Author : Jennie S. Hwang
Publisher : McGraw Hill Professional
Page : 520 pages
File Size : 15,96 MB
Release : 2004-12-10
Category : Technology & Engineering
ISBN : 9780071443746
Publisher Description
Author : Sanka Ganesan
Publisher : John Wiley & Sons
Page : 796 pages
File Size : 23,41 MB
Release : 2006-03-31
Category : Technology & Engineering
ISBN : 0470007796
Lead-free Electronics provides guidance on the design and use of lead-free electronics as well as technical and legislative perspectives. All the complex challenges confronting the elec-tronics industry are skillfully addressed: * Complying with state legislation * Implementing the transition to lead-free electronics, including anticipating associated costs and potential supply chain issues * Understanding intellectual property issues in lead-free alloys and their applications, including licensing and infringement * Implementing cost effective manufacturing and testing * Reducing risks due to tin whiskers * Finding lead-free solutions in harsh environments such as in the automotive and telecommunications industries * Understanding the capabilities and limitations of conductive adhesives in lead-free interconnects * Devising solutions for lead-free, flip-chip interconnects in high-performance integrated circuit products Each chapter is written by leading experts in the field and carefully edited to ensure a consistent approach. Readers will find all the latest information, including the most recent data on cyclic thermomechanical deformation properties of lead-free SnAgCu alloys and a comparison of the properties of standard Sn-Pb versus lead-free alloys, using the energy partitioning approach. With legislative and market pressure to eliminate the use of lead in electronics manufacturing, this timely publication is essential reading for all engineers and professionals in the electronics industry.
Author : Edwin Bradley
Publisher : John Wiley & Sons
Page : 472 pages
File Size : 33,81 MB
Release : 2007-10-26
Category : Technology & Engineering
ISBN : 9780470171462
Based on the results of a more than two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing is the first practical, primary reference to cover Pb-free solder assembly as well as the analysis and reasoning behind the selection of Sn-Ag-Cu as the recommended Pb-free replacement for Sn-Pb. Reflecting the results of a two-year study, Lead-Free Electronics: iNEMI Projects Lead to Successful Manufacturing provides full coverage of the issues surrounding the implementation of Pb-free solder into electronic board assembly. This book is extremely timelyâ??most electronic manufacturers are going to change over to Pb free soldering by 2006 to meet new European laws. All manufacturers around the globe are going to be affected by this change. The text provides specific results from the thirty company NEMI project activities. It contains integrated and fully documented book chapters with references to existing published work in the area. These serve as tremendous resources for engineers and companies faced with making the switch to Pb-free solder assembly.
Author : KV Subramanian
Publisher : Springer Science & Business Media
Page : 370 pages
File Size : 43,6 MB
Release : 2007-06-28
Category : Technology & Engineering
ISBN : 0387484337
Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.
Author : Karl J. Puttlitz
Publisher : CRC Press
Page : 1044 pages
File Size : 42,66 MB
Release : 2004-02-27
Category : Technology & Engineering
ISBN : 0203021487
This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specif
Author : Katsuaki Suganuma
Publisher : CRC Press
Page : 368 pages
File Size : 40,49 MB
Release : 2003-12-11
Category : Technology & Engineering
ISBN : 9780203025772
Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free sold
Author : Jasbir Bath
Publisher : Springer Science & Business Media
Page : 307 pages
File Size : 47,87 MB
Release : 2007-06-26
Category : Technology & Engineering
ISBN : 0387684220
The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.
Author : Gregory Henshall
Publisher : John Wiley & Sons
Page : 241 pages
File Size : 18,87 MB
Release : 2011-03-29
Category : Technology & Engineering
ISBN : 1118102746
Discusses the growth mechanisms of tin whiskers and the effective mitigation strategies necessary to reduce whisker growth risks This book covers key tin whisker topics, ranging from fundamental science to practical mitigation strategies. The text begins with a review of the characteristic properties of local microstructures around whisker and hillock grains to identify why these particular grains and locations become predisposed to forming whiskers and hillocks. The book discusses the basic properties of tin-based alloy finishes and the effects of various alloying elements on whisker formation, with a focus on potential mechanisms for whisker suppression or enhancement for each element. Tin whisker risk mitigation strategies for each tier of the supply chain for high reliability electronic systems are also described. Discusses whisker formation factors including surface grain geometry, crystallographic orientation-dependent surface grain boundary structure, and the localization of elastic strain/strain energy density distribution Examines how whiskers and hillocks evolve in time through real-time studies of whisker growth with the scanning electron microscope/focused ion beaming milling (SEM/FIB) Covers characterization methods of tin and tin-based alloy finishes such as transmission electron microscopy (TEM), scanning electron microscopy (SEM), and electron backscatter diffraction (EBSD) Reviews theories of mechanically-induced tin whiskers with case studies using pure tin and other lead-free finishes shown to evaluate the pressure-induced tin whiskers Mitigating Tin Whisker Risks: Theory and Practice is intended for the broader electronic packaging and manufacturing community including: manufacturing engineers, packaging development engineers, as well as engineers and researchers in high reliability industries.
Author : Mohd N. Tamin
Publisher : Springer Science & Business
Page : 179 pages
File Size : 46,4 MB
Release : 2014-04-26
Category : Technology & Engineering
ISBN : 3319000926
This book presents a systematic approach in performing reliability assessment of solder joints using Finite Element (FE) simulation. Essential requirements for FE modelling of an electronic package or a single reflowed solder joint subjected to reliability test conditions are elaborated. These cover assumptions considered for a simplified physical model, FE model geometry development, constitutive models for solder joints and aspects of FE model validation. Fundamentals of the mechanics of solder material are adequately reviewed in relation to FE formulations. Concept of damage is introduced along with deliberation of cohesive zone model and continuum damage model for simulation of solder/IMC interface and bulk solder joint failure, respectively. Applications of the deliberated methodology to selected problems in assessing reliability of solder joints are demonstrated. These industry-defined research-based problems include solder reflow cooling, temperature cycling and mechanical fatigue of a BGA package, JEDEC board-level drop test and mechanisms of solder joint fatigue. Emphasis is placed on accurate quantitative assessment of solder joint reliability through basic understanding of the mechanics of materials as interpreted from results of FE simulations. The FE simulation methodology is readily applicable to numerous other problems in mechanics of materials and structures.
Author : Deborah D. L. Chung
Publisher : World Scientific
Page : 246 pages
File Size : 19,44 MB
Release : 2006
Category : Science
ISBN : 9812566007
The Hungarian born mathematical genius, John von Neumann, was undoubtedly one of the greatest and most influential scientific minds of the 20th century. Von Neumann made fundamental contributions to Computing and he had a keen interest in Dynamical Systems, specifically Hydrodynamic Turbulence. This book, offering a state-of-the-art collection of papers in computational dynamical systems, is dedicated to the memory of von Neumann. Including contributions from J E Marsden, P J Holmes, M Shub, A Iserles, M Dellnitz and J Guckenheimer, this book offers a unique combination of theoretical and applied research in areas such as geometric integration, neural networks, linear programming, dynamical astronomy, chemical reaction models, structural and fluid mechanics.
