Chemical Abstracts


Book Description




Bell Laboratories Talks and Papers


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BTL Talks and Papers


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CRC Handbook of Metal Etchants


Book Description

This publication presents cleaning and etching solutions, their applications, and results on inorganic materials. It is a comprehensive collection of etching and cleaning solutions in a single source. Chemical formulas are presented in one of three standard formats - general, electrolytic or ionized gas formats - to insure inclusion of all necessary operational data as shown in references that accompany each numbered formula. The book describes other applications of specific solutions, including their use on other metals or metallic compounds. Physical properties, association of natural and man-made minerals, and materials are shown in relationship to crystal structure, special processing techniques and solid state devices and assemblies fabricated. This publication also presents a number of organic materials which are widely used in handling and general processing...waxes, plastics, and lacquers for example. It is useful to individuals involved in study, development, and processing of metals and metallic compounds. It is invaluable for readers from the college level to industrial R & D and full-scale device fabrication, testing and sales. Scientific disciplines, work areas and individuals with great interest include: chemistry, physics, metallurgy, geology, solid state, ceramic and glass, research libraries, individuals dealing with chemical processing of inorganic materials, societies and schools.




Fibre Optic Communication Devices


Book Description

