gettering is studied along with modern techniques to determine gettering efficiency. Throughout all of these subjects, the book presents only reliable and up-to-date data so as to provide a thorough review of recent scientific investigations.




Junctionless Field-Effect Transistors


Book Description

A comprehensive one-volume reference on current JLFET methods, techniques, and research Advancements in transistor technology have driven the modern smart-device revolution—many cell phones, watches, home appliances, and numerous other devices of everyday usage now surpass the performance of the room-filling supercomputers of the past. Electronic devices are continuing to become more mobile, powerful, and versatile in this era of internet-of-things (IoT) due in large part to the scaling of metal-oxide semiconductor field-effect transistors (MOSFETs). Incessant scaling of the conventional MOSFETs to cater to consumer needs without incurring performance degradation requires costly and complex fabrication process owing to the presence of metallurgical junctions. Unlike conventional MOSFETs, junctionless field-effect transistors (JLFETs) contain no metallurgical junctions, so they are simpler to process and less costly to manufacture.JLFETs utilize a gated semiconductor film to control its resistance and the current flowing through it. Junctionless Field-Effect Transistors: Design, Modeling, and Simulation is an inclusive, one-stop referenceon the study and research on JLFETs This timely book covers the fundamental physics underlying JLFET operation, emerging architectures, modeling and simulation methods, comparative analyses of JLFET performance metrics, and several other interesting facts related to JLFETs. A calibrated simulation framework, including guidance on SentaurusTCAD software, enables researchers to investigate JLFETs, develop new architectures, and improve performance. This valuable resource: Addresses the design and architecture challenges faced by JLFET as a replacement for MOSFET Examines various approaches for analytical and compact modeling of JLFETs in circuit design and simulation Explains how to use Technology Computer-Aided Design software (TCAD) to produce numerical simulations of JLFETs Suggests research directions and potential applications of JLFETs Junctionless Field-Effect Transistors: Design, Modeling, and Simulation is an essential resource for CMOS device design researchers and advanced students in the field of physics and semiconductor devices.




Semiconductor Advanced Packaging


Book Description

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.




2021 IEEE Regional Symposium on Micro and Nanoelectronics (RSM)


Book Description

The RSM conference series has become the preeminent international forum on semiconductor electronics embracing all aspects of the semiconductor technology from circuit device, modeling and simulation, photonics and sensor technology, MEMs technology, process and fabrication packaging technology and manufacturing, failure analysis and reliability, material and devices and nanoelectronics