Design and Optimization of Global Interconnect in High Speed VLSI Circuits
Author : Haihua Su
Publisher :
Page : 270 pages
File Size : 30,1 MB
Release : 2002
Category :
ISBN :
Author : Haihua Su
Publisher :
Page : 270 pages
File Size : 30,1 MB
Release : 2002
Category :
ISBN :
Author : Vazgen Melikyan
Publisher : Springer
Page : 371 pages
File Size : 41,58 MB
Release : 2018-04-12
Category : Technology & Engineering
ISBN : 3319716379
This book describes new, fuzzy logic-based mathematical apparatus, which enable readers to work with continuous variables, while implementing whole circuit simulations with speed, similar to gate-level simulators and accuracy, similar to circuit-level simulators. The author demonstrates newly developed principles of digital integrated circuit simulation and optimization that take into consideration various external and internal destabilizing factors, influencing the operation of digital ICs. The discussion includes factors including radiation, ambient temperature, electromagnetic fields, and climatic conditions, as well as non-ideality of interconnects and power rails.
Author : Bing Lu
Publisher : Springer Science & Business Media
Page : 292 pages
File Size : 12,77 MB
Release : 2013-06-29
Category : Computers
ISBN : 1475734158
Introduction The exponential scaling of feature sizes in semiconductor technologies has side-effects on layout optimization, related to effects such as inter connect delay, noise and crosstalk, signal integrity, parasitics effects, and power dissipation, that invalidate the assumptions that form the basis of previous design methodologies and tools. This book is intended to sample the most important, contemporary, and advanced layout opti mization problems emerging with the advent of very deep submicron technologies in semiconductor processing. We hope that it will stimulate more people to perform research that leads to advances in the design and development of more efficient, effective, and elegant algorithms and design tools. Organization of the Book The book is organized as follows. A multi-stage simulated annealing algorithm that integrates floorplanning and interconnect planning is pre sented in Chapter 1. To reduce the run time, different interconnect plan ning approaches are applied in different ranges of temperatures. Chapter 2 introduces a new design methodology - the interconnect-centric design methodology and its centerpiece, interconnect planning, which consists of physical hierarchy generation, floorplanning with interconnect planning, and interconnect architecture planning. Chapter 3 investigates a net-cut minimization based placement tool, Dragon, which integrates the state of the art partitioning and placement techniques.
Author : Sandip Bhattacharya
Publisher : CRC Press
Page : 223 pages
File Size : 20,76 MB
Release : 2023-12-22
Category : Technology & Engineering
ISBN : 1003817068
Focusses on materials and nanomaterials utilization in next generation interconnects based on carbon nanotubes (CNT) and graphene nanoribbons (GNR) Helps readers realize interconnects, interconnect models, and crosstalk noise analysis Describes hybrid CNT and GNR based interconnects Presents the details of power supply voltage drop analysis in CNT and GNR interconnects Overviews pertinent RF performance and stability analysis
Author : Dr. Ashad Ullah Qureshi
Publisher : Concepts Books Publication
Page : 33 pages
File Size : 32,32 MB
Release : 2022-07-01
Category : Technology & Engineering
ISBN :
As prevailing copper interconnect technology advances to its fundamental physical limit, interconnect delay due to ever-increasing wire resistivity has greatly limited the circuit miniaturization. Carbon nanotube (CNT) interconnects have emerged as promising replacement materials for copper interconnects due to their superior conductivity. Buffer insertion for CNT interconnects is capable of improving circuit timing of signal nets with limited buffer deployment. However, due to the imperfection of fabricating long straight CNT, there exist significant unidimensional-spatially correlated variations on the critical CNT geometric parameters such as the diameter and density, which will act the circuit performance. This dissertation develops a novel timing driven buffer insertion technique considering unidimensional correlations of variations of CNT. Although the fabrication variations of CNTs are not desired for the circuit designs targeting performance optimization and reliability, these inherent imperfections make them natural candidates for building highly secure physical unclonable function (PUF), which is an advanced hardware security technology. A novel CNT PUF design through leveraging Lorenz chaotic system is developed and we show that it is resistant to many machine learning modeling attacks. In summary, the studies in this dissertation demonstrate that CNT technology is highly promising for performance and security optimizations in advanced VLSI circuit design.
