Leakage in Nanometer CMOS Technologies


Book Description

Covers in detail promising solutions at the device, circuit, and architecture levels of abstraction after first explaining the sensitivity of the various MOS leakage sources to these conditions from the first principles. Also treated are the resulting effects so the reader understands the effectiveness of leakage power reduction solutions under these different conditions. Case studies supply real-world examples that reap the benefits of leakage power reduction solutions as the book highlights different device design choices that exist to mitigate increases in the leakage components as technology scales.







Leakage in Nanometer CMOS Technologies


Book Description

Covers in detail promising solutions at the device, circuit, and architecture levels of abstraction after first explaining the sensitivity of the various MOS leakage sources to these conditions from the first principles. Also treated are the resulting effects so the reader understands the effectiveness of leakage power reduction solutions under these different conditions. Case studies supply real-world examples that reap the benefits of leakage power reduction solutions as the book highlights different device design choices that exist to mitigate increases in the leakage components as technology scales.







Technische Mechanik


Book Description




Low-Power Deep Sub-Micron CMOS Logic


Book Description

1. 1 Power-dissipation trends in CMOS circuits Shrinking device geometry, growing chip area and increased data-processing speed performance are technological trends in the integrated circuit industry to enlarge chip functionality. Already in 1965 Gordon Moore predicted that the total number of devices on a chip would double every year until the 1970s and every 24 months in the 1980s. This prediction is widely known as "Moore's Law" and eventually culminated in the Semiconductor Industry Association (SIA) technology road map [1]. The SIA road map has been a guide for the in dustry leading them to continued wafer and die size growth, increased transistor density and operating frequencies, and defect density reduction. To mention a few numbers; the die size increased 7% per year, the smallest feature sizes decreased 30% and the operating frequencies doubled every two years. As a consequence of these trends both the number of transistors and the power dissi pation per unit area increase. In the near future the maximum power dissipation per unit area will be reached. Down-scaling of the supply voltage is not only the most effective way to reduce power dissipation in general it also is a necessary precondition to ensure device reliability by reducing electrical fields and device temperature, to prevent device degradation. A draw-back of this solution is an increased signal propa gation delay, which results in a lower data-processing speed performance.




Nanometer CMOS ICs


Book Description

This textbook provides a comprehensive, fully-updated introduction to the essentials of nanometer CMOS integrated circuits. It includes aspects of scaling to even beyond 12nm CMOS technologies and designs. It clearly describes the fundamental CMOS operating principles and presents substantial insight into the various aspects of design implementation and application. Coverage includes all associated disciplines of nanometer CMOS ICs, including physics, lithography, technology, design, memories, VLSI, power consumption, variability, reliability and signal integrity, testing, yield, failure analysis, packaging, scaling trends and road blocks. The text is based upon in-house Philips, NXP Semiconductors, Applied Materials, ASML, IMEC, ST-Ericsson, TSMC, etc., courseware, which, to date, has been completed by more than 4500 engineers working in a large variety of related disciplines: architecture, design, test, fabrication process, packaging, failure analysis and software.




Subthreshold and Gate Leakage Current Analysis and Reduction in VLSI Circuits


Book Description

"CMOS technology has scaled aggressively over the past few decades in an effort to enhance functionality, speed and packing density per chip. As the feature sizes are scaling down to sub-100nm regime, leakage power is increasing significantly and is becoming the dominant component of the total power dissipation. Major contributors to the total leakage current in deep submicron regime are subthreshold and gate tunneling leakage currents. The leakage reduction technique developed so far were mostly devoted to reducing subthreshold leakage. However, at sub-65nm feature sizes, gate leakage current grows faster and is expectedd to surpass subthreshold leakage current. In this work, an extensive analysis of the circuit level characteristics of subthreshold and gate leakage currents is performed at 45nm and 32nm feature sizes. The analysis provides several key observations on the interdependency of gate and subthreshold leakages currents. Based on these observations, a new leakage reduction technique is proposed that optimizes both the leakage currents. This technique identifies minimum leakage vectors for a given circuit based on the number of transistors in OFF state and their position in the stack. The effectiveness of the proposed technique is compared to most of the mainstream leakage reduction techniques by implementing them on ISCAS89 benchmark circuits. The proposed leakage reduction technique proved to be more effective in reducing gate leakage current than subthreshold leakage current. However, when combined with dual-threshold and variable-threshold CMOS techniques, substantial subthreshold leakage current reduction was also achieved. A total savings of 53% for subthreshold leakage current and 26% for gate leakage current are reported."--Abstract.




Subthreshold SRAM Design for Energy Efficient Applications in Nanometric CMOS Technologies


Book Description

Embedded SRAM circuits are vital components in a modern system on chip (SOC) that can occupy up to 90% of the total area. Therefore, SRAM circuits heavily affect SOC performance, reliability, and yield. In addition, most of the SRAM bitcells are in standby mode and significantly contribute to the total leakage current and leakage power consumption. The aggressive demand in portable devices and billions of connected sensor networks requires long battery life. Therefore, careful design of SRAM circuits with minimal power consumption is in high demand. Reducing the power consumption is mainly achieved by reducing the power supply voltage in the idle mode. However, simply reducing the supply voltage imposes practical limitations on SRAM circuits such as reduced static noise margin, poor write margin, reduced number of cells per bitline, and reduced bitline sensing margin that might cause read/write failures. In addition, the SRAM bitcell has contradictory requirements for read stability and writability. Improving the read stability can cause difficulties in a write operation or vice versa. In this thesis, various techniques for designing subthreshold energy-efficient SRAM circuits are proposed. The proposed techniques include improvement in read margin and write margin, speed improvement, energy consumption reduction, new bitcell architecture and utilizing programmable wordline boosting. A programmable wordline boosting technique is exploited on a conventional 6T SRAM bitcell to improve the operational speed. In addition, wordline boosting can reduce the supply voltage while maintaining the operational frequency. The reduction of the supply voltage allows the memory macro to operate with reduced power consumption. To verify the design, a 16-kb SRAM was fabricated using the TSMC 65 nm CMOS technology. Measurement results show that the maximum operational frequency increases up to 33.3% when wordline boosting is applied. Besides, the supply voltage can be reduced while maintaining the same frequency. This allows reducing the energy consumption to be reduced by 22.2%. The minimum energy consumption achieved is 0.536 fJ/b at 400 mV. Moreover, to improve the read margin, a 6T bitcell SRAM with a PMOS access transistor is proposed. Utilizing a PMOS access transistor results in lower zero level degradation, and hence higher read stability. In addition, the access transistor connected to the internal node holding V DD acts as a stabilizer and counterbalances the effect of zero level degradation. In order to improve the writability, wordline boosting is exploited. Wordline boosting also helps to compensate for the lower speed of the PMOS access transistor compared to a NMOS transistor. To verify our design, a 2kb SRAM is fabricated in the TSMC 65 nm CMOS technology. Measurement results show that the maximum operating frequency of the test chip is at 3.34 MHz at 290 mV. The minimum energy consumption is measured as 1.1 fJ/b at 400 mV.