Book Description

Plasma processes for cleaning, etching and desmear of electronic components and printed wiring boards (PWB) are difficult to predict and control. Non-uniformity of most plasma processes and sensitivity to environmental changes make it difficult to maintain process stability from day to day. To assure plasma process performance, weight loss coupons or post-plasma destructive testing must be used. The problem with these techniques is that they are not real-time methods and do not allow for immediate diagnosis and process correction. These methods often require scrapping some fraction of a batch to insure the integrity of the rest. Since these methods verify a successful cycle with post-plasma diagnostics, poor test results often determine that a batch is substandard and the resulting parts unusable. Both of these methods are a costly part of the overall fabrication cost. A more efficient method of testing would allow for constant monitoring of plasma conditions and process control. Process failures should be detected before the parts being treated. are damaged. Real time monitoring would allow for instantaneous corrections. Multiple site monitoring would allow for process mapping within one system or simultaneous monitoring of multiple systems. Optical emission spectroscopy conducted external to the plasma apparatus would allow for this sort of multifunctional analysis without perturbing the glow discharge. In this paper, optical emission spectroscopy for non-intrusive, in situ process control will be explored. A discussion of this technique as it applies towards process control, failure analysis and endpoint determination will be conducted. Methods for identifying process failures, progress and end of etch back and desmear processes will be discussed.