Materials Reliability in Microelectronics VI: Volume 428


Book Description

MRS books on materials reliability in microelectronics have become the snapshot of progress in this field. Reduced feature size, increased speed, and larger area are all factors contributing to the continual performance and functionality improvements in integrated circuit technology. These same factors place demands on the reliability of the individual components that make up the IC. Achieving increased reliability requires an improved understanding of both thin-film and patterned-feature materials properties and their degradation mechanisms, how materials and processes used to fabricate ICs interact, and how they may be tailored to enable reliability improvements. This book focuses on the physics and materials science of microelectronics reliability problems rather than the traditional statistical, accelerated electrical testing aspects. Studies are grouped into three large sections covering electromigration, gate oxide reliability and mechanical stress behavior. Topics include: historical summary; reliability issues for Cu metallization; characterization of electromigration phenomena; modelling; microstructural evolution and influences; oxide and device reliability; thin oxynitride dielectrics; noncontact diagnostics; stress effects in thin films and interconnects and microbeam X-ray techniques for stress measurements.







Materials Reliability in Microelectronics VII: Volume 473


Book Description

The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.










Handbook of Semiconductor Manufacturing Technology


Book Description

The Handbook of Semiconductor Manufacturing Technology describes the individual processes and manufacturing control, support, and infrastructure technologies of silicon-based integrated-circuit manufacturing, many of which are also applicable for building devices on other semiconductor substrates. Discussing ion implantation, rapid thermal processing, photomask fabrication, chip testing, and plasma etching, the editors explore current and anticipated equipment, devices, materials, and practices of silicon-based manufacturing. The book includes a foreword by Jack S. Kilby, cowinner of the Nobel Prize in Physics 2000 "for his part in the invention of the integrated circuit."




Materials Reliability in Microelectronics II: Volume 265


Book Description

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.







Atomic Resolution Microscopy of Surfaces and Interfaces: Volume 466


Book Description

There has been a considerable expansion in the breadth and depth of studies involving scanning tunneling microscopy and high-resolution electron microscopy. The purpose of this book is to highlight recent developments and applications of atomic-resolution imaging methods to surfaces and bulk defects. Papers from a range of scientific and engineering disciplines are presented. Recent advances in imaging techniques, including quantitative image matching, are emphasized. Applications to ceramics, intermetallics and semiconductor surface reconstructions are also featured.




Statistical Mechanics in Physics and Biology: Volume 463


Book Description

Since statistical physics is a tool for the study not only of disordered physical systems, but of biological systems as well, this book from MRS focuses on both. While including physical problems such as fractals, pattern formation at first-order phase transitions, and glassy dynamics, the book also focuses on problems such as the statistical mechanics of DNA and DNA replications, structuring in biological systems, and problems in 'biologically inspired physics'. Topics include: statistical mechanics of proteins; statistical mechanics of DNA; biologically inspired physics; statistical mechanics in biology; micromanipulation in physics and biology; friction and fracture; statistical mechanics in physics and granular media.