Assembled in Light


Book Description

The first monograph illustrating the high-end contemporary residential design of Barnes Coy Architects. Throughout their twenty-five-year commitment to modern design, Barnes Coy Architects have specialized in one-of-a-kind dream houses designed for those who prefer to live in highly spatial and modern ways. Assembled in Light is the first exclusive look at this firm's previously unpublished body of high-end residential work. These leisure homes gleam in the sun like sleek, finely tuned machines. Everything has been custom designed, custom made, custom treated. The houses are tastefully furnished with one-of-a-kind artisanal pieces (by Wendell Castle, Chris Lehrecke, etc.) and museum-quality collections of contemporary art hanging on the walls (such as works by Anselm Kiefer, Barbara Kruger, Richard Prince, and Cindy Sherman). They feature infinity pools, outdoor and indoor kitchens, roof decks, temperature-controlled wine cellars, and numerous guest rooms, as well as ten-foot-high doorways and floor-to-ceiling swathes of tempered glass to better gaze out at the dunes and ocean views. The new photography beautifully captures the architects' attention to detail and love of specialized materials, whether it's Carrara marble from Italy or teak from Bali. While most of the houses are located in the Hamptons in New York, a few are found as far afield as Costa Rica, California, Georgia, and Westchester County. All but three homes were built on commanding waterfront sites.




Microelectronic Interconnections and Assembly


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MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.







The Automobile


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Federal Register


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USITC Publication


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Economy Approach Lighting Aids


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