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CMOS - MEMS

Author : Henry Baltes

Publisher : John Wiley & Sons

Page : 610 pages

File Size : 20,48 MB

Release : 2013-03-26

Category : Technology & Engineering

ISBN : 352767506X

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Book Description

This edition of 'CMOS-MEMS' was originally published in the successful series 'Advanced Micro & Nanosystems'. Here, the combination of the globally established, billion dollar chip mass fabrication technology CMOS with the fascinating and commercially promising new world of MEMS is covered from all angles. The book introduces readers to this fi eld and takes them from fabrication technologies and material charaterization aspects to the actual applications of CMOS-MEMS - a wide range of miniaturized physical, chemical and biological sensors and RF systems. Vital knowledge on circuit and system integration issues concludes this in-depth treatise, illustrating the advantages of combining CMOS and MEMS in the first place, rather than having a hybrid solution.



Development of CMOS-MEMS/NEMS Devices

Author : Jaume Verd

Publisher : MDPI

Page : 166 pages

File Size : 44,33 MB

Release : 2019-06-25

Category : Technology & Engineering

ISBN : 3039210688

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Book Description

Micro and nano-electro-mechanical system (M/NEMS) devices constitute key technological building blocks to enable increased additional functionalities within Integrated Circuits (ICs) in the More-Than-Moore era, as described in the International Technology Roadmap for Semiconductors. The CMOS ICs and M/NEMS dies can be combined in the same package (SiP), or integrated within a single chip (SoC). In the SoC approach the M/NEMS devices are monolithically integrated together with CMOS circuitry allowing the development of compact and low-cost CMOS-M/NEMS devices for multiple applications (physical sensors, chemical sensors, biosensors, actuators, energy actuators, filters, mechanical relays, and others). On-chip CMOS electronics integration can overcome limitations related to the extremely low-level signals in sub-micrometer and nanometer scale electromechanical transducers enabling novel breakthrough applications. This Special Issue aims to gather high quality research contributions dealing with MEMS and NEMS devices monolithically integrated with CMOS, independently of the final application and fabrication approach adopted (MEMS-first, interleaved MEMS, MEMS-last or others).]



3D and Circuit Integration of MEMS

Author : Masayoshi Esashi

Publisher : John Wiley & Sons

Page : 528 pages

File Size : 18,79 MB

Release : 2021-03-16

Category : Technology & Engineering

ISBN : 3527823255

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Book Description

Explore heterogeneous circuit integration and the packaging needed for practical applications of microsystems MEMS and system integration are important building blocks for the “More-Than-Moore” paradigm described in the International Technology Roadmap for Semiconductors. And, in 3D and Circuit Integration of MEMS, distinguished editor Dr. Masayoshi Esashi delivers a comprehensive and systematic exploration of the technologies for microsystem packaging and heterogeneous integration. The book focuses on the silicon MEMS that have been used extensively and the technologies surrounding system integration. You’ll learn about topics as varied as bulk micromachining, surface micromachining, CMOS-MEMS, wafer interconnection, wafer bonding, and sealing. Highly relevant for researchers involved in microsystem technologies, the book is also ideal for anyone working in the microsystems industry. It demonstrates the key technologies that will assist researchers and professionals deal with current and future application bottlenecks. Readers will also benefit from the inclusion of: A thorough introduction to enhanced bulk micromachining on MIS process, including pressure sensor fabrication and the extension of MIS process for various advanced MEMS devices An exploration of epitaxial poly Si surface micromachining, including process condition of epi-poly Si, and MEMS devices using epi-poly Si Practical discussions of Poly SiGe surface micromachining, including SiGe deposition and LP CVD polycrystalline SiGe A concise treatment of heterogeneously integrated aluminum nitride MEMS resonators and filters Perfect for materials scientists, electronics engineers, and electrical and mechanical engineers, 3D and Circuit Integration of MEMS will also earn a place in the libraries of semiconductor physicists seeking a one-stop reference for circuit integration and the practical application of microsystems.



Enabling Technology for MEMS and Nanodevices

Author : Henry Baltes

Publisher : John Wiley & Sons

Page : 441 pages

File Size : 28,75 MB

Release : 2013-03-27

Category : Technology & Engineering

ISBN : 3527675043

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Book Description

Mikro- und Nanotechnik haben Wissenschaft und Forschung revolutioniert. In Zukunft werden sie auch den Alltag verändern. Nun liegt der erste Band einer neuen Buchreihe vor: Advanced Micro and Nano Systems 1. Henry Baltes und seine Co-Autoren knüpfen mit AMN an die Sensors Update-Reihe an. Das Autorenteam wurde um weitere Experten erweitert. AMN wird zwei Mal pro Jahr mit einem neuen Band die aktuellen Entwicklungen in der Mikro- und Nano-Welt begleiten. Die Erforschung und der Einsatz von Mikro- und Nanosystemen sind eines der brandaktuellen Themen im Wissenschaftsbereich. Die Forschungsergebnisse werden mehr und mehr auch konkret umgesetzt. Damit werden Mikro- und Nanotechnologie zu Wirtschaftsfaktoren. Aktuelle Entwicklungen, neue Technologien, Nano-Bauelemente und Systeme im Mikromaßstab - Advanced Micro and Nano Systems, die neue Buchreihe, wird Spiegel der spannenden und faszinierenden Mikro- und Nano-Welt sein. Zweimal pro Jahr wird es einen neuen AMN-Band geben. Die Autoren sind ausgewiesene Spezialisten. Zu den Herausgebern zählt Henry Baltes, Professor an der ETH Zürich. Er zeichnete bereits für die Bände der Sensors Update-Reihe verantwortlich. Die Artikel ermöglichen Neueinsteigern einen ersten Zugriff auf die Materie. Fachleute erhalten einen umfassenden Überblick. Anspruch der Herausgeber ist es, nicht nur die theoretischen Grundlagen von Mikro- und Nanosystemen zu reflektieren, sondern immer auch praktische Möglichkeiten und die Grenzen der Anwendung im Blick zu haben. Die AMN-Bände sind Handbücher und Nachschlagewerke in einem. Die Reihe richtet sich an Vertreter unterschiedlicher Fachrichtungen: Biologie, Chemie, Mathematik, Sensorindustrie und Materialwissenschaften.



