Materials Characterisation VII


Book Description

Containing papers presented at the Seventh International Conference on Materials Characterisation, this book presents the latest advances in a rapidly developing field that requires the application of a combination of numerical and experimental methods. The work has been contributed by researchers who use computational methods, those who perform experiments, and those who combine both. Materials characterisation is important to ensuring that new products meet the needs of industry and consumers. The accurate characterisation of the physical and chemical properties of the materials requires the application of both experimental techniques and computer simulation methods. The wide range of materials now available, from metals to polymers and semiconductors to composites, necessitates a variety of experimental techniques and numerical methods. The papers in the book examine various combinations of techniques. The papers cover such topics as: Mechanical Characterisation and Testing; Micro and Macro Materials Characterisation; Cementitious Materials; Advances in Composites; Semiconductor Materials Characterisation; Computational Models and Experiments; Corrosion Problems.




Materials and Contact Characterisation VIII


Book Description

Material and contact characterisation is a rapidly advancing field that requires the application of a combination of numerical and experimental methods. Including papers from the International Conference on Computational Methods and Experiments in Material and Contact Characterisation this volume presents the latest research in the field.




Materials Characterisation and Mechanism of Micro-Cutting in Ultra-Precision Diamond Turning


Book Description

This book presents an in-depth study and elucidation on the mechanisms of the micro-cutting process, with particular emphasis and a novel viewpoint on materials characterization and its influences on ultra-precision machining. Ultra-precision single point diamond turning is a key technology in the manufacture of mechanical, optical and opto-electronics components with a surface roughness of a few nanometers and form accuracy in the sub-micrometric range. In the context of subtractive manufacturing, ultra-precision diamond turning is based on the pillars of materials science, machine tools, modeling and simulation technologies, etc., making the study of such machining processes intrinsically interdisciplinary. However, in contrast to the substantial advances that have been achieved in machine design, laser metrology and control systems, relatively little research has been conducted on the material behavior and its effects on surface finish, such as the material anisotropy of crystalline materials. The feature of the significantly reduced depth of cut on the order of a few micrometers or less, which is much smaller than the average grain size of work-piece materials, unavoidably means that conventional metal cutting theories can only be of limited value in the investigation of the mechanisms at work in micro-cutting processes in ultra-precision diamond turning.




Materials Characterization


Book Description

This book covers state-of-the-art techniques commonly used in modern materials characterization. Two important aspects of characterization, materials structures and chemical analysis, are included. Widely used techniques, such as metallography (light microscopy), X-ray diffraction, transmission and scanning electron microscopy, are described. In addition, the book introduces advanced techniques, including scanning probe microscopy. The second half of the book accordingly presents techniques such as X-ray energy dispersive spectroscopy (commonly equipped in the scanning electron microscope), fluorescence X-ray spectroscopy, and popular surface analysis techniques (XPS and SIMS). Finally, vibrational spectroscopy (FTIR and Raman) and thermal analysis are also covered.




Practical Materials Characterization


Book Description

Practical Materials Characterization covers the most common materials analysis techniques in a single volume. It stands as a quick reference for experienced users, as a learning tool for students, and as a guide for the understanding of typical data interpretation for anyone looking at results from a range of analytical techniques. The book includes analytical methods covering microstructural, surface, morphological, and optical characterization of materials with emphasis on microscopic structural, electronic, biological, and mechanical properties. Many examples in this volume cover cutting-edge technologies such as nanomaterials and life sciences.




Materials Characterisation


Book Description

Containing selected papers on Materials Characterisation this volume presents the latest research in the field. Material and contact characterisation is a rapidly advancing field that requires the application of a combination of numerical and experimental methods. Contributions come from both industry and research communities using computational methods and performing experiments. Demand for high quality production from both industry and consumers has led to rapid developments in materials science and engineering. Current research is focussed on modification technologies that can increase the surface durability of materials. The characteristics of the system reveal which surface engineering methods should be chosen and as a consequence it is essential to study the combination of surface treatment and contact mechanics. The accurate characterisation of the physical and chemical properties of materials requires the application of both experimental techniques and computer simulation methods in order to gain a correct analysis. A very wide range of materials, starting with metals through polymers and semiconductors to composites, necessitates a whole spectrum of characteristic experimental techniques and research methods. The papers in this book examine various combinations of techniques across various topics.




Corrosion


Book Description

Corrosion is a degrading material process frequently encountered in engineering structures and components, which may lead to costly and catastrophic failures if not properly and timely addressed. This volume describes a wide spectrum of experimental and analytical studies, which provide a fairly comprehensive account of corrosion manifestations and methodologies for addressing them in structural and industrial design. As such, it is expected to make a valuable reference publication for engineers and scientists interested in the protection of structures and components from harmful and potentially ruinous corrosive action. The collected articles comprising this volume address issues which can be categorised into two main areas. The first is concerned with material science approaches to corrosion, that is, visual or instrumental means of assessing existing behaviour or effectiveness of corrective measures and techniques. The second part of the volume comprises boundary element simulations of cathodic protection schemes for the purpose of predicting and optimising their performance. A number of practical problems are analysed such as: the coating condition on a ballast tank wall; the impressed current cathodic protection of an offshore platform and minimizing a ship’s electric and magnetic signature. Topics covered include: Elemental identification; Material loss; Strain fields; Stress corrosion cracking; Corrosion resistance; Fretting corrosion; Contact surface damage; Electrochemical testing; Coating conditions; Cathodic protection; Current density distribution; Pipelines and deep well casings; Electric and magnetic signatures; Coating damage effects; Galvanic corrosion.




Surface Characterization Techniques


Book Description

This book covers 10 surface characterization techniques divided into three sections. The first section covers the theoretical background, instrumentation and their salient features and a general understanding behind the results. The second section delves into deeper discussion of every terminology and concept. The third section is composed of 5 sets of examples from different research papers for every technique.




Materials for Modern Technologies VII


Book Description

Selected peer-reviewed full text papers from the 10th Spring International Conference on Material Sciences and Technology (MST-S 2021) Selected, peer-reviewed papers from the 2021 Spring International Conference on Material Sciences and Technology (MST-S), April 20-22, 2021, Xi’an, China




Semiconductor Material and Device Characterization


Book Description

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.