Advanced RF MEMS


Book Description

An up-to-date guide to the theory and applications of RF MEMS. With detailed information about RF MEMS technology as well as its reliability and applications, this is a comprehensive resource for professionals, researchers, and students alike. • Reviews RF MEMS technologies • Illustrates new techniques that solve long-standing problems associated with reliability and packaging • Provides the information needed to incorporate RF MEMS into commercial products • Describes current and future trends in RF MEMS, providing perspective on industry growth • Ideal for those studying or working in RF and microwave circuits, systems, microfabrication and manufacturing, production management and metrology, and performance evaluation







Mechanical resonator for hermeticity evaluation of RF MEMS wafer–level packages


Book Description

Master's Thesis from the year 2002 in the subject Electrotechnology, grade: 1.0 (A), University of Applied Sciences Berlin (FB1), language: English, abstract: Common test standards for evaluating the hermeticity of microsystem packages are unsuitable for small MEMS-devices. It is the task of this Master thesis to create a universal test device to measure and to compare the hermeticities of different wafer-level packaging concepts, especially for RF MEMS devices. Resonator structures were found to be most suitable to measure low pressures and low pressure changes over time, due to the high sensitivity of their Q-value to the pressure in the cavity. The resonators are electrostatically actuated by using a novel coupling concept of the excitation voltage. The detection of the resonator movement is done by laser-interferometry. Sensors fulfilling the specific demands were designed, simulated and fabricated in the cleanroom. The fabrication process is based on SOI (Silicon On Insulator) wafers. Finally, the sensors were evaluated and characterized. A suitable resonator with a length of 500 μm reaches a Q-factor of 8070, at an ambient pressure of 0,02 mbar, and a resonance frequency of 36329 Hz. The sensitivity of the Q-value to pressure change is 4000 %/mbar at 0,02 mbar. This work was carried out within the Summit RF MEMS project, a collaborative project involving Ericsson, the Royal Institute of Technology-S3, Acreo and Saab Ericsson Space.




RF MEMS and Their Applications


Book Description

Microelectromechanical systems (MEMS) refer to a collection of micro-sensors and actuators, which can react to environmental change under micro- circuit control. The integration of MEMS into traditional Radio Frequency (RF) circuits has resulted in systems with superior performance levels and lower manufacturing costs. The incorporation of MEMS based fabrication technologies into micro and millimeter wave systems offers viable routes to ICs with MEMS actuators, antennas, switches and transmission lines. The resultant systems operate with an increased bandwidth and increased radiation efficiency and have considerable scope for implementation within the expanding area of wireless personal communication devices. This text provides leading edge coverage of this increasingly important area and highlights the overlapping information requirements of the RF and MEMS research and development communities. * Provides an introduction to micromachining techniques and their use in the fabrication of micro switches, capacitors and inductors * Includes coverage of MEMS devices for wireless and Bluetooth enabled systems Essential reading for RF Circuit design practitioners and researchers requiring an introduction to MEMS technologies, as well as practitioners and researchers in MEMS and silicon technology requiring an introduction to RF circuit design.




Practical Guide to RF-MEMS


Book Description

Closes the gap between hardcore-theoretical and purely experimental RF-MEMS books. The book covers, from a practical viewpoint, the most critical steps that have to be taken in order to develop novel RF-MEMS device concepts. Prototypical RF-MEMS devices, both including lumped components and complex networks, are presented at the beginning of the book as reference examples, and these are then discussed from different perspectives with regard to design, simulation, packaging, testing, and post-fabrication modeling. Theoretical concepts are introduced when necessary to complement the practical hints given for all RF-MEMS development stages. Provides researchers and engineers with invaluable practical hints on how to develop novel RF-MEMS device concepts Covers all critical steps, dealing with design, simulation, optimization, characterization and fabrication of MEMS for radio-frequency applications Addresses frequently disregarded issues, explicitly treating the hard to predict interplay between the three-dimensional device structure and its electromagnetic functionality Bridges theory and experiment, fundamental concepts are introduced with the application in mind, and simulation results are validated against experimental results Appeals to the practice-oriented R&D reader: design and simulation examples are based on widely known software packages such as ANSYS and the hardware description language Verilog.




Wafer Level Micropackaging for RF MEMS Switches


Book Description

Wafer-level micro-encapsulation is an innovative, low-cost, wafer-level packaging method for encapsulating RF MEMS switches. This zero-level packaging technique has demonstrated 0.04 dB package insertion loss at 35 GHz. This article overviews the processes, measurements, and testing methods used for determining the integrity and performance of individual encapsulated RF MEMS packages.










RF MEMS


Book Description

Ultrasmall Radio Frequency and Micro-wave Microelectromechanical systems (RF MEMs), such as switches, varactors, and phase shifters, exhibit nearly zero power consumption or loss. For this reason, they are being developed intensively by corporations worldwide for use in telecommunications equipment. This book acquaints readers with the basics of RF MEMs and describes how to design practical circuits and devices with them. The author, an acknowledged expert in the field, presents a range of real-world applications and shares many valuable tricks of the trade.