Author : Charles A. Harper
Publisher : McGraw Hill Professional
Page : 692 pages
File Size : 45,83 MB
Release : 2002-04-10
Category : Education
ISBN : 9780071378826
Printed circuit history and overview. Development and fabrication of IC chips. Packaging of IC chips. Printed circuit board fabrication.
Author : Cheryl Tulkoff
Publisher : John Wiley & Sons
Page : 400 pages
File Size : 21,43 MB
Release : 2021-03-22
Category : Technology & Engineering
ISBN : 1119109388
An authoritative guide to optimizing design for manufacturability and reliability from a team of experts Design for Excellence in Electronics Manufacturing is a comprehensive, state-of-the-art book that covers design and reliability of electronics. The authors—noted experts on the topic—explain how using the DfX concepts of design for reliability, design for manufacturability, design for environment, design for testability, and more, reduce research and development costs and decrease time to market and allow companies to confidently issue warranty coverage. By employing the concepts outlined in Design for Excellence in Electronics Manufacturing, engineers and managers can increase customer satisfaction, market share, and long-term profits. In addition, the authors describe the best practices regarding product design and show how the practices can be adapted for different manufacturing processes, suppliers, use environments, and reliability expectations. This important book: Contains a comprehensive review of the design and reliability of electronics Covers a range of topics: establishing a reliability program, design for the use environment, design for manufacturability, and more Includes technical information on electronic packaging, discrete components, and assembly processes Shows how aspects of electronics can fail under different environmental stresses Written for reliability engineers, electronics engineers, design engineers, component engineers, and others, Design for Excellence in Electronics Manufacturing is a comprehensive book that reveals how to get product design right the first time.
Author : Phil Zarrow
Publisher : Pragma Media
Page : 278 pages
File Size : 30,84 MB
Release : 2020-02-27
Category : Technology & Engineering
ISBN : 9781732283688
BoardTalk had its humble beginnings as a SMT expert Q&A session with Phil Zarrow and Jim Hall at an SMTAI conference. Ten years and over 200 episodes later, the "Assembly Brothers - Pick and Place" have transcribed their informative discussions from CircuitInsight.com, where BoardTalk is streamed all over the world.
Author : Yong Liu
Publisher : Springer Science & Business Media
Page : 606 pages
File Size : 31,60 MB
Release : 2012-02-15
Category : Technology & Engineering
ISBN : 1461410533
Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.
Author : MIKE JUDD
Publisher : Elsevier
Page : 385 pages
File Size : 17,16 MB
Release : 1999-03-26
Category : Technology & Engineering
ISBN : 008051734X
Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use - Cleaning, faults, troubleshooting and standards are all major topics - Considers safety and solder process quality assessment
Author : Ronald Lasky
Publisher :
Page : pages
File Size : 34,58 MB
Release : 2014-01-01
Category :
ISBN : 9780988887312
Originally conceived as a supplement to the SMTA Certification Program, this book is a must-have reference manual for all process engineers working in the electronics industry as well as anyone just entering the industry. The book provides an in-depth understanding of the entire electronic assembly process. Chapter topics include soldering and materials, printed wiring boards, components, paste-print stencil, component placement, assembly line design and optimization, solder reflow, wave soldering, dispensing, and inspection and test.
Author : Elissa M. Bumiller
Publisher : CRC Press
Page : 236 pages
File Size : 30,73 MB
Release : 2002-11-12
Category : Technology & Engineering
ISBN : 1420040065
Contamination problems have become a major factor in determining the manufacturability, quality, and reliability of electronic assemblies. Understanding the mechanics and chemistry of contamination has become necessary for improving quality and reliability and reducing costs of electronic assemblies. Designed as a practical guide, Contamination of
Author : R. S. Khandpur
Publisher : McGraw Hill Professional
Page : 717 pages
File Size : 38,66 MB
Release : 2005-09-07
Category : Technology & Engineering
ISBN : 0071589252
The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.
Author : John Lau
Publisher : McGraw Hill Professional
Page : 710 pages
File Size : 14,35 MB
Release : 2002-08-23
Category : Technology & Engineering
ISBN : 9780071386241
An engineer's guidebook demonstrating non-toxic electronics manufacturing processes
Author : Bernard S. Matisoff
Publisher : Springer Science & Business Media
Page : 480 pages
File Size : 16,75 MB
Release : 2012-12-06
Category : Science
ISBN : 9401169799
The Handbook of Electronics Packaging Design and Engineering has been writ ten as a reference source for use in the packaging design of electronics equip ment. It is designed to provide a single convenient source for the solution of re curring design problems. The primary consideration of any design is that the end product meet or exceed the applicable product specifications. The judicious use of uniform design practices will realize the following economies and equipment improvements: • Economics of design. Uniform design practices will result in less engineering and design times and lower costs. They will also reduce the number of changes that may be required due to poor reliability, maintainability, or producibility. • Improved design. Better designs with increased reliability, maintainability, and producibility will result from the use of uniform design practices. • Production economies. Uniform designs employing standard available tools, materials, and parts will result in the cost control of manufacturing. The Handbook is intended primarily for the serious student of electronics packaging and for those engineers and designers actively engaged in this vital and interesting profession. It attempts to present electronics packaging as it is today. It can be used as a training text for instructional purposes and as a reference source for the practicing designer and engineer.
