IEEE VLSI Test Symposium
Author :
Publisher :
Page : 498 pages
File Size : 11,17 MB
Release : 2005
Category : Application-specific integrated circuits
ISBN :
Author :
Publisher :
Page : 498 pages
File Size : 11,17 MB
Release : 2005
Category : Application-specific integrated circuits
ISBN :
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 458 pages
File Size : 29,49 MB
Release : 2001
Category : Computers
ISBN : 9780769511221
Collects 58 papers from the April/May 2001 symposium that explore new approaches in the testing of electronic circuits and systems. Key areas in testing are discussed, such as BIST, analog measurement, fault tolerance, diagnosis methods, scan chain design, memory test and diagnosis, and test data compression and compaction. Also on the program are sessions on emerging areas that are gaining prominence, including low power testing, testing high speed circuits on low cost testers, processor based self test techniques, and core- based system-on-chip testing. Some of the topics are robust and low cost BIST architectures for sequential fault testing in datapath multipliers, a method for measuring the cycle-to-cycle period jitter of high-frequency clock signals, fault equivalence identification using redundancy information and static and dynamic extraction, and test scheduling for minimal energy consumption under power constraints. No subject index. c. Book News Inc.
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 528 pages
File Size : 20,52 MB
Release : 2000
Category : Computers
ISBN : 9780769506135
Proceedings of a spring 2000 symposium, highlighting novel ideas and approaches to current and future problems related to testing of electronic circuits and systems. Themes are microprocessor test/validation, low power BIST and scan, technology trends, scan- related approaches, defect-driven techniques, and system-on-chip test techniques. Other subjects are analog test techniques, temperature and process drift issues, test compaction and design validation, analog BIST, and functional test and verification issues. Also covered are STIL extension, IDDQ test, and on-line testing and fault tolerance. Lacks a subject index. Annotation copyrighted by Book News, Inc., Portland, OR.
Author :
Publisher :
Page : 528 pages
File Size : 16,96 MB
Release : 1998
Category : Application-specific integrated circuits
ISBN :
Author :
Publisher : Institute of Electrical & Electronics Engineers(IEEE)
Page : 534 pages
File Size : 49,5 MB
Release : 1999
Category : Computers
ISBN : 9780769501468
The theme of the April 1999 symposium Scaling deeper to submicron: test technology challenges reflects the issues being created by the move toward nanometer technologies. Many creative and novel ideas and approaches to the current and future electronic circuit testing-related problems are explored
Author : Michael Nicolaidis
Publisher : Springer Science & Business Media
Page : 152 pages
File Size : 50,95 MB
Release : 2013-03-09
Category : Technology & Engineering
ISBN : 1475760698
Test functions (fault detection, diagnosis, error correction, repair, etc.) that are applied concurrently while the system continues its intended function are defined as on-line testing. In its expanded scope, on-line testing includes the design of concurrent error checking subsystems that can be themselves self-checking, fail-safe systems that continue to function correctly even after an error occurs, reliability monitoring, and self-test and fault-tolerant designs. On-Line Testing for VLSI contains a selected set of articles that discuss many of the modern aspects of on-line testing as faced today. The contributions are largely derived from recent IEEE International On-Line Testing Workshops. Guest editors Michael Nicolaidis, Yervant Zorian and Dhiraj Pradhan organized the articles into six chapters. In the first chapter the editors introduce a large number of approaches with an expanded bibliography in which some references date back to the sixties. On-Line Testing for VLSI is an edited volume of original research comprising invited contributions by leading researchers.
Author : Krzysztof Iniewski
Publisher : John Wiley & Sons
Page : 632 pages
File Size : 28,22 MB
Release : 2012-04-17
Category : Technology & Engineering
ISBN : 1118181476
The book will address the-state-of-the-art in integrated circuit design in the context of emerging systems. New exciting opportunities in body area networks, wireless communications, data networking, and optical imaging are discussed. Emerging materials that can take system performance beyond standard CMOS, like Silicon on Insulator (SOI), Silicon Germanium (SiGe), and Indium Phosphide (InP) are explored. Three-dimensional (3-D) CMOS integration and co-integration with sensor technology are described as well. The book is a must for anyone serious about circuit design for future technologies. The book is written by top notch international experts in industry and academia. The intended audience is practicing engineers with integrated circuit background. The book will be also used as a recommended reading and supplementary material in graduate course curriculum. Intended audience is professionals working in the integrated circuit design field. Their job titles might be : design engineer, product manager, marketing manager, design team leader, etc. The book will be also used by graduate students. Many of the chapter authors are University Professors.
Author : Sandeep K. Goel
Publisher : CRC Press
Page : 259 pages
File Size : 25,1 MB
Release : 2017-12-19
Category : Technology & Engineering
ISBN : 143982942X
Advances in design methods and process technologies have resulted in a continuous increase in the complexity of integrated circuits (ICs). However, the increased complexity and nanometer-size features of modern ICs make them susceptible to manufacturing defects, as well as performance and quality issues. Testing for Small-Delay Defects in Nanoscale CMOS Integrated Circuits covers common problems in areas such as process variations, power supply noise, crosstalk, resistive opens/bridges, and design-for-manufacturing (DfM)-related rule violations. The book also addresses testing for small-delay defects (SDDs), which can cause immediate timing failures on both critical and non-critical paths in the circuit. Overviews semiconductor industry test challenges and the need for SDD testing, including basic concepts and introductory material Describes algorithmic solutions incorporated in commercial tools from Mentor Graphics Reviews SDD testing based on "alternative methods" that explores new metrics, top-off ATPG, and circuit topology-based solutions Highlights the advantages and disadvantages of a diverse set of metrics, and identifies scope for improvement Written from the triple viewpoint of university researchers, EDA tool developers, and chip designers and tool users, this book is the first of its kind to address all aspects of SDD testing from such a diverse perspective. The book is designed as a one-stop reference for current industrial practices, research challenges in the domain of SDD testing, and recent developments in SDD solutions.
Author : Raimund Ubar
Publisher : IGI Global
Page : 580 pages
File Size : 44,8 MB
Release : 2011-01-01
Category : Computers
ISBN : 1609602145
"This book covers aspects of system design and efficient modelling, and also introduces various fault models and fault mechanisms associated with digital circuits integrated into System on Chip (SoC), Multi-Processor System-on Chip (MPSoC) or Network on Chip (NoC)"--
Author : Ran Wang
Publisher : Springer
Page : 192 pages
File Size : 37,6 MB
Release : 2017-03-20
Category : Technology & Engineering
ISBN : 3319547143
This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.