Ge/SiGe Quantum Well Waveguide Modulator for Optical Interconnect Systems


Book Description

Thanks to the development of silicon VLSI technology over the past several decades, we can now integrate far more transistors onto a single chip than ever before. However, this also imposes more stringent requirements, in terms of bandwidth, density, and power consumption, on the interconnect systems that link transistors. The interconnect system is currently one of the major hurdles for the further advancement of the electronic technology. Optical interconnect is considered a promising solution to overcome the interconnect bottleneck. The quantum-confined Stark effect in Ge/SiGe quantum well system paves the way to realize efficient optical modulation on Si in a fully CMOS compatible fashion. In this dissertation, we investigate the integration of Ge/SiGe quantum well waveguide modulators with silicon-on-insulator waveguides. For the first time, we demonstrate the selective epitaxial growth of Ge/SiGe quantum well structures on patterned Si substrates. The selective epitaxy exhibits perfect selectivity and minimal pattern sensitivity. Compared to their counterparts made using bulk epitaxy, the p-i-n diodes from selective epitaxy demonstrate very low reverse leakage current and high reverse breakdown voltage. Strong quantum-confined Stark effect (QCSE) is, for the first time, demonstrated in this material system in the telecommunication C-band at room temperature. A 3 dB optical modulation bandwidth of 2.8 THz is measured, covering more than half of the C-band. We propose, analyze, and experimentally demonstrate a novel approach to realize butt coupling between a SOI waveguide and a selectively grown Ge/SiGe quantum well waveguide modulator using a thin dielectric spacer. Through numerical simulation, we show that the insertion loss penalty for a thin 20 nm thick spacer can be as low as 0.13 dB. Such a quantum well waveguide modulator with a footprint of 8 [Mu]m2 has also been fabricated, demonstrating 3.2 dB modulation contrast with merely 1V swing at a speed of 16 Gpbs.




Electroabsorption Mechanisms in Germanium Quantum Well Material


Book Description

One possible solution to make viable optoelectronic modulators that meet strict targets down to the scale of on-chip communication is to use germanium-rich materials. Ge/SiGe quantum wells grown on silicon substrates provide the strongest mechanism, the quantum-confined Stark effect (QCSE), and thereby can meet the strictest requirements for optical interconnects, including CMOS-compatibility. Using such a strong effect, Ge-based modulators can be ultra-compact, ultralow-power, large bandwidth and high-speed, making them a strong contender for the future of optoelectronic device integration to solve the bottleneck problem. In this thesis, we will discuss the physical properties of the Ge and SiGe material system then present designs of optoelectronic modulators at the important 1310 nm and 1550 nm communication wavelengths using a program we developed called the Simple Quantum Well Electroabsorption Calculator (SQWEAC). SQWEAC takes the important physical mechanisms present, such as QCSE and indirect absorption, to predict the electroabsorption profile of Ge-based quantum wells. QCSE was experimentally determined on a wide range of samples to show the predictive powers of SQWEAC. Additionally, indirect absorption was also experimentally determined to optimize the physical model for these Ge quantum well devices. In being able to design both 1310 nm and 1550 nm devices using this Ge material system, we provide a platform for designing optoelectronic devices that are Si CMOS compatible and operate over a wide range of wavelengths. These modulators have the capability of providing the large density of information at very low energies per bit required for future interconnect technologies.




Handbook of Silicon Photonics


Book Description

The development of integrated silicon photonic circuits has recently been driven by the Internet and the push for high bandwidth as well as the need to reduce power dissipation induced by high data-rate signal transmission. To reach these goals, efficient passive and active silicon photonic devices, including waveguide, modulators, photodetectors,




Advanced Materials for Integrated Optical Waveguides


Book Description

This book provides a comprehensive introduction to integrated optical waveguides for information technology and data communications. Integrated coverage ranges from advanced materials, fabrication, and characterization techniques to guidelines for design and simulation. A concluding chapter offers perspectives on likely future trends and challenges. The dramatic scaling down of feature sizes has driven exponential improvements in semiconductor productivity and performance in the past several decades. However, with the potential of gigascale integration, size reduction is approaching a physical limitation due to the negative impact on resistance and inductance of metal interconnects with current copper-trace based technology. Integrated optics provides a potentially lower-cost, higher performance alternative to electronics in optical communication systems. Optical interconnects, in which light can be generated, guided, modulated, amplified, and detected, can provide greater bandwidth, lower power consumption, decreased interconnect delays, resistance to electromagnetic interference, and reduced crosstalk when integrated into standard electronic circuits. Integrated waveguide optics represents a truly multidisciplinary field of science and engineering, with continued growth requiring new developments in modeling, further advances in materials science, and innovations in integration platforms. In addition, the processing and fabrication of these new devices must be optimized in conjunction with the development of accurate and precise characterization and testing methods. Students and professionals in materials science and engineering will find Advanced Materials for Integrated Optical Waveguides to be an invaluable reference for meeting these research and development goals.




