Crosstalk in Modern On-Chip Interconnects


Book Description

The book provides accurate FDTD models for on-chip interconnects, covering most recent advancements in materials and design. Furthermore, depending on the geometry and physical configurations, different electrical equivalent models for CNT and GNR based interconnects are presented. Based on the electrical equivalent models the performance comparison among the Cu, CNT and GNR-based interconnects are also discussed in the book. The proposed models are validated with the HSPICE simulations. The book introduces the current research scenario in the modeling of on-chip interconnects. It presents the structure, properties, and characteristics of graphene based on-chip interconnects and the FDTD modeling of Cu based on-chip interconnects. The model considers the non-linear effects of CMOS driver as well as the transmission line effects of interconnect line that includes coupling capacitance and mutual inductance effects. In a more realistic manner, the proposed model includes the effect of width-dependent MFP of the MLGNR while taking into account the edge roughness.




Nano Interconnects


Book Description

This textbook comprehensively covers on-chip interconnect dimension and application of carbon nanomaterials for modeling VLSI interconnect and buffer circuits. It provides analysis of ultra-low power high speed nano-interconnects based on different facets such as material modeling, circuit modeling and the adoption of repeater insertion strategies and measurement techniques. It covers important topics including on-chip interconnects, interconnect modeling, electrical impedance modeling of on-chip interconnects, modeling of repeater buffer and variability analysis. Pedagogical features including solved problems and unsolved exercises are interspersed throughout the text for better understanding. Aimed at senior undergraduate and graduate students in the field of electrical engineering, electronics and communications engineering for courses on Advanced VLSI Interconnects/Advanced VLSI Design/VLSI Interconnects/VLSI Design Automation and Techniques, this book: Provides comprehensive coverage of fundamental concepts related to nanotube transistors and interconnects. Discusses properties and performance of practical nanotube devices and related applications. Covers physical and electrical phenomena of carbon nanotubes, as well as applications enabled by this nanotechnology. Discusses the structure, properties, and characteristics of graphene-based on-chip interconnect. Examines interconnect power and interconnect delay issues arising due to downscaling of device size.




Integrated Circuit and System Design. Power and Timing Modeling, Optimization and Simulation


Book Description

Welcome to the proceedings of PATMOS 2003. This was the 13th in a series of international workshops held in several locations in Europe. Over the years, PATMOS has gained recognition as one of the major European events devoted to power and timing aspects of integrated circuit and system design. Despite its signi?cant growth and development, PATMOS can still be considered as a very informal forum, featuring high-level scienti?c presentations together with open discussions and panel sessions in a free and relaxed environment. This year, PATMOS took place in Turin, Italy, organized by the Politecnico di Torino, with technical co-sponsorship from the IEEE Circuits and Systems Society and the generous support of the European Commission, as well as that of several industrial sponsors, including BullDAST, Cadence, Mentor Graphics, STMicroelectronics, and Synopsys. The objective of the PATMOS workshop is to provide a forum to discuss and investigate the emerging problems in methodologies and tools for the design of new generations of integrated circuits and systems. A major emphasis of the technical program is on speed and low-power aspects, with particular regard to modeling, characterization, design, and architectures.




Modern Receiver Front-Ends


Book Description

Architectures BABAK MATINPOUR and JOY LASKAR * Describes the actual implementation of receiver architectures from the initial design to an IC-based product * Presents many tricks-of-the-trade not usually covered in textbooks * Covers a range of practical issues including semiconductor technology selection, cost versus performance, yield, packaging, prototype development, testing, and analysis * Discusses architectures that are employed in modern broadband wireless systems




Modern VLSI Design


Book Description

The Number 1 VLSI Design Guide—Now Fully Updated for IP-Based Design and the Newest Technologies Modern VLSI Design, Fourth Edition, offers authoritative, up-to-the-minute guidance for the entire VLSI design process—from architecture and logic design through layout and packaging. Wayne Wolf has systematically updated his award-winning book for today’s newest technologies and highest-value design techniques. Wolf introduces powerful new IP-based design techniques at all three levels: gates, subsystems, and architecture. He presents deeper coverage of logic design fundamentals, clocking and timing, and much more. No other VLSI guide presents as much up-to-date information for maximizing performance, minimizing power utilization, and achieving rapid design turnarounds.




Low Power Design Essentials


Book Description

This book contains all the topics of importance to the low power designer. It first lays the foundation and then goes on to detail the design process. The book also discusses such special topics as power management and modal design, ultra low power, and low power design methodology and flows. In addition, coverage includes projections of the future and case studies.




Solutions on Embedded Systems


Book Description

Embedded systems have an increasing importance in our everyday lives. The growing complexity of embedded systems and the emerging trend to interconnections between them lead to new challenges. Intelligent solutions are necessary to overcome these challenges and to provide reliable and secure systems to the customer under a strict time and financial budget. Solutions on Embedded Systems documents results of several innovative approaches that provide intelligent solutions in embedded systems. The objective is to present mature approaches, to provide detailed information on the implementation and to discuss the results obtained.




Noise Coupling in System-on-Chip


Book Description

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.




Integrated Devices for Artificial Intelligence and VLSI


Book Description

With its in-depth exploration of the close connection between microelectronics, AI, and VLSI technology, this book offers valuable insights into the cutting-edge techniques and tools used in VLSI design automation, making it an essential resource for anyone seeking to stay ahead in the rapidly evolving field of VLSI design. Very large-scale integration (VLSI) is the inter-disciplinary science of utilizing advanced semiconductor technology to create various functions of computer system. This book addresses the close link of microelectronics and artificial intelligence (AI). By combining VLSI technology, a very powerful computer architecture confinement is possible. To overcome problems at different design stages, researchers introduced artificial intelligent (AI) techniques in VLSI design automation. AI techniques, such as knowledge-based and expert systems, first try to define the problem and then choose the best solution from the domain of possible solutions. These days, several CAD technologies, such as Synopsys and Mentor Graphics, are specifically created to increase the automation of VLSI design. When a task is completed using the appropriate tool, each stage of the task design produces outcomes that are more productive than typical. However, combining all of these tools into a single package offer has drawbacks. We can’t really use every outlook without sacrificing the efficiency and usefulness of our output. The researchers decided to include AI approaches into VLSI design automation in order to get around these obstacles. AI is one of the fastest growing tools in the world of technology and innovation that helps to make computers more reliable and easy to use. Artificial Intelligence in VLSI design has provided high-end and more feasible solutions to the difficulties faced by the VLSI industry. Physical design, RTL design, STA, etc. are some of the most in-demand courses to enter the VLSI industry. These courses help develop a better understanding of the many tools like Synopsis. With each new dawn, artificial intelligence in VLSI design is continually evolving, and new opportunities are being investigated.




Development, Validation, and Application of Semi-Analytical Interconnect Models for Efficient Simulation of Multilayer Substrates


Book Description

This thesis deals with the development of semi-analytical models for the electrical behavior of vias and traces in chip packages and printed circuit boards. A framework for automated simulation of multilayer structures is also proposed. The validation and evaluation of the models are thoroughly addressed with several test structures and application studies. It is shown that the models can provide good results up to 40 GHz, whereas the numerical efficiency is at least two orders of magnitude higher in comparison to general-purpose numerical methods.