Heat transfer in data centers, volume II
Author : Chengbin Zhang
Publisher : Frontiers Media SA
Page : 89 pages
File Size : 10,49 MB
Release : 2023-03-24
Category : Technology & Engineering
ISBN : 2832507484
Author : Chengbin Zhang
Publisher : Frontiers Media SA
Page : 89 pages
File Size : 10,49 MB
Release : 2023-03-24
Category : Technology & Engineering
ISBN : 2832507484
Author : Yogendra Joshi
Publisher : Springer Science & Business Media
Page : 635 pages
File Size : 42,44 MB
Release : 2012-03-20
Category : Science
ISBN : 1441971246
Energy Efficient Thermal Management of Data Centers examines energy flow in today's data centers. Particular focus is given to the state-of-the-art thermal management and thermal design approaches now being implemented across the multiple length scales involved. The impact of future trends in information technology hardware, and emerging software paradigms such as cloud computing and virtualization, on thermal management are also addressed. The book explores computational and experimental characterization approaches for determining temperature and air flow patterns within data centers. Thermodynamic analyses using the second law to improve energy efficiency are introduced and used in proposing improvements in cooling methodologies. Reduced-order modeling and robust multi-objective design of next generation data centers are discussed.
Author : Ephraim M. Sparrow
Publisher : Academic Press
Page : 396 pages
File Size : 12,18 MB
Release : 2018-11-07
Category : Technology & Engineering
ISBN : 0128155264
Advances in Heat Transfer, Volume 50, provides in-depth review articles from a broader scope than in traditional journals or texts, with this comprehensive release covering chapters on Heat Transfer in Rotating Channels, Advances in Liquid Metal Science and Technology in Chip Cooling and Thermal Management, Heat Transfer in Rotating Cooling Channel, Anomalous Heat Transfer: Examples, Fundamentals, and Fractional Calculus Models, and much more. - Fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in traditional journals or texts - Essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, or in graduate schools or industry
Author :
Publisher : World Scientific
Page : 1397 pages
File Size : 40,47 MB
Release : 2014-10-23
Category : Technology & Engineering
ISBN : 9814520241
remove This Encyclopedia comes in 3 sets. To check out Set 1 and Set 3, please visit Set 1: Thermal Packaging Techniques and Set 3: Thermal Packaging Applications /remove Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.
Author : John R Thome
Publisher : World Scientific
Page : 1460 pages
File Size : 13,60 MB
Release : 2018-03-13
Category : Technology & Engineering
ISBN : 9813227427
Set III of this encyclopedia is a new addition to the previous Sets I and II. It contains 26 invited chapters from international specialists on the topics of numerical modeling of two-phase flows and evaporation, fundamentals of evaporation and condensation in microchannels and macrochannels, development and testing of micro two-phase cooling systems for electronics, and various special topics (surface wetting effects, microfin tubes, two-phase flow vibration across tube bundles). The chapters are written both by renowned university researchers and by well-known engineers from leading corporate research laboratories. Numerous 'must read' chapters cover the fundamentals of research and engineering practice on boiling, condensation and two-phase flows, two-phase heat transfer equipment, electronics cooling systems, case studies and so forth. Set III constitutes a 'must have' reference together with Sets I and II for thermal engineering researchers and practitioners.
Author : W. Minkowycz
Publisher : CRC Press
Page : 421 pages
File Size : 27,48 MB
Release : 2018-12-13
Category : Science
ISBN : 135146826X
This volume discusses the advances in numerical heat transfer modeling by applying high-performance computing resources, striking a balance between generic fundamentals, specific fundamentals, generic applications, and specific applications.
Author : Hwaiyu Geng
Publisher : John Wiley & Sons
Page : 720 pages
File Size : 50,30 MB
Release : 2014-12-22
Category : Computers
ISBN : 1118436636
Provides the fundamentals, technologies, and best practices in designing, constructing and managing mission critical, energy efficient data centers Organizations in need of high-speed connectivity and nonstop systems operations depend upon data centers for a range of deployment solutions. A data center is a facility used to house computer systems and associated components, such as telecommunications and storage systems. It generally includes multiple power sources, redundant data communications connections, environmental controls (e.g., air conditioning, fire suppression) and security devices. With contributions from an international list of experts, The Data Center Handbook instructs readers to: Prepare strategic plan that includes location plan, site selection, roadmap and capacity planning Design and build "green" data centers, with mission critical and energy-efficient infrastructure Apply best practices to reduce energy consumption and carbon emissions Apply IT technologies such as cloud and virtualization Manage data centers in order to sustain operations with minimum costs Prepare and practice disaster reovery and business continuity plan The book imparts essential knowledge needed to implement data center design and construction, apply IT technologies, and continually improve data center operations.
Author : Ali Cemal Benim
Publisher : Springer Nature
Page : 742 pages
File Size : 48,52 MB
Release :
Category :
ISBN : 3031666097
Author : L S Tong
Publisher : Routledge
Page : 394 pages
File Size : 13,80 MB
Release : 2018-05-04
Category : Science
ISBN : 1351463365
Completely updated, this graduate text describes the current state of boiling heat transfer and two-phase flow, in terms through which students can attain a consistent understanding. Prediction of real or potential boiling heat transfer behaviour, both in steady and transient states, is covered to aid engineering design of reliable and effective systems.
Author : Zhaojun Wang
Publisher : Springer Nature
Page : 931 pages
File Size : 43,29 MB
Release : 2020-03-19
Category : Technology & Engineering
ISBN : 9811395241
This book presents selected papers from the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019), with a focus on HVAC techniques for improving indoor environment quality and the energy efficiency of heating and cooling systems. Presenting inspiration for implementing more efficient and safer HVAC systems, the book is a valuable resource for academic researchers, engineers in industry, and government regulators.