Dynamic Response Assessment for the MEMS Accelerometer Under Severe Shock Loads
Author :
Publisher :
Page : 80 pages
File Size : 29,13 MB
Release : 2001
Category :
ISBN :
Author :
Publisher :
Page : 80 pages
File Size : 29,13 MB
Release : 2001
Category :
ISBN :
Author : Mark S. Fan
Publisher :
Page : 78 pages
File Size : 46,1 MB
Release : 2001
Category : Accelerometers
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Author : National Aeronautics and Space Administration (NASA)
Publisher : Createspace Independent Publishing Platform
Page : 74 pages
File Size : 36,10 MB
Release : 2018-05-30
Category :
ISBN : 9781720481201
NASA Goddard Space Flight Center (GSFC) has evaluated the dynamic response of a commercial-off-the-shelf (COTS) microelectromechanical systems (MEMS) device made by Analog Device, Inc. The device is designated as ADXL250 and is designed mainly for sensing dynamic acceleration. It is also used to measure the tilting angle of any system or component from its original level position. The device has been in commercial use (e.g., in automobile airbag deployment system as a dual-axial accelerometer and in the electronic game play-station as a tilting sensor) with success, but NASA needs an in-depth assessment of its performance under severe dynamic shock environments. It was realized while planning this evaluation task that two assessments would be beneficial to NASA's missions: (1) severe dynamic shock response under nominal thermal environments; and (2) general dynamic performance under cryogenic environments. The first evaluation aims at obtaining a good understanding of its micromachined structure within a framework of brittle fracture dynamics, while the second evaluation focuses on the structure integrity under cryogenic temperature conditions. The information we gathered from the manufacturer indicated that the environmental stresses under NASA's evaluation program have been far beyond what the device has experienced with commercial applications, for which the device was designed. Thus NASA needs the outcome of this evaluation in order to make the selection for possible use for its missions. This paper provides details of the first evaluation the dynamic response under severe multi-axial single-pulse shock load. It was performed using finite element tools with nonlinear dynamics procedures.Fan, Mark S. and Shaw, Harry C.Goddard Space Flight CenterACCELEROMETERS; COMMERCIAL OFF-THE-SHELF PRODUCTS; DYNAMIC RESPONSE; MICROELECTROMECHANICAL SYSTEMS; FINITE ELEMENT METHOD; ATTITUDE (INCLINATION); SHOCK LOADS; COMPUTERIZED SIMULATION
Author : United States. National Aeronautics and Space Administration
Publisher :
Page : 80 pages
File Size : 24,9 MB
Release : 2001
Category : Aeronautics
ISBN :
Author :
Publisher :
Page : 88 pages
File Size : 33,42 MB
Release : 2001-10
Category : Science
ISBN :
Author : Mohammad I. Younis
Publisher : Springer Science & Business Media
Page : 463 pages
File Size : 49,53 MB
Release : 2011-06-27
Category : Technology & Engineering
ISBN : 1441960201
MEMS Linear and Nonlinear Statics and Dynamics presents the necessary analytical and computational tools for MEMS designers to model and simulate most known MEMS devices, structures, and phenomena. This book also provides an in-depth analysis and treatment of the most common static and dynamic phenomena in MEMS that are encountered by engineers. Coverage also includes nonlinear modeling approaches to modeling various MEMS phenomena of a nonlinear nature, such as those due to electrostatic forces, squeeze-film damping, and large deflection of structures. The book also: Includes examples of numerous MEMS devices and structures that require static or dynamic modeling Provides code for programs in Matlab, Mathematica, and ANSYS for simulating the behavior of MEMS structures Provides real world problems related to the dynamics of MEMS such as dynamics of electrostatically actuated devices, stiction and adhesion of microbeams due to electrostatic and capillary forces MEMS Linear and Nonlinear Statics and Dynamics is an ideal volume for researchers and engineers working in MEMS design and fabrication.
Author : Yung-cheng Lee
Publisher : World Scientific
Page : 363 pages
File Size : 50,35 MB
Release : 2018-01-03
Category : Technology & Engineering
ISBN : 9813229373
MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices.This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability.
Author :
Publisher :
Page : 754 pages
File Size : 46,29 MB
Release : 2007
Category : Mechanics, Applied
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Author :
Publisher :
Page : 934 pages
File Size : 15,50 MB
Release : 1999
Category : Aeronautics
ISBN :
Author : Clarence W. de Silva
Publisher : CRC Press
Page : 1837 pages
File Size : 10,68 MB
Release : 2005-06-27
Category : Technology & Engineering
ISBN : 142003989X
Every so often, a reference book appears that stands apart from all others, destined to become the definitive work in its field. The Vibration and Shock Handbook is just such a reference. From its ambitious scope to its impressive list of contributors, this handbook delivers all of the techniques, tools, instrumentation, and data needed to model, analyze, monitor, modify, and control vibration, shock, noise, and acoustics. Providing convenient, thorough, up-to-date, and authoritative coverage, the editor summarizes important and complex concepts and results into “snapshot” windows to make quick access to this critical information even easier. The Handbook’s nine sections encompass: fundamentals and analytical techniques; computer techniques, tools, and signal analysis; shock and vibration methodologies; instrumentation and testing; vibration suppression, damping, and control; monitoring and diagnosis; seismic vibration and related regulatory issues; system design, application, and control implementation; and acoustics and noise suppression. The book also features an extensive glossary and convenient cross-referencing, plus references at the end of each chapter. Brimming with illustrations, equations, examples, and case studies, the Vibration and Shock Handbook is the most extensive, practical, and comprehensive reference in the field. It is a must-have for anyone, beginner or expert, who is serious about investigating and controlling vibration and acoustics.