Multifunctional Metallic Hollow Sphere Structures


Book Description

Multifunctional Metallic Hollow Sphere Structures are an emerging new material category, belonging like metal foams to the class cellular metals. Thanks to their advantageous mechanical and sound absorbing properties, Multifunctional Metallic Hollow Sphere Structures are very promising for various applications and our technological knowledge makes them ready for industrial usage. This reference gives a complete overview on this new materials class, the fundamentals, the applications and the perspective for future use. It provides the foundations for a profound understanding (production and processing), their physical properties (surface properties and stalility) and applicaltion (in particular for sound absorption and chemical adsorption in structural parts). The book is written for material scientists, product designers and developers as well as academic researches and scientists.




Physical Metallurgy


Book Description

This fifth edition of the highly regarded family of titles that first published in 1965 is now a three-volume set and over 3,000 pages. All chapters have been revised and expanded, either by the fourth edition authors alone or jointly with new co-authors. Chapters have been added on the physical metallurgy of light alloys, the physical metallurgy of titanium alloys, atom probe field ion microscopy, computational metallurgy, and orientational imaging microscopy. The books incorporate the latest experimental research results and theoretical insights. Several thousand citations to the research and review literature are included. - Exhaustively synthesizes the pertinent, contemporary developments within physical metallurgy so scientists have authoritative information at their fingertips - Replaces existing articles and monographs with a single, complete solution - Enables metallurgists to predict changes and create novel alloys and processes




Cellular and Porous Materials


Book Description

Providing the reader with a solid understanding of the fundamentals as well as an awareness of recent advances in properties and applications of cellular and porous materials, this handbook and ready reference covers all important analytical and numerical methods for characterizing and predicting thermal properties. In so doing it directly addresses the special characteristics of foam-like and hole-riddled materials, combining theoretical and experimental aspects for characterization purposes.




Fundamental Issues and Applications of Shock-Wave and High-Strain-Rate Phenomena


Book Description

This book contains the proceedings of EXPLOMETTM 2000, International Conference on Fundamental Issues and Applications of Shock-Wave and High-Strain-Rate Phenomena, held in Albuquerque, New Mexico, 2000; the fifth in the EXPLOMETTM quinquennial series which began in Albuquerque in 1980. The book is divided into five major sections with a total of 85 chapters. Section I deals with materials issues in shock and high strain rates while Section II covers shock consolidation, reactions, and synthesis. Materials aspects of ballistic and hypervelocity impact are covered in Section III followed by modeling and simulation in Section IV and a range of novel applications of shock and high-strain-rate phenomena in Section V. Like previous conference volumes published in 1980, 1985, and 1995, the current volume includes contributions from fourteen countries outside the United States. As a consequence, it is hoped that this book will serve as a global summary of current issues involving shock and high-strain-rate phenomena as well as a general reference and teaching componant for specializd curricula dealing with these features in a contemporary way. Over the past twenty years, the EXPLOMETTM Conferences have created a family of participants who not only converse every five years but who have developed long-standing interactions and professional relationships which continue to stimulate new concepts and applications particularly rooted in basic materials behavior.




Magnesium


Book Description

The need for light-weight materials, especially in the automobile industry, created renewed interest in innovative applications of magnesium materials. This demand has resulted in increased research and development activity in companies and research institutes in order to achieve an improved property profile and better choice of alloy systems. Here, development trends and application potential in different fields like the automotive industry and communication technology are discussed in an interdisciplinary framework.




Metal Foams: A Design Guide


Book Description

Metal foams are at the forefront of technological development for the automotive, aerospace, and other weight-dependent industries. They are formed by various methods, but the key facet of their manufacture is the inclusion of air or other gaseous pockets in the metal structure. The fact that gas pockets are present in their structure provides an obvious weight advantage over traditionally cast or machined solid metal components. The unique structure of metal foams also opens up more opportunities to improve on more complex methods of producing parts with space inclusions such as sand-casting. This guide provides information on the advantages metal foams possess, and the applications for which they may prove suitable. - Offers a concise description of metal foams, their manufacture, and their advantages in industry - Provides engineers with answers to pertinent questions surrounding metal foams - Satisfies a major need in the market for information on the properties, performance, and applications of these materials




Metal Foams


Book Description

This work offers a description of how metal foams are made, listing applications which have been suggested. It also covers how metal foams can be cut, finished and joined, and includes case studies illustrating successful and potential applications.










Electron Microscopy of Semiconducting Materials and ULSI Devices


Book Description

The first symposium on electron microscopy and materials for ultra-large scale integration (ULSI) at the Society's meeting attracted 34 papers by contributors from Asia, North America, and Europe. They cover specimen preparation and defect analysis in semiconductor devices; metallization, silicides, and diffusion barriers; the advanced characterization of ULSI structures, and semiconductor epitaxy and heterostructures. Annotation copyrighted by Book News, Inc., Portland, OR