Etching of Crystals


Book Description

Defects in Solids, Volume 15: Etching of Crystals: Theory, Experiment, and Application focuses on the processes, reactions, and methodologies involved in the etching of crystals, including thermodynamics and diffusion. The publication first underscores the defects in crystals, detection of defects, and growth and dissolution of crystals. Discussions focus on thermodynamic theories, nature of pit sites, surface roughening during diffusion-controlled dissolution, growth controlled by simultaneous mass transfer and surface reactions, and chemical and thermal etching. The text then examines the theories of dissolution and etch-pit formation and the chemical aspects of the dissolution process, including catalytic reactions, dissolution of semiconductors, topochemical adsorption theories, and diffusion theories. The book tackles the solubility of crystals and complexes in solution and the kinetics and mechanism of dissolution. Topics include metallic crystals, semiconductors, stability of complexes, relationship between solubility, surface energy, and hardness of crystals, and solvents for crystals and estimation of crystal solubility in solvents other than water. The publication is a dependable source of data for readers interested in the etching of crystals.







Etching of Crystals


Book Description

Defects in Solids, Volume 15: Etching of Crystals: Theory, Experiment, and Application focuses on the processes, reactions, and methodologies involved in the etching of crystals, including thermodynamics and diffusion. The publication first underscores the defects in crystals, detection of defects, and growth and dissolution of crystals. Discussions focus on thermodynamic theories, nature of pit sites, surface roughening during diffusion-controlled dissolution, growth controlled by simultaneous mass transfer and surface reactions, and chemical and thermal etching. The text then examines the theories of dissolution and etch-pit formation and the chemical aspects of the dissolution process, including catalytic reactions, dissolution of semiconductors, topochemical adsorption theories, and diffusion theories. The book tackles the solubility of crystals and complexes in solution and the kinetics and mechanism of dissolution. Topics include metallic crystals, semiconductors, stability of complexes, relationship between solubility, surface energy, and hardness of crystals, and solvents for crystals and estimation of crystal solubility in solvents other than water. The publication is a dependable source of data for readers interested in the etching of crystals.




Silicon Chemical Etching


Book Description

In the first contribution to this volume we read that the world-wide production of single crystal silicon amounts to some 2000 metric tons per year. Given the size of present-day silicon-crystals, this number is equivalent to 100000 silicon-crystals grown every year by either the Czochralski (80%) or the floating-zone (20%) technique. But, to the best of my knowledge, no coherent and comprehensive article has been written that deals with "the art and science", as well as the practical and technical aspects of growing silicon crystals by the Czochralski technique. The same could be said about the floating-zone technique were it not for the review article by W. Dietze, W. Keller and A. Miihlbauer which was published in the preceding Volume 5 ("Silicon") of this series (and for a monograph by two of the above authors published about the same time). As editor of this volume I am very glad to have succeeded in persuading two scien tists, W. Zulehner and D. Huber, of Wacker-Chemitronic GmbH - the world's largest producer of silicon-crystals - to write a comprehensive article about the practical and scientific aspects of growing silicon-crystals by the Czochralski method and about silicon wafer manufacture. I am sure that many scientists or engineers who work with silicon crystals -be it in the laboratory or in a production environment - will profit from the first article in this volume.










Studies of Ice Etching


Book Description

Thermal etching of ice and its application to the investigation of surface abrasion in ice crystals is explained. Investigations of surface abrasion in ice crystals provide fundamental information in the study of snow and ice friction. The technique of producing evaporation etch pits by the application of Formvar film to the ice crystal surface is described, and the development of microcrystals by recrystallization is compared with the surrounding mother crystals. Experimental data are presented and discussed with emphasis on the development of thermal etch pits, scratches on different crystal faces, damage to the prismatic face, thermal etch channels on the basal plane, predominant orientation of etch channels on the basal plane, and etch-pit-free zones and stress concentrations around solid inclusions. (Author).