Author : Chulwoo Kim
Publisher : Springer Science & Business Media
Page : 94 pages
File Size : 36,36 MB
Release : 2013-10-27
Category : Technology & Engineering
ISBN : 3319023810
This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
Author : Jürgen Becker
Publisher : Springer
Page : 1226 pages
File Size : 14,6 MB
Release : 2004-08-11
Category : Computers
ISBN : 3540301178
This book contains the papers presented at the 14th International Conference on Field Programmable Logic and Applications (FPL) held during August 30th- September 1st 2004. The conference was hosted by the Interuniversity Micro- Electronics Center (IMEC) in Leuven, Belgium. The FPL series of conferences was founded in 1991 at Oxford University (UK), and has been held annually since: in Oxford (3 times), Vienna, Prague, Darmstadt, London, Tallinn, Glasgow, Villach, Belfast, Montpellier and Lisbon. It is the largest and oldest conference in reconfigurable computing and brings together academic researchers, industry experts, users and newcomers in an informal, welcoming atmosphere that encourages productive exchange of ideas and knowledge between the delegates. The fast and exciting advances in field programmable logic are increasing steadily with more and more application potential and need. New ground has been broken in architectures, design techniques, (partial) run-time reconfiguration and applications of field programmable devices in several different areas. Many of these recent innovations are reported in this volume. The size of the FPL conferences has grown significantly over the years. FPL in 2003 saw 216 papers submitted. The interest and support for FPL in the programmable logic community continued this year with 285 scientific papers submitted, demonstrating a 32% increase when compared to the year before. The technical program was assembled from 78 selected regular papers, 45 additional short papers and 29 posters, resulting in this volume of proceedings. The program also included three invited plenary keynote presentations from Xilinx, Gilder Technology Report and Altera, and three embedded tutorials from Xilinx, the Universit ̈ at Karlsruhe (TH) and the University of Oslo.
Author : Martin Schoeberl
Publisher : Springer
Page : 337 pages
File Size : 50,5 MB
Release : 2019-05-13
Category : Computers
ISBN : 3030186563
This book constitutes the proceedings of the 32nd International Conference on Architecture of Computing Systems, ARCS 2019, held in Copenhagen, Denmark, in May 2019. The 24 full papers presented in this volume were carefully reviewed and selected from 40 submissions. ARCS has always been a conference attracting leading-edge research outcomes in Computer Architecture and Operating Systems, including a wide spectrum of topics ranging from embedded and real-time systems all the way to large-scale and parallel systems. The selected papers are organized in the following topical sections: Dependable systems; real-time systems; special applications; architecture; memory hierarchy; FPGA; energy awareness; NoC/SoC. The chapter 'MEMPower: Data-Aware GPU Memory Power Model' is open access under a CC BY 4.0 license at link.springer.com.
Author : Jose Moreira
Publisher : Artech House
Page : 709 pages
File Size : 49,2 MB
Release : 2016-04-30
Category : Technology & Engineering
ISBN : 1608079864
This second edition of An Engineer's Guide to Automated Testing of High-Speed Interfaces provides updates to reflect current state-of-the-art high-speed digital testing with automated test equipment technology (ATE). Featuring clear examples, this one-stop reference covers all critical aspects of automated testing, including an introduction to high-speed digital basics, a discussion of industry standards, ATE and bench instrumentation for digital applications, and test and measurement techniques for characterization and production environment. Engineers learn how to apply automated test equipment for testing high-speed digital I/O interfaces and gain a better understanding of PCI-Express 4, 100Gb Ethernet, and MIPI while exploring the correlation between phase noise and jitter. This updated resource provides expanded material on 28/32 Gbps NRZ testing and wireless testing that are becoming increasingly more pertinent for future applications. This book explores the current trend of merging high-speed digital testing within the fields of photonic and wireless testing.
Author : Corey Gough
Publisher : Apress
Page : 347 pages
File Size : 29,29 MB
Release : 2015-04-07
Category : Computers
ISBN : 1430266384
Energy Efficient Servers: Blueprints for Data Center Optimization introduces engineers and IT professionals to the power management technologies and techniques used in energy efficient servers. The book includes a deep examination of different features used in processors, memory, interconnects, I/O devices, and other platform components. It outlines the power and performance impact of these features and the role firmware and software play in initialization and control. Using examples from cloud, HPC, and enterprise environments, the book demonstrates how various power management technologies are utilized across a range of server utilization. It teaches the reader how to monitor, analyze, and optimize their environment to best suit their needs. It shares optimization techniques used by data center administrators and system optimization experts at the world’s most advanced data centers.