Integrated Interconnect Technologies for 3D Nanoelectronic Systems


Book Description

This cutting-edge book on off-chip technologies puts the hottest breakthroughs in high-density compliant electrical interconnects, nanophotonics, and microfluidics at your fingertips, integrating the full range of mathematics, physics, and technology issues together in a single comprehensive source. You get full details on state-of-the-art I/O interconnects and packaging, including mechanically compliant I/O approaches, fabrication, and assembly, followed by the latest advances and applications in power delivery design, analysis, and modeling. The book explores interconnect structures, materials, and packages for achieving high-bandwidth off-chip electrical communication, including optical interconnects and chip-to-chip signaling approaches, and brings you up to speed on CMOS integrated optical devices, 3D integration, wafer stacking technology, and through-wafer interconnects.




High Speed, Low Driving Voltage Vertical Cavity Germanium-silicon Modulators for Optical Interconnect


Book Description

Information processing requires interconnects to carry information from one place to another. Optical interconnects between electronics systems have attracted significant attention and development for a number of years because optical links have demonstrated potential advantages for high-speed, low-power, and interference immunity. With increasing system speed and greater bandwidth requirements, the distance over which optical communication is useful has continually decreased to chip-to-chip and on-chip levels. Monolithic integration of photonics and electronics will significantly reduce the cost of optical components and further combine the functionalities of chips on the same or different boards or systems. Modulators are one of the fundamental building blocks for optical interconnects. Previous work demonstrated modulators based upon the quantum confined Stark effect (QCSE) in SiGe p-i-n devices with strained Ge/SiGe multi-quantum-well (MQW) structures in the i region. While the previous work demonstrated the effect, it did not examine the high-speed aspects of the device, which is the focus of this dissertation. High-speed modulation and low driving voltage are the keys for the device's practical use. At lower optical intensity operation, the ultimate limitation in speed will be the RC time constant of the device itself. At high optical intensity, the large number of photo generated carriers in the MQW region will limit the performance of the device through photo carrier related voltage drop and exciton saturation. In previous work, the devices consist of MQWs configured as p-i-n diodes. The electric field induced absorption change by QCSE modulates the optical transmission of the device. The focus of this thesis is the optimization of MQW material deposition, minimization of the parasitic capacitance of the probe pads for high speed, low voltage and high contrast ratio operation. The design, fabrication and high-speed characterization of devices of different sizes, with different bias voltages are presented. The device fabrication is based on processes for standard silicon electronics and is suitable for mass-production. This research will enable efficient transceivers to be monolithically integrated with silicon chips for high-speed optical interconnects. We demonstrated a modulator, with an eye diagram of 3.125GHz, a small driving voltage of 2.5V and an f3dB bandwidth greater than 30GHz. Carrier dynamics under ultra-fast laser excitation and high-speed photocurrent response are also investigated.




Handbook of Conducting Polymers, Fourth Edition - 2 Volume Set


Book Description

In the last 10 years there have been major advances in fundamental understanding and applications and a vast portfolio of new polymer structures with unique and tailored properties was developed. Work moved from a chemical repeat unit structure to one more based on structural control, new polymerization methodologies, properties, processing, and applications. The 4th Edition takes this into account and will be completely rewritten and reorganized, focusing on spin coating, spray coating, blade/slot die coating, layer-by-layer assembly, and fiber spinning methods; property characterizations of redox, interfacial, electrical, and optical phenomena; and commercial applications.




Conjugated Polymers


Book Description

This book covers properties, processing, and applications of conducting polymers. It discusses properties and characterization, including photophysics and transport. It then moves to processing and morphology of conducting polymers, covering such topics as printing, thermal processing, morphology evolution, conducting polymer composites, thin films




Fibre Optic Communication Devices


Book Description

Optoelectronic devices and fibre optics are the basis of cutting-edge communication systems. This monograph deals with the various components of these systems, including lasers, amplifiers, modulators, converters, filters, sensors, and more.




75th Anniversary of the Transistor


Book Description

75th Anniversary of the Transistor 75th anniversary commemorative volume reflecting the transistor's development since inception to current state of the art 75th Anniversary of the Transistor is a commemorative anniversary volume to celebrate the invention of the transistor. The anniversary volume was conceived by the IEEE Electron Devices Society (EDS) to provide comprehensive yet compact coverage of the historical perspectives underlying the invention of the transistor and its subsequent evolution into a multitude of integration and manufacturing technologies and applications. The book reflects the transistor's development since inception to the current state of the art that continues to enable scaling to very large-scale integrated circuits of higher functionality and speed. The stages in this evolution covered are in chronological order to reflect historical developments. Narratives and experiences are provided by a select number of venerated industry and academic leaders, and retired veterans, of the semiconductor industry. 75th Anniversary of the Transistor highlights: Historical perspectives of the state-of-the-art pre-solid-state-transistor world (pre-1947) leading to the invention of the transistor Invention of the bipolar junction transistor (BJT) and analytical formulations by Shockley (1948) and their impact on the semiconductor industry Large scale integration, Moore's Law (1965) and transistor scaling (1974), and MOS/LSI, including flash memories — SRAMs, DRAMs (1963), and the Toshiba NAND flash memory (1989) Image sensors (1986), including charge-coupled devices, and related microsensor applications With comprehensive yet succinct and accessible coverage of one of the cornerstones of modern technology, 75th Anniversary of the Transistor is an essential reference for engineers, researchers, and undergraduate students looking for historical perspective from leaders in the field.