Materials and Failures in MEMS and NEMS

Author : Atul Tiwari

Publisher : John Wiley & Sons

Page : 435 pages

File Size : 32,2 MB

Release : 2015-09-11

Category : Technology & Engineering

ISBN : 1119083869

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Book Description

The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.



Poly-SiGe for MEMS-above-CMOS Sensors

Author : Pilar Gonzalez Ruiz

Publisher : Springer Science & Business Media

Page : 210 pages

File Size : 18,98 MB

Release : 2013-07-17

Category : Technology & Engineering

ISBN : 9400767994

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Book Description

Polycrystalline SiGe has emerged as a promising MEMS (Microelectromechanical Systems) structural material since it provides the desired mechanical properties at lower temperatures compared to poly-Si, allowing the direct post-processing on top of CMOS. This CMOS-MEMS monolithic integration can lead to more compact MEMS with improved performance. The potential of poly-SiGe for MEMS above-aluminum-backend CMOS integration has already been demonstrated. However, aggressive interconnect scaling has led to the replacement of the traditional aluminum metallization by copper (Cu) metallization, due to its lower resistivity and improved reliability. Poly-SiGe for MEMS-above-CMOS sensors demonstrates the compatibility of poly-SiGe with post-processing above the advanced CMOS technology nodes through the successful fabrication of an integrated poly-SiGe piezoresistive pressure sensor, directly fabricated above 0.13 m Cu-backend CMOS. Furthermore, this book presents the first detailed investigation on the influence of deposition conditions, germanium content and doping concentration on the electrical and piezoresistive properties of boron-doped poly-SiGe. The development of a CMOS-compatible process flow, with special attention to the sealing method, is also described. Piezoresistive pressure sensors with different areas and piezoresistor designs were fabricated and tested. Together with the piezoresistive pressure sensors, also functional capacitive pressure sensors were successfully fabricated on the same wafer, proving the versatility of poly-SiGe for MEMS sensor applications. Finally, a detailed analysis of the MEMS processing impact on the underlying CMOS circuit is also presented.



Handbook of Silicon Based MEMS Materials and Technologies

Author : Markku Tilli

Publisher : William Andrew

Page : 827 pages

File Size : 33,21 MB

Release : 2015-09-02

Category : Technology & Engineering

ISBN : 0323312233

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Book Description

The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory



MEMS

Author : Mohamed Gad-el-Hak

Publisher : CRC Press

Page : 576 pages

File Size : 50,98 MB

Release : 2005-11-29

Category : Technology & Engineering

ISBN : 1420036556

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Book Description

As our knowledge of microelectromechanical systems (MEMS) continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection



SOC Design Methodologies

Author : Michel Robert

Publisher : Springer

Page : 489 pages

File Size : 26,85 MB

Release : 2013-03-15

Category : Technology & Engineering

ISBN : 0387355979

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Book Description

The 11 th IFIP International Conference on Very Large Scale Integration, in Montpellier, France, December 3-5,2001, was a great success. The main focus was about IP Cores, Circuits and System Designs & Applications as well as SOC Design Methods and CAD. This book contains the best papers (39 among 70) that have been presented during the conference. Those papers deal with all aspects of importance for the design of the current and future integrated systems. System on Chip (SOC) design is today a big challenge for designers, as a SOC may contain very different blocks, such as microcontrollers, DSPs, memories including embedded DRAM, analog, FPGA, RF front-ends for wireless communications and integrated sensors. The complete design of such chips, in very deep submicron technologies down to 0.13 mm, with several hundreds of millions of transistors, supplied at less than 1 Volt, is a very challenging task if design, verification, debug and industrial test are considered. The microelectronic revolution is fascinating; 55 years ago, in late 1947, the transistor was invented, and everybody knows that it was by William Shockley, John Bardeen and Walter H. Brattein, Bell Telephone Laboratories, which received the Nobel Prize in Physics in 1956. Probably, everybody thinks that it was recognized immediately as a major invention.



Micro- and Nanomanipulation Tools

Author : Yu Sun

Publisher : John Wiley & Sons

Page : 608 pages

File Size : 15,80 MB

Release : 2015-09-10

Category : Technology & Engineering

ISBN : 3527690255

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Book Description

Combining robotics with nanotechnology, this ready reference summarizes the fundamentals and emerging applications in this fascinating research field. This is the first book to introduce tools specifically designed and made for manipulating micro- and nanometer-sized objects, and presents such examples as semiconductor packaging and clinical diagnostics as well as surgery. The first part discusses various topics of on-chip and device-based micro- and nanomanipulation, including the use of acoustic, magnetic, optical or dielectrophoretic fields, while surface-driven and high-speed microfluidic manipulation for biophysical applications are also covered. In the second part of the book, the main focus is on microrobotic tools. Alongside magnetic micromanipulators, bacteria and untethered, chapters also discuss silicon nano- and integrated optical tweezers. The book closes with a number of chapters on nanomanipulation using AFM and nanocoils under optical and electron microscopes. Exciting images from the tiniest robotic systems at the nano-level are used to illustrate the examples throughout the work. A must-have book for readers with a background ranging from engineering to nanotechnology.