Author :
Publisher :
Page : 852 pages
File Size : 21,3 MB
Release : 2000
Category : Patents
ISBN :
Author : Francesca Palumbo
Publisher : Springer Nature
Page : 380 pages
File Size : 31,57 MB
Release : 2023-09-15
Category : Computers
ISBN : 3031429214
This book constitutes the proceedings of the 19th International Symposium on Applied Reconfigurable Computing, ARC 2023, which was held in Cottbus, Germany, in September 2023. The 18 full papers presented in this volume were reviewed and selected from numerous submissions. The proceedings also contain 4 short PhD papers. The contributions were organized in topical sections as follows: Design methods and tools; applications; architectures; special session: near and in-memory computing; and PhD forum papers.
Author : José M. Laginha M. Palma
Publisher : Springer Science & Business Media
Page : 483 pages
File Size : 18,79 MB
Release : 2011-02-23
Category : Computers
ISBN : 3642193277
This book constitutes the thoroughly refereed post-conference proceedings of the 9th International Conference on High Performance Computing for Computational Science, VECPAR 2010, held in Berkeley, CA, USA, in June 2010. The 34 revised full papers presented together with five invited contributions were carefully selected during two rounds of reviewing and revision. The papers are organized in topical sections on linear algebra and solvers on emerging architectures, large-scale simulations, parallel and distributed computing, numerical algorithms.
Author : R. Bryant
Publisher : Springer Science & Business Media
Page : 435 pages
File Size : 11,18 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 3642954324
The papers in this book were presented at the Third Caltech Conference on Very Large Scale Integration, held March 21-23, 1983 in Pasadena, California. The conference was organized by the Computer Science Depart ment, California Institute of Technology, and was partly supported by the Caltech Silicon Structures Project. This conference focused on the role of systematic methodologies, theoretical models, and algorithms in all phases of the design, verification, and testing of very large scale integrated circuits. The need for such disciplines has arisen as a result of the rapid progress of integrated circuit technology over the past 10 years. This progress has been driven largely by the fabrica tion technology, providing the capability to manufacture very complex elec tronic systems reliably and at low cost. At this point the capability to manufac ture very large scale integrated circuits has exceeded our capability to develop new product designs quickly, reliably, and at a reasonable cost. As a result new designs are undertaken only if the production volume will be large enough to amortize high design costs, products first appear on the market well past their announced delivery date, and reference manuals must be amended to document design flaws. Recent research in universities and in private industry has created an emerg ing science of very large scale integration.
Author : Andrew .J
Publisher : Andrew .J
Page : 591 pages
File Size : 42,18 MB
Release : 2024-05-11
Category : Technology & Engineering
ISBN :
The semiconductor market refers to the industry involved in the design, development, manufacturing, and distribution of semiconductors, which are the building blocks of electronic devices. Semiconductors are materials with electrical conductivity between that of conductors (such as metals) and insulators (such as plastics). They are primarily made of silicon, although other materials like gallium arsenide, germanium, and indium phosphide are also used. The semiconductor market has experienced significant growth over the years due to the increasing demand for electronic devices and advancements in technology. The market is driven by various factors such as the growing demand of smartphones and mobile devices, the expansion of the automotive industry, the rise of Internet of Things (IoT) devices, and the development of emerging technologies like artificial intelligence (AI), virtual reality (VR), and autonomous vehicles, etc. To sum up, the semiconductor market is a dynamic and rapidly evolving industry that plays a critical role in shaping the modern technological landscape. Its growth is driven by advancements in various sectors, and it continues to be a key enabler of innovation and technological progress. The range of individual technological elements necessary for the semiconductor industry is extensive, leading to the publication of numerous technical books across various domains. (while it is understandable that advanced technologies specific to each company are not publicly disclosed due to concerns regarding potential leaks) These publications have undeniably played a significant role in aiding professionals and students for establishing a solid foundation of knowledge. In addition to the importance of individual technologies, it is necessary to examine what final products emerge as these technologies converge. While consumer electronics such as PCs and smartphones vary, there are common aspects among the semiconductor products that constitute them. Should one seek more comprehensive materials, it often entails a costly purchase of white paper. In this book, we aim to delve into a more in-depth discussion of the semiconductor market, with an emphasis on the product perspective. To accomplish this, we will extensively draw upon various academic and market resources. Additionally, in order to foster a comprehensive understanding of the market, it is necessary to have a certain level of familiarity with technical elements. Therefore, some technical explanations alongside the discussions is provided. In this book, we primarily focus on the FAB (Fabrication) domain. This book is divided into three major parts. Part 1 provides an overview of the semiconductor market, covering the definition, significance, supply chain structure, regional characteristics, challenges, and more within the semiconductor industry. Part 2, the major portion of this book, offers a comprehensive explanation of the most widely used types of semiconductor products. Particularly high market share products, notably Microcomponents, APs, and memory semiconductors, will have separate in-depth descriptions provided in the appendix. Finally, Part 3 will outline the general process by which these products are designed, focusing on a typical perspective, up to the stage just before Foundry.
