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Final Report of Geothermal Energy and High-Performance Drilling Collaborative Research Program (gebo)

Author : Cuvillier Verlag

Publisher : Cuvillier Verlag

Page : 994 pages

File Size : 50,86 MB

Release : 2015-08-19

Category : Technology & Engineering

ISBN : 3736980809

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Book Description

The superior goal of the gebo research association was making important contributions for the future reliable drilling under the existing “hot-hard-rock” conditions in Niedersachsen and their development to the geothermal drillings with sustainable geological subsurface heat exchangers. This goal should be achieved due to the solid research and innovative technology approaches in their combination within one concept for pioneering methods in deep geothermal drillings in hard rock, to be more exact - in interdisciplinary cooperation on engineers and scientists - in cooperation between industry and University, researchers and users Gebo research association comprised scientists and technicians of different research institutions and universities who are working in 33 projects. The individual projects were assigned to one of the 4 main research fields or focus areas. Gebo research association started its activities with 7 project partners participating: - Technische Universität Braunschweig (TUBS) - Technische Universität Clausthal (TUC) - Gottfried Wilhelm Leibniz Universität Hannover (LUH) - Georg-August-Universität Göttingen (UGOE) - Leibniz-Institut für Angewandte Geophysik (LIAG) - Bundesanstalt für Geowissenschaften und Rohstoffe (BGR) - Energie-Forschungszentrum Niedersachsen (EFZN) Baker Hughes, an industrial partner, participated in the association and supplies it with its experience and additional funds.



Copper Wire Bonding

Author : Preeti S Chauhan

Publisher : Springer Science & Business Media

Page : 254 pages

File Size : 46,30 MB

Release : 2013-09-20

Category : Technology & Engineering

ISBN : 1461457610

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Book Description

This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components. In summary, this book: Introduces copper wire bonding technologies Presents copper wire bonding processes Discusses copper wire bonding metallurgies Covers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishes Covers the reliability tests and concerns Covers the current implementation of copper wire bonding in the electronics industry Features 120 figures and tables Copper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.



Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules

Author : Hsinjin Edwin Yang

Publisher : William Andrew

Page : 358 pages

File Size : 24,66 MB

Release : 2019-06-13

Category : Technology & Engineering

ISBN : 0128115467

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Book Description

Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules describes the durability and reliability behavior of polymers used in Si-photovoltaic modules and systems, particularly in terms of physical aging and degradation process/mechanisms, characterization methods, accelerated exposure chamber and testing, module level testing, and service life prediction. The book compares polymeric materials to traditional materials used in solar applications, explaining the degradation pathways of the different elements of a photovoltaic module, including encapsulant, front sheet, back sheet, wires and connectors, adhesives, sealants, and more. In addition, users will find sections on the tests needed for the evaluation of polymer degradation and aging, as well as accelerated tests to aid in materials selection. As demand for photovoltaics continues to grow globally, with polymer photovoltaics offering significantly lower production costs compared to earlier approaches, this book will serve as a welcome resource on new avenues. - Provides comprehensive coverage of photovoltaic polymers, from fundamental degradation mechanisms, to specific case studies of durability and materials failure - Offers practical, actionable information in relation to service life prediction of photovoltaic modules and accelerated testing for materials selection - Includes up-to-date information and interpretation of safety regulations and testing of photovoltaic modules and materials