Author : Millie Pant
Publisher : Springer
Page : 1030 pages
File Size : 10,10 MB
Release : 2016-03-19
Category : Technology & Engineering
ISBN : 981100448X
The proceedings of SocProS 2015 will serve as an academic bonanza for scientists and researchers working in the field of Soft Computing. This book contains theoretical as well as practical aspects using fuzzy logic, neural networks, evolutionary algorithms, swarm intelligence algorithms, etc., with many applications under the umbrella of ‘Soft Computing’. The book will be beneficial for young as well as experienced researchers dealing across complex and intricate real world problems for which finding a solution by traditional methods is a difficult task. The different application areas covered in the proceedings are: Image Processing, Cryptanalysis, Industrial Optimization, Supply Chain Management, Newly Proposed Nature Inspired Algorithms, Signal Processing, Problems related to Medical and Health Care, Networking Optimization Problems, etc.
Author : Rohit Dhiman
Publisher : Springer
Page : 122 pages
File Size : 38,53 MB
Release : 2014-11-07
Category : Technology & Engineering
ISBN : 813222132X
The book provides a detailed analysis of issues related to sub-threshold interconnect performance from the perspective of analytical approach and design techniques. Particular emphasis is laid on the performance analysis of coupling noise and variability issues in sub-threshold domain to develop efficient compact models. The proposed analytical approach gives physical insight of the parameters affecting the transient behavior of coupled interconnects. Remedial design techniques are also suggested to mitigate the effect of coupling noise. The effects of wire width, spacing between the wires, wire length are thoroughly investigated. In addition, the effect of parameters like driver strength on peak coupling noise has also been analyzed. Process, voltage and temperature variations are prominent factors affecting sub-threshold design and have also been investigated. The process variability analysis has been carried out using parametric analysis, process corner analysis and Monte Carlo technique. The book also provides a qualitative summary of the work reported in the literature by various researchers in the design of digital sub-threshold circuits. This book should be of interest for researchers and graduate students with deeper insights into sub-threshold interconnect models in particular. In this sense, this book will best fit as a text book and/or a reference book for students who are initiated in the area of research and advanced courses in nanotechnology, interconnect design and modeling.
Author : Jorge Juan Chico
Publisher : Springer
Page : 647 pages
File Size : 25,87 MB
Release : 2003-10-02
Category : Technology & Engineering
ISBN : 3540397620
Welcome to the proceedings of PATMOS 2003. This was the 13th in a series of international workshops held in several locations in Europe. Over the years, PATMOS has gained recognition as one of the major European events devoted to power and timing aspects of integrated circuit and system design. Despite its signi?cant growth and development, PATMOS can still be considered as a very informal forum, featuring high-level scienti?c presentations together with open discussions and panel sessions in a free and relaxed environment. This year, PATMOS took place in Turin, Italy, organized by the Politecnico di Torino, with technical co-sponsorship from the IEEE Circuits and Systems Society and the generous support of the European Commission, as well as that of several industrial sponsors, including BullDAST, Cadence, Mentor Graphics, STMicroelectronics, and Synopsys. The objective of the PATMOS workshop is to provide a forum to discuss and investigate the emerging problems in methodologies and tools for the design of new generations of integrated circuits and systems. A major emphasis of the technical program is on speed and low-power aspects, with particular regard to modeling, characterization, design, and architectures.
Author : Ashish Raman
Publisher : CRC Press
Page : 410 pages
File Size : 45,72 MB
Release : 2022-05-10
Category : Technology & Engineering
ISBN : 1000577236
This comprehensive reference text discusses novel semiconductor devices, including nanostructure field-effect transistors, photodiodes, high electron mobility transistors, and oxide-based devices. The text covers submicron semiconductor devices, device modeling, novel materials for devices, novel semiconductor devices, optimization techniques, and their application in detail. It covers such important topics as negative capacitance devices, surface-plasmon resonance devices, Fermi-level pinning, external stimuli-based optimization techniques, optoelectronic devices, and architecture-based optimization techniques. The book: Covers novel semiconductor devices with submicron dimensions Discusses comprehensive device optimization techniques Examines conceptualization and modeling of semiconductor devices Covers circuit and sensor-based application of the novel devices Discusses novel materials for next-generation devices This text will be useful for graduate students and professionals in fields including electrical engineering, electronics and communication engineering, materials science, and nanoscience.
Author : Pingshan Wang
Publisher :
Page : 336 pages
File Size : 39,41 MB
Release : 2004
Category :
ISBN :