Machine Learning in VLSI Computer-Aided Design


Book Description

This book provides readers with an up-to-date account of the use of machine learning frameworks, methodologies, algorithms and techniques in the context of computer-aided design (CAD) for very-large-scale integrated circuits (VLSI). Coverage includes the various machine learning methods used in lithography, physical design, yield prediction, post-silicon performance analysis, reliability and failure analysis, power and thermal analysis, analog design, logic synthesis, verification, and neuromorphic design. Provides up-to-date information on machine learning in VLSI CAD for device modeling, layout verifications, yield prediction, post-silicon validation, and reliability; Discusses the use of machine learning techniques in the context of analog and digital synthesis; Demonstrates how to formulate VLSI CAD objectives as machine learning problems and provides a comprehensive treatment of their efficient solutions; Discusses the tradeoff between the cost of collecting data and prediction accuracy and provides a methodology for using prior data to reduce cost of data collection in the design, testing and validation of both analog and digital VLSI designs. From the Foreword As the semiconductor industry embraces the rising swell of cognitive systems and edge intelligence, this book could serve as a harbinger and example of the osmosis that will exist between our cognitive structures and methods, on the one hand, and the hardware architectures and technologies that will support them, on the other....As we transition from the computing era to the cognitive one, it behooves us to remember the success story of VLSI CAD and to earnestly seek the help of the invisible hand so that our future cognitive systems are used to design more powerful cognitive systems. This book is very much aligned with this on-going transition from computing to cognition, and it is with deep pleasure that I recommend it to all those who are actively engaged in this exciting transformation. Dr. Ruchir Puri, IBM Fellow, IBM Watson CTO & Chief Architect, IBM T. J. Watson Research Center




High-Level Synthesis


Book Description

This book presents an excellent collection of contributions addressing different aspects of high-level synthesis from both industry and academia. It includes an overview of available EDA tool solutions and their applicability to design problems.




FPGA-based Implementation of Signal Processing Systems


Book Description

An important working resource for engineers and researchers involved in the design, development, and implementation of signal processing systems The last decade has seen a rapid expansion of the use of field programmable gate arrays (FPGAs) for a wide range of applications beyond traditional digital signal processing (DSP) systems. Written by a team of experts working at the leading edge of FPGA research and development, this second edition of FPGA-based Implementation of Signal Processing Systems has been extensively updated and revised to reflect the latest iterations of FPGA theory, applications, and technology. Written from a system-level perspective, it features expert discussions of contemporary methods and tools used in the design, optimization and implementation of DSP systems using programmable FPGA hardware. And it provides a wealth of practical insights—along with illustrative case studies and timely real-world examples—of critical concern to engineers working in the design and development of DSP systems for radio, telecommunications, audio-visual, and security applications, as well as bioinformatics, Big Data applications, and more. Inside you will find up-to-date coverage of: FPGA solutions for Big Data Applications, especially as they apply to huge data sets The use of ARM processors in FPGAs and the transfer of FPGAs towards heterogeneous computing platforms The evolution of High Level Synthesis tools—including new sections on Xilinx's HLS Vivado tool flow and Altera's OpenCL approach Developments in Graphical Processing Units (GPUs), which are rapidly replacing more traditional DSP systems FPGA-based Implementation of Signal Processing Systems, 2nd Edition is an indispensable guide for engineers and researchers involved in the design and development of both traditional and cutting-edge data and signal processing systems. Senior-level electrical and computer engineering graduates studying signal processing or digital signal processing also will find this volume of great interest.




VLSI Physical Design: From Graph Partitioning to Timing Closure


Book Description

Design and optimization of integrated circuits are essential to the creation of new semiconductor chips, and physical optimizations are becoming more prominent as a result of semiconductor scaling. Modern chip design has become so complex that it is largely performed by specialized software, which is frequently updated to address advances in semiconductor technologies and increased problem complexities. A user of such software needs a high-level understanding of the underlying mathematical models and algorithms. On the other hand, a developer of such software must have a keen understanding of computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. "VLSI Physical Design: From Graph Partitioning to Timing Closure" introduces and compares algorithms that are used during the physical design phase of integrated-circuit design, wherein a geometric chip layout is produced starting from an abstract circuit design. The emphasis is on essential and fundamental techniques, ranging from hypergraph partitioning and circuit placement to timing closure.




Digital Integrated Circuit Design


Book Description

This practical, tool-independent guide to designing digital circuits takes a unique, top-down approach, reflecting the nature of the design process in industry. Starting with architecture design, the book comprehensively explains the why and how of digital circuit design, using the physics designers need to know, and no more.




Foundations for Microstrip Circuit Design


Book Description

Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.




Photoplethysmography


Book Description

Photoplethysmography: Technology, Signal Analysis, and Applications is the first comprehensive volume on the theory, principles, and technology (sensors and electronics) of photoplethysmography (PPG). It provides a detailed description of the current state-of-the-art technologies/optical components enabling the extreme miniaturization of such sensors, as well as comprehensive coverage of PPG signal analysis techniques including machine learning and artificial intelligence. The book also outlines the huge range of PPG applications in healthcare, with a strong focus on the contribution of PPG in wearable sensors and PPG for cardiovascular assessment. - Presents the underlying principles and technology surrounding PPG - Includes applications for healthcare and wellbeing - Focuses on PPG in wearable sensors and devices - Presents advanced signal analysis techniques - Includes cutting-edge research, applications and future directions




Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization




Thermally-Aware Design


Book Description

Provides an overview of analysis and optimization techniques for thermally-aware chip design.