Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 832 pages
File Size : 27,21 MB
Release : 2002
Category : Business & Economics
ISBN :
*Covers design, packaging, construction, assembly, and application of all three approaches to Area Array Packaging: Ball Grid Array (BGA), Chip Scale Package (CSP), and Flip Chip (FC) *Details the pros and cons of each technology with varying applications *Examines packaging ramifications of high density interconnects (HDI)
Author : Karl J. Puttlitz
Publisher : Springer Science & Business Media
Page : 1250 pages
File Size : 37,55 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 1461513898
Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.
Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 276 pages
File Size : 28,54 MB
Release : 2004
Category : Technology & Engineering
ISBN : 9780071428293
This engineering reference covers the most important assembly processes in modern electronic packaging. It includes flip chip assembly and processes, die-attach, and BGA and CSP rework.
Author : Rao Tummala
Publisher : Springer Science & Business Media
Page : 662 pages
File Size : 36,36 MB
Release : 1997-01-31
Category : Computers
ISBN : 9780412084515
This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.
Author : R.R. Tummala
Publisher : Springer Science & Business Media
Page : 1060 pages
File Size : 14,6 MB
Release : 2013-11-27
Category : Computers
ISBN : 1461560373
Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.
Author : Ken Gilleo
Publisher : McGraw Hill Professional
Page : 182 pages
File Size : 43,81 MB
Release : 2004
Category : Ball grid array technology
ISBN : 9780071428286
This engineering reference covers the most important assembly processes in modern electronic packaging.
Author : Yoshio Nishi
Publisher : CRC Press
Page : 1720 pages
File Size : 24,11 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1420017667
Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.
Author : Lászlo Roth
Publisher : John Wiley & Sons
Page : 850 pages
File Size : 21,48 MB
Release : 2012-12-07
Category : Design
ISBN : 1118420845
The essential packaging design resource, now with more patterns than ever! For more than two decades, The Packaging Designer's Book of Patterns has served as an indispensable source of ideas and practical solutions for a wide range of packaging design challenges. This Fourth Edition offers more than 600 patterns and structural designs—more than any other book—all drawn to scale and ready to be traced, scanned, or photocopied. Online access to the patterns in digital format allows readers to immediately use any pattern in the most common software programs, including Adobe Photoshop and Illustrator. Every pattern has been test-constructed to verify dimensional accuracy. The patterns can be scaled to suit particular specifications—many are easily converted to alternate uses—and most details are easily customizable. Features of this Fourth Edition include: More than 55 new patterns added to this edition—over 600 patterns in all A broad array of patterns for folding cartons, trays, tubes, sleeves, wraps, folders, rigid boxes, corrugated containers, and point-of-purchase displays Proven, scalable patterns that save hours of research and trial-and-error design Packaging patterns that are based on the use of 100% recyclable materials Includes access to a password protected website that contains all 600+ patterns in digital form for immediate use Comprehensive and up to date, The Packaging Designer's Book of Patterns, Fourth Edition enables packaging, display, and graphic designers and students to achieve project-specific design objectives with precision and confidence.
Author : Glenn R. Blackwell
Publisher : CRC Press
Page : 937 pages
File Size : 25,27 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 1351835548
The packaging of electronic devices and systems represents a significant challenge for product designers and managers. Performance, efficiency, cost considerations, dealing with the newer IC packaging technologies, and EMI/RFI issues all come into play. Thermal considerations at both the device and the systems level are also necessary. The Electronic Packaging Handbook, a new volume in the Electrical Engineering Handbook Series, provides essential factual information on the design, manufacturing, and testing of electronic devices and systems. Co-published with the IEEE, this is an ideal resource for engineers and technicians involved in any aspect of design, production, testing or packaging of electronic products, regardless of whether they are commercial or industrial in nature. Topics addressed include design automation, new IC packaging technologies, materials, testing, and safety. Electronics packaging continues to include expanding and evolving topics and technologies, as the demand for smaller, faster, and lighter products continues without signs of abatement. These demands mean that individuals in each of the specialty areas involved in electronics packaging-such as electronic, mechanical, and thermal designers, and manufacturing and test engineers-are all interdependent on each others knowledge. The Electronic Packaging Handbook elucidates these specialty areas and helps individuals broaden their knowledge base in this ever-growing field.
Author : Bonnie A. Osif
Publisher : CRC Press
Page : 548 pages
File Size : 11,91 MB
Release : 2016-04-19
Category : Language Arts & Disciplines
ISBN : 1439850038
With the encroachment of the Internet into nearly all aspects of work and life, it seems as though information is everywhere. However, there is information and then there is correct, appropriate, and timely information. While we might love being able to turn to Wikipedia for encyclopedia-like information or search Google for the thousands of links
