Data compilations in physics


Book Description




Diffusion in Solids


Book Description

This book describes the central aspects of diffusion in solids, and goes on to provide easy access to important information about diffusion in metals, alloys, semiconductors, ion-conducting materials, glasses and nanomaterials. Coverage includes diffusion-controlled phenomena including ionic conduction, grain-boundary and dislocation pipe diffusion. This book will benefit graduate students in such disciplines as solid-state physics, physical metallurgy, materials science, and geophysics, as well as scientists in academic and industrial research laboratories.




Diffusion in Materials - DIMAT2008


Book Description

Selected, peer reviewed papers from the eventh International Conference on Diffusion in Materials, held at Lanzarote (Caranry Islands, SPAIN)







Introduction to Space Charge Effects in Semiconductors


Book Description

Describing space-charge effects in semiconductors, this text moves from basic principles to advanced application in semiconducting devices. It uses detailed analyses of the transport, Poisson, and continuity equations to show the behavior of solution curves.




ASM Handbook


Book Description

These volumes cover the properties, processing, and applications of metals and nonmetallic engineering materials. They are designed to provide the authoritative information and data necessary for the appropriate selection of materials to meet critical design and performance criteria.




Physical Metallurgy


Book Description

This is the fourth edition of a work which first appeared in 1965. The first edition had approximately one thousand pages in a single volume. This latest volume has almost three thousand pages in 3 volumes which is a fair measure of the pace at which the discipline of physical metallurgy has grown in the intervening 30 years.Almost all the topics previously treated are still in evidence in this version which is approximately 50% bigger than the previous edition. All the chapters have been either totally rewritten by new authors or thoroughly revised and expanded, either by the third-edition authors alone or jointly with new co-authors. Three chapters on new topics have been added, dealing with dry corrosion, oxidation and protection of metal surfaces; the dislocation theory of the mechanical behavior of intermetallic compounds; and (most novel) a chapter on polymer science for metallurgists, which analyses the conceptual mismatch between metallurgists' and polymer scientists' way of looking at materials. Special care has been taken throughout all chapters to incorporate the latest experimental research results and theoretical insights. Several thousand citations to the research and review literature are included in this edition. There is a very detailed subject index, as well as a comprehensive author index.The original version of this book has long been regarded as the standard text in physical metallurgy and this thoroughly rewritten and updated version will retain this status.




Diffusion and Thermodynamics of Materials


Book Description

D&T '06 Proceedings of the 9th Seminar on Diffusion and Thermodynamics of Materials, Brno, Czech Republic, September 13-15, 2006




Diffusion Processes in Advanced Technological Materials


Book Description

This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.