Particle Technology and Textiles

Author : Jean Cornier

Publisher : Walter de Gruyter GmbH & Co KG

Page : 526 pages

File Size : 33,7 MB

Release : 2023-05-22

Category : Science

ISBN : 3110670771

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Book Description

Functionalization of material systems is one of the key developments nowadays in the textile industry, where particles are frequently used to enhance the properties of fibers and to add new functionalities. This book focuses on innovative textile materials and is a perfect guide for professionals in the textile industry and scientists alike. An overview of particle technology is provided before addressing all topics relevant to particle-enhanced textiles, i.e. the properties and application of micro/nanoparticles in textiles, production techniques, safety, as well as regulatory and intellectual property aspects. The book covers the composition and applications of various types of textile fillers, finishings, and microfibers. gives an outlook on future trends and challenges in the research, development, and production of nano- and micro-enabled textiles. The authors of the book, who are leading experts in their fields, address many aspects relevant to the use of particle-enhanced textiles in industrial applications as well as in our daily life. A particular emphasis is put on practical examples of applications and products, safety and sustainability issues and the potential for further innovation. This book should bring inspiration for textile scientists in using particles for improving textiles and further expanding their possibilities of use.



Advanced Concepts in Mechanical Engineering I

Author : Ioan Doroftei

Publisher : Trans Tech Publications Ltd

Page : 759 pages

File Size : 25,97 MB

Release : 2014-10-01

Category : Technology & Engineering

ISBN : 3038266558

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Book Description

Selected, peer reviewed papers from a Collection of Papers from the 6th International Conference on Advanced Concepts in Mechanical Engineering (ACME 2014), June 12-13, 2014, Iasi, Romania



Reliability of Organic Compounds in Microelectronics and Optoelectronics

Author : Willem Dirk van Driel

Publisher : Springer Nature

Page : 552 pages

File Size : 50,4 MB

Release : 2022-01-31

Category : Technology & Engineering

ISBN : 3030815765

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Book Description

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems.



Science and Materials Engineering IV

Author : Jesús García-Serrano

Publisher : Trans Tech Publications Ltd

Page : 275 pages

File Size : 33,93 MB

Release : 2014-06-30

Category : Technology & Engineering

ISBN : 303826539X

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Book Description

Selected, peer reviewed papers from the Fourth National Congress of Science and Materials Engineering (CNCIM 2013), February 22-28, 2013, Pachuca, México



Photovoltaic Modules

Author : Harry Wirth

Publisher : Walter de Gruyter GmbH & Co KG

Page : 224 pages

File Size : 44,76 MB

Release : 2016-09-12

Category : Technology & Engineering

ISBN : 3110348284

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Book Description

Photovoltaic Modules: Technology and Reliability provides unique insights into concepts, material design strategies, manufacturing techniques, quality and service life analysis of wafer-based photovoltaic modules. Taking an interdisciplinary approach, the authors focus on two main topics. Part I – Crystalline Silicone Module Technology offers photovoltaics fundamentals: solar cell properties, module design, materials and production, basic module characterization, module power as well as efficiency and module performance. Part II, on the other hand, illustrates the state-of-the-art of module reliability by characterization of modules and degradation effects, examination of PV-Module loads, accelerated aging tests as well as reliability testing of materials and modules. A separate chapter is dedicated to PV module and component certification.



Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Author : E-H Wong

Publisher : Woodhead Publishing

Page : 477 pages

File Size : 25,38 MB

Release : 2015-05-23

Category : Technology & Engineering

ISBN : 0857099116

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Book Description

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study



Security Breaches and Threat Prevention in the Internet of Things

Author : Jeyanthi, N.

Publisher : IGI Global

Page : 290 pages

File Size : 31,96 MB

Release : 2017-02-01

Category : Computers

ISBN : 1522522972

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Book Description

As the applications of the Internet of Things continue to progress, so do the security concerns for this technology. The study of threat prevention in the Internet of Things is necessary, as security breaches in this field can ruin industries and lives. Security Breaches and Threat Prevention in the Internet of Things provides a comprehensive examination of the latest strategies and methods for tracking and blocking threats within industries that work heavily with this technology. Featuring chapters on emerging topics such as security threats in autonomous vehicles, digital forensics, secure communications, and image encryption, this critical reference source is a valuable tool for all academicians, graduate students, practitioners, professionals, and researchers who are interested in expanding their knowledge of security practices pertaining to the Internet of Things.