Design of High-Speed Railway Turnouts


Book Description

High-speed turnouts, a key technology for high-speed railways, have a great influence on the safe and stable running of high-speed trains. Design of High-Speed Railway Turnouts: Theory and Applications, comprehensively introduces the technical characteristics and requirements of high-speed turnouts, including design theories and methods of turnout layout geometry, wheel and rail relations, track stiffness, welded turnout, turnout conversion, turnout components, and manufacture and laying technologies of turnouts. Analyzing the operational problems of China's high-speed turnout in particular, this book discusses the control of structure irregularity, state irregularity, geometrical irregularity and dynamic irregularity during the design, manufacture, laying, and maintenance of turnouts. At the end of this reference book, the author provides high-speed turnouts management methods, maintenance standards, testing and monitoring technology, and maintenance technology. Design of High-Speed Railway Turnouts: Theory and Applications will enable railway technicians all over the world to develop an in-depth knowledge of the design, manufacture, laying, and maintenance technology of high-speed turnouts. - The first book in the world to focus explicitly on high-speed turnouts, including design, construction, maintenance and management of high speed turnouts - Expounds the theory of vehicle-turnout system coupling dynamics in detail, aligning this with several examples of computation, and examines the results of dynamic experiments which validate the theory - Written by Ping Wang, who is recognized as a leading researcher and main developer of high-speed turnouts in China




Structural Analysis and Design of Tall Buildings


Book Description

As software skills rise to the forefront of design concerns, the art of structural conceptualization is often minimized. Structural engineering, however, requires the marriage of artistic and intuitive designs with mathematical accuracy and detail. Computer analysis works to solidify and extend the creative idea or concept that might have started o







Beam Ends


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Analysis of Aircraft Structures


Book Description

As with the first edition, this textbook provides a clear introduction to the fundamental theory of structural analysis as applied to vehicular structures such as aircraft, spacecraft, automobiles and ships. The emphasis is on the application of fundamental concepts of structural analysis that are employed in everyday engineering practice. All approximations are accompanied by a full explanation of their validity. In this new edition, more topics, figures, examples and exercises have been added. There is also a greater emphasis on the finite element method of analysis. Clarity remains the hallmark of this text and it employs three strategies to achieve clarity of presentation: essential introductory topics are covered, all approximations are fully explained and many important concepts are repeated.




Black & Decker The Complete Outdoor Builder


Book Description

Adding beautiful, functional patios and walkways to the yard has never been easier thanks to this book. Over 150 projects and hundreds of instructional photographs combine with informative tips, tricks, and inspiration for the most comprehensive patio and walkway book on the market. From low-cost, curb-appeal walkways to expansive, estate-quality decorative concrete patios complete with outdoor kitchens, this book presents each project with step-by-step instructions and full-color photographs as well as informative tips, tricks, and inspiration. Each project uses the most current materials, tools, common practices, codes, and construction techniques to help readers add value to their homes and allow them to enjoy their outdoor spaces to full potential. Whether an existing patio needs to be freshened up or an unused space in the yard is just waiting to be put to use, this book is a crucial resource for do-it-yourself homeowners.




Area Array Interconnection Handbook


Book Description

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.




The Nautical Magazine


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