Book Description
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Kenneth P. Rodbell
Publisher :
Page : 520 pages
File Size : 45,72 MB
Release : 1993-08-31
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Kenneth P. Rodbell
Publisher : Cambridge University Press
Page : 514 pages
File Size : 35,64 MB
Release : 2014-06-05
Category : Technology & Engineering
ISBN : 9781107409484
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Paul S. Ho
Publisher : Cambridge University Press
Page : 433 pages
File Size : 25,92 MB
Release : 2022-05-12
Category : Science
ISBN : 1107032385
Learn to assess electromigration reliability and design more resilient chips in this comprehensive and practical resource. Beginning with fundamental physics and building to advanced methodologies, this book enables the reader to develop highly reliable on-chip wiring stacks and power grids. Through a detailed review on the role of microstructure, interfaces and processing on electromigration reliability, as well as characterisation, testing and analysis, the book follows the development of on-chip interconnects from microscale to nanoscale. Practical modeling methodologies for statistical analysis, from simple 1D approximation to complex 3D description, can be used for step-by-step development of reliable on-chip wiring stacks and industrial-grade power/ground grids. This is an ideal resource for materials scientists and reliability and chip design engineers.
Author : O. J. Glembocki
Publisher :
Page : 536 pages
File Size : 37,71 MB
Release : 1994-07
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Mark Alper
Publisher :
Page : 368 pages
File Size : 50,70 MB
Release : 1994-08-24
Category : Science
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : George K. Celler
Publisher :
Page : 320 pages
File Size : 11,97 MB
Release : 1993-10-27
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author :
Publisher :
Page : 536 pages
File Size : 18,13 MB
Release : 1993
Category : Semiconductors
ISBN :
Author : Edward R. Myers
Publisher :
Page : 528 pages
File Size : 32,38 MB
Release : 1992
Category : Technology & Engineering
ISBN :
Papers of the symposium held April 13-16, 1993 in San Francisco, Calif., on: novel analysis techniques to characterize materials and device properties, process integration, degradation and modelling, CVD, spin pyrolysis, niobium and barium based ferroelectrics, materials and processes, sputter deposition, pulsed laser and other deposition techniques. Annotation copyright by Book News, Inc., Portland, OR
Author : K. S. Jones
Publisher : Mrs Proceedings
Page : 648 pages
File Size : 50,88 MB
Release : 1993-08-25
Category : Technology & Engineering
ISBN :
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Author : Zhong-lin Wang
Publisher : Springer Science & Business Media
Page : 528 pages
File Size : 28,99 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 1461553679
In the search for new functional materials, a clear understanding about the relationship between the physical properties and the atomic-scale structure of materials is needed. Here, the authors provide graduate students and scientists with an in-depth account of the evolutionary behavior of oxide functional materials within specific structural systems, discussing the intrinsic connections among these different structural systems. Over 300 illustrations and key appendices support the text.