Interconnect and Contact Metallization for ULSI
Author : G. S. Mathad
Publisher : The Electrochemical Society
Page : 358 pages
File Size : 40,50 MB
Release : 2000
Category : Science
ISBN : 9781566772549
Author : G. S. Mathad
Publisher : The Electrochemical Society
Page : 358 pages
File Size : 40,50 MB
Release : 2000
Category : Science
ISBN : 9781566772549
Author : Robert Havemann
Publisher : Mrs Conference Proceedings
Page : 640 pages
File Size : 43,62 MB
Release : 1997
Category : Computers
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Mikhail Baklanov
Publisher : John Wiley & Sons
Page : 616 pages
File Size : 29,81 MB
Release : 2012-04-02
Category : Technology & Engineering
ISBN : 0470662549
Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.
Author : S. P. Murarka
Publisher : Butterworth-Heinemann
Page : 268 pages
File Size : 16,98 MB
Release : 1993
Category : Computers
ISBN :
This title covers fundemental concepts, properties and applicabilities of metals and alloys for use in various metallization schemes. Metallizations form the key components on electronic circuits - controlling device properties and providing power and device interconnections with the outside world or with other devices. The recent advent of submicron dimensions and increasingly faster devices in the semiconductor have challenged researchers to keep metallization schemes in line with new demanding requirements.
Author : George J. Hefferon
Publisher :
Page : 382 pages
File Size : 15,11 MB
Release : 1992
Category : Integrated circuits
ISBN :
Author : Electrochemical Society. Dielectric Science and Technology Division
Publisher :
Page : 290 pages
File Size : 28,78 MB
Release : 1999
Category : Science
ISBN :
Author : Yosi Shacham-Diamand
Publisher : Springer Science & Business Media
Page : 545 pages
File Size : 11,29 MB
Release : 2009-09-19
Category : Science
ISBN : 0387958681
In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.
Author : Krishna Shenai
Publisher : Artech House Publishers
Page : 548 pages
File Size : 44,53 MB
Release : 1991
Category : Technology & Engineering
ISBN :
This comprehensive collection of reprinted articles presents the most important developments on VLSI contact and interconnect technologies and applications. The book covers important developments in metallization of compound semiconductor technologies, and includes a section on metallization reliability and high speed testing.
Author : Terry O. Herndon
Publisher :
Page : pages
File Size : 20,11 MB
Release : 1992
Category :
ISBN : 9781566770071
Author : Harzara S. Rathore
Publisher : The Electrochemical Society
Page : 292 pages
File Size : 11,27 MB
Release : 1998
Category : Computers
ISBN : 9781566771849