Embedded Cooling Of Electronic Devices: Conduction, Evaporation, And Single- And Two-phase Convection


Book Description

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.




Embedded Cooling of Electronic Devices: Conduction, Evaporation, and Single- And Two-Phase Convection


Book Description

This book is a comprehensive guide on emerging cooling technologies for processors in microelectronics. It covers various topics such as chip-embedded two-phase cooling, monolithic microfluidic cooling, numerical modeling, and advances in materials engineering for conduction-limited direct contact cooling, with a goal to remedy high heat flux issues.The book also discusses the co-design of thermal and electromagnetic properties for the development of light and ultra-high efficiency electric motors. It provides an in-depth analysis of the scaling limits, challenges, and opportunities in embedded cooling, including high power RF amplifiers and self-emissive and liquid crystal displays. Its analysis of emerging cooling technologies provides a roadmap for the future of cooling technology in microelectronics.This book is a good starting point for the electrical and thermal engineers, as well as MS and PhD students, interested in understanding and collaboratively tackling the complex and multidisciplinary field of microelectronics device (embedded) cooling. A basic knowledge of heat conduction and convection is required.




Air Cooling Technology for Electronic Equipment


Book Description

Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.




Electronics Cooling


Book Description

Featuring contributions from the renowned researchers and academicians in the field, this book covers key conventional and emerging cooling techniques and coolants for electronics cooling. It includes following thematic topics: - Cooling approaches and coolants - Boiling and phase change-based technologies - Heat pipes-based cooling - Microchannels cooling systems - Heat loop cooling technology - Nanofluids as coolants - Theoretical development for the junction temperature of package chips. This book is intended to be a reference source and guide to researchers, engineers, postgraduate students, and academicians in the fields of thermal management and cooling technologies as well as for people in the electronics and semiconductors industries.




Liquid Cooling of Electronic Devices by Single-Phase Convection


Book Description

Channeling or controlling the heat generated by electronics products is a vital concern of product developers: fail to confront this issue and the chances of product failure escalate. This third book in the series explores yet another method of heat management-the use of liquids to absorb and remove heat away from vital parts of the electronic systems.




Cooling of Electronic Systems


Book Description

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.




Cooling of Electronic Equipment


Book Description







Transport Phenomena In Thermal Control


Book Description

A collection of research papers into transport phenomena in thermal control, closely related to several important aspects of cooling technology. Articles provide overviews of current advances and details of individual technologies including electronic and turbine cooling and Marangoni convection.




Emerging Two-Phase Cooling Technologies for Power Electronic Inverters


Book Description

In order to meet the Department of Energy's (DOE's) FreedomCAR and Vehicle Technologies (FVCT) goals for volume, weight, efficiency, reliability, and cost, the cooling of the power electronic devices, traction motors, and generators is critical. Currently the power electronic devices, traction motors, and generators in a hybrid electric vehicle (HEV) are primarily cooled by water-ethylene glycol (WEG) mixture. The cooling fluid operates as a single-phase coolant as the liquid phase of the WEG does not change to its vapor phase during the cooling process. In these single-phase systems, two cooling loops of WEG produce a low temperature (around 70 C) cooling loop for the power electronics and motor/generator, and higher temperature loop (around 105 C) for the internal combustion engine. There is another coolant option currently available in automobiles. It is possible to use the transmission oil as a coolant. The oil temperature exists at approximately 85 C which can be utilized to cool the power electronic and electrical devices. Because heat flux is proportional to the temperature difference between the device's hot surface and the coolant, a device that can tolerate higher temperatures enables the device to be smaller while dissipating the same amount of heat. Presently, new silicon carbide (SiC) devices and high temperature direct current (dc)-link capacitors, such as Teflon capacitors, are available but at significantly higher costs. Higher junction temperature (175 C) silicon (Si) dies are gradually emerging in the market, which will eventually help to lower hardware costs for cooling. The development of high-temperature devices is not the only way to reduce device size. Two-phase cooling that utilizes the vaporization of the liquid to dissipate heat is expected to be a very effective cooling method. Among two-phase cooling methods, different technologies such as spray, jet impingement, pool boiling and submersion, etc. are being developed. The Oak Ridge National Laboratory (ORNL) is leading the research on a novel floating refrigerant loop that cools high-power electronic devices and the motor/generator with very low cooling energy. The loop can be operated independently or attached to the air conditioning system of the vehicle to share the condenser and other mutually needed components. The ability to achieve low cooling energy in the floating loop is attributable to the liquid refrigerant operating at its hot saturated temperature (around 50 C+). In an air conditioning system, the liquid refrigerant is sub-cooled for producing cool air to the passenger compartment. The ORNL floating loop avoids the sub-cooling of the liquid refrigerant and saves significant cooling energy. It can raise the coefficient of performance (COP) more than 10 fold from that of the existing air-conditioning system, where the COP is the ratio of the cooled power and the input power for dissipating the cooled power. In order to thoroughly investigate emerging two-phase cooling technologies, ORNL subcontracted three university/companies to look into three leading two-phase cooling technologies. ORNL's assessments on these technologies are summarized in Section I. Detailed descriptions of the reports by the three university/companies (subcontractors) are in Section II.