Heat Transfer by a Multiple Array of Round Jets Impinging Perpendicular to a Concave Surface


Book Description

An experimental investigation was undertaken to study jet impingement cooling of a semi-cylindrical concave surface in a semi-enclosed environment. The investigation showed that it was possible to obtain a correlating formula for the various parameters involved. The effect of jet 'spent air' on heat transfer was also observed. The results are compared with those of Kercher and Tabakoff who carried out a similar investigation using a flat plate. (Author).







ASME 69-GT-4


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NASA Technical Paper


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Advances in Heat Transfer


Book Description

Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry







Experimental Methods in Heat Transfer and Fluid Mechanics


Book Description

Experimental Methods in Heat Transfer and Fluid Mechanics focuses on how to analyze and solve the classic heat transfer and fluid mechanics measurement problems in one book. This work serves the need of graduate students and researchers looking for advanced measurement techniques for thermal, flow, and heat transfer engineering applications. The text focuses on analyzing and solving classic heat transfer and fluid mechanics measurement problems, emphasizing fundamental principles, measurement techniques, data presentation, and uncertainty analysis. Overall, the text builds a strong and practical background for solving complex engineering heat transfer and fluid flow problems. Features Provides students with an understandable introduction to thermal-fluid measurement Covers heat transfer and fluid mechanics measurements from basic to advanced methods Explains and compares various thermal-fluid experimental and measurement techniques Uses a step-by-step approach to explaining key measurement principles Gives measurement procedures that readers can easily follow and apply in the lab




Jet Array Impingement with Crossflow - Correlation of Streamwise Resolved Flow and Heat Transfer Distributions


Book Description

Correlations for heat transfer coefficients for jets of circular offices and impinging on a surface parallel to the jet orifice plate are presented. The air, following impingement, is constrained to exit in a single direction along the channel formed by the jet orifice plate and the heat transfer (impingement) surface. The downstream jets are subjected to a crossflow originating from the upstream jets. Impingement surface heat transfer coefficients resolved to one streamwise jet orifice spacing, averaged across the channel span, are correlated with the associated individual spanwise orifice row jet and crossflow velocities, and with the geometric parameters. (NTRL site)




Cooling of Electronic Systems


Book Description

Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.