Damping Properties of Viscoelastic Materials Under Biaxial Stress


Book Description

The damping characteristics of a temperature independent viscoelastic material are determined under axial, shear, and several combinations of both axial and shear loadings. A method for measuring these properties is devised by considering a double lap joint specimen and measuring the area of the hysteresis loops which resulted from the cyclic loading of the specimen under axial, shear, and several combinations of both axial and shear conditions. The complex elastic and shear moduli and Poisson's ratio are presented as a function of the strain amplitude. The experimental results of the damping properties under biaxial stresses are found to be in good agreement with the theoretical analysis. (Author).




Dissertation Abstracts


Book Description

Abstracts of dissertations and monographs in microform.




Phenomenological Theories of Hysteretic Material Damping with Applicaton to the Vibrations of Circular Plates


Book Description

Prediction of hysteretic specific damping energy of structural materials under combined dynamic stresses knowing the damping under uniaxial stresses is discussed. Consideration is limited to biaxial states of stress. Bounds for biaxial stress damping are proposed to be the values predicted by assuming purely dilatational damping and purely distortional damping. Available published data show qualitative agreement with the predicted bounds. New experiments for this report involving vibration decay tests on mild steel beams and circular plates are discussed with emphasis on accuracy. Data for beams are used to predict bounds for plate damping. Plate damping data are bracketed by these bounds which lends confidence in the theory for this sort of stresses. It is concluded that the theory will give satisfactory results for isotropic, homogeneous materials provided the biaxially-stressed part and the specimens for the uniaxial-stress damping experiments are from the same stock and the uniaxial tests match the temperature and frequency of the application. (Author).