Novel Methods for Low Resistance Ultra-shallow Junction Formation
Author : Sameer H. Jain
Publisher :
Page : 166 pages
File Size : 35,96 MB
Release : 2005
Category :
ISBN :
Rapid Thermal and Other Short-time Processing Technologies
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 482 pages
File Size : 23,23 MB
Release : 2000
Category : Technology & Engineering
ISBN : 9781566772747
Book Description
The proceedings from this May 2000 symposium illustrate the range of applications in Rapid Thermal Processing (RTP). The refereed papers cover a variety of issues, such as ultra-shallow junctions; contacts for nanoscale CMOS; gate stacks; new applications of RTP, such as for the enhanced crystalization of amorphous silicon thin films; and advances on RTP systems and process monitoring, including optimizing and controlling gas flows in an RTCVD reactor. Most presentations are supported by charts and other graphical data. c. Book News Inc.
Advanced Gate Stack, Source/drain, and Channel Engineering for Si-based CMOS 2
Author : Fred Roozeboom
Publisher : The Electrochemical Society
Page : 472 pages
File Size : 34,46 MB
Release : 2006
Category : Gate array circuits
ISBN : 1566775027
Book Description
These proceedings describe processing, materials, and equipment for CMOS front-end integration including gate stack, source/drain and channel engineering. Topics: strained Si/SiGe and Si/SiGe on insulator; high-mobility channels including III-V¿s, etc.; nanowires and carbon nanotubes; high-k dielectrics, metal and FUSI gate electrodes; doping/annealing for ultra-shallow junctions; low-resistivity contacts; advanced deposition (e.g. ALD, CVD, MBE), RTP, UV, plasma and laser-assisted processes.
ULSI Process Integration II
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 636 pages
File Size : 50,80 MB
Release : 2001
Category : Technology & Engineering
ISBN : 9781566773089
Book Description
ULSI Process Integration 5
Author : Cor L. Claeys
Publisher : The Electrochemical Society
Page : 509 pages
File Size : 47,38 MB
Release : 2007
Category : Integrated circuits
ISBN : 1566775728
Book Description
The symposium provided a forum for reviewing and discussing all aspects of process integration, with special focus on nanoscaled technologies, 65 nm and beyond on DRAM, SRAM, flash memory, high density logic-low power, RF, mixed analog-digital, process integration yield, CMP chemistries, low-k processes, gate stacks, metal gates, rapid thermal processing, silicides, copper interconnects, carbon nanotubes, novel materials, high mobility substrates (SOI, sSi, SiGe, GeOI), strain engineering, and hybrid integration.
Semiconductor Technology (ISTC 2001)
Author : Ming Yang
Publisher :
Page : 688 pages
File Size : 45,14 MB
Release : 2001
Category : Semiconductors
ISBN :
Book Description
ULSI Science and Technology, 1989
Author : C. M. Osburn
Publisher :
Page : 804 pages
File Size : 12,55 MB
Release : 1989
Category : Integrated circuits
ISBN :
Book Description
Dissertation Abstracts International
Author :
Publisher :
Page : 862 pages
File Size : 46,2 MB
Release : 2006
Category : Dissertations, Academic
ISBN :
Book Description
ULSI Science and Technology/1987
Author : S. Broydo
Publisher :
Page : 874 pages
File Size : 47,18 MB
Release : 1987
Category : Integrated circuits
ISBN :
Book Description
JJAP
Author :
Publisher :
Page : 926 pages
File Size : 48,97 MB
Release : 2007
Category : Engineering
ISBN :
