Author : Michael Hausner
Publisher : SPIE-International Society for Optical Engineering
Page : pages
File Size : 43,60 MB
Release : 2016-06-01
Category : Optical materials
ISBN : 9781510601796
"This book instructs inspectors and designers of optical elements and assemblies with the primary means of inspection and testing, as well as the relevant tools and instruments"--
Author : Wolfgang Osten
Publisher : CRC Press
Page : 524 pages
File Size : 43,38 MB
Release : 2018-10-03
Category : Science
ISBN : 1420019163
Where conventional testing and inspection techniques fail at the micro-scale, optical techniques provide a fast, robust, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems is the first comprehensive, up-to-date survey of the most important and widely used full-field optical metrology and inspection technologies. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moiré techniques, interference microscopy, laser Doppler vibrometry, holography, speckle metrology, and spectroscopy. They also examine modern approaches to data acquisition and processing. The book emphasizes the evaluation of various properties to increase reliability and promote a consistent approach to optical testing. Numerous practical examples and illustrations reinforce the concepts. Supplying advanced tools for microsystem manufacturing and characterization, Optical Inspection of Microsystems enables you to reach toward a higher level of quality and reliability in modern micro-scale applications.
Author : F. C. Campbell
Publisher : ASM International
Page : 496 pages
File Size : 50,46 MB
Release : 2013-04-01
Category : Technology & Engineering
ISBN : 1627080007
This book covers the technology of inspection of metals, the main emphasis on final part inspection at the manufacturing facility or on receipt at the user's facility. The unique feature of this book is that it provides an intermediate level introduction to the different methods used to inspect metals and finished parts and a more detailed review of the specific inspection methods for important metal product forms. The book is divided into two parts: Part I gives the basics of the most important methods used for inspection and testing, while Part II covers the types of methods used to inspect different classes of metallic parts. The advantages and limitations of each method are discussed, including when other methods may be warranted. In particular, the chapters on specific product forms (e.g., castings) compare the different inspection methods and why they are used.
Author : Jim Hayes
Publisher : Booksurge Publishing
Page : 0 pages
File Size : 40,20 MB
Release : 2009-09-04
Category : Fiber optics
ISBN : 9781439253878
Updated January 2019.This book is a complete guide to the design, installation, testing and operation of fiber optic networks. It was written with the assistance of many experienced Fiber Optic Association (FOA) instructors in fiber optics as a reference book for classes aimed at FOA CFOT certification as well as a basic reference for anyone working in the field of fiber optics. This book offers expansive coverage on the components and processes of fiber optics as used in all applications and installation practices. A complete curriculum for teaching fiber optics using this book as a text is available from FOA.
Author : Wolfgang Osten
Publisher : CRC Press
Page : 570 pages
File Size : 24,82 MB
Release : 2019-06-21
Category : Technology & Engineering
ISBN : 1498779506
Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts. Supplying effective tools for increased quality and reliability, this book Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques Offers numerous practical examples and illustrations Includes calibration of optical measurement systems for the inspection of MEMS Presents the characterization of dynamics of MEMS
Author : National Research Council
Publisher : National Academies Press
Page : 358 pages
File Size : 14,28 MB
Release : 1998-09-25
Category : Technology & Engineering
ISBN : 0309059917
Optical science and engineering affect almost every aspect of our lives. Millions of miles of optical fiber carry voice and data signals around the world. Lasers are used in surgery of the retina, kidneys, and heart. New high-efficiency light sources promise dramatic reductions in electricity consumption. Night-vision equipment and satellite surveillance are changing how wars are fought. Industry uses optical methods in everything from the production of computer chips to the construction of tunnels. Harnessing Light surveys this multitude of applications, as well as the status of the optics industry and of research and education in optics, and identifies actions that could enhance the field's contributions to society and facilitate its continued technical development.
Author : Pramod Rastogi
Publisher : Artech House
Page : 473 pages
File Size : 10,34 MB
Release : 2015-05-01
Category : Technology & Engineering
ISBN : 1608078078
This new resource explains the principles and applications of today’s digital optical measurement techniques. From start to finish, each chapter provides a concise introduction to the concepts and principles of digital optical metrology, followed by a detailed presentation of their applications. The development of all these topics, including their numerous methods, principles, and applications, has been illustrated using a large number of easy-to-understand figures. This book aims to not only help the reader identify the appropriate techniques in function of the measurement requirements, but also assess modern digital measurement systems.
Author : Robert Erf
Publisher : Elsevier
Page : 461 pages
File Size : 35,59 MB
Release : 2012-12-02
Category : Technology & Engineering
ISBN : 0323149502
Holographic Nondestructive Testing presents a unified discussion of the principles and methods of holography and its application holographic nondestructive testing. The book discusses in detail the basic theoretical concepts, the experimental methods for recording holograms, and different specialized holographic techniques. Several kinds of holography are discussed in the beginning chapters such as continuous-wave holography, pulsed holography, and interferometric holography. Other topics covered in the book are holographic surface contouring, holographic correlation, and holographic vibration analysis. Microwave and acoustical holography are the major areas of interest in Chapters 9 and 10. The text serves as an important reference to both engineers and optical scientists.
Author : Swarup Bhunia
Publisher : Morgan Kaufmann
Page : 528 pages
File Size : 19,25 MB
Release : 2018-10-30
Category : Computers
ISBN : 0128124784
Hardware Security: A Hands-On Learning Approach provides a broad, comprehensive and practical overview of hardware security that encompasses all levels of the electronic hardware infrastructure. It covers basic concepts like advanced attack techniques and countermeasures that are illustrated through theory, case studies and well-designed, hands-on laboratory exercises for each key concept. The book is ideal as a textbook for upper-level undergraduate students studying computer engineering, computer science, electrical engineering, and biomedical engineering, but is also a handy reference for graduate students, researchers and industry professionals. For academic courses, the book contains a robust suite of teaching ancillaries. Users will be able to access schematic, layout and design files for a printed circuit board for hardware hacking (i.e. the HaHa board) that can be used by instructors to fabricate boards, a suite of videos that demonstrate different hardware vulnerabilities, hardware attacks and countermeasures, and a detailed description and user manual for companion materials. - Provides a thorough overview of computer hardware, including the fundamentals of computer systems and the implications of security risks - Includes discussion of the liability, safety and privacy implications of hardware and software security and interaction - Gives insights on a wide range of security, trust issues and emerging attacks and protection mechanisms in the electronic hardware lifecycle, from design, fabrication, test, and distribution, straight through to supply chain and deployment in the field - A full range of instructor and student support materials can be found on the authors' own website for the book: http://hwsecuritybook.org
Author :
Publisher : ASM International
Page : 1234 pages
File Size : 39,11 MB
Release : 1989-11-01
Category : Technology & Engineering
ISBN : 9780871702852
Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.
