Development of Adhesives with Improved Heat Resistance in Bonds of Stainless Steel


Book Description

Adhesives containing combinations of polyamide resin with melamine compounds, epoxy resins with vinyl anhydride copolymers, and inorganic fillers were studied as heat-resistant bonding agents for stainless steel. Attempts to improve the strength of the polyamide-melamine type adhesive at 550° F. were unsuccessful. Studies were made of the heat-resistant properties of eight different epoxy resins modified with an ethyl acrylate-maleic anhydride copolymer and with maleic anhydride. The most promising of these were adhesive formulations of epoxy resins which were glycidyl ethers of either bisphenol A or tetra hydroxy phenyl ethane and contained aluminum powder and arsenic pentoxide fillers impregnated into asbestos cloth. (Author).




NASA Technical Note


Book Description




Report


Book Description













Machine Design


Book Description




Treatise on Adhesion and Adhesives


Book Description







Technical Abstract Bulletin


Book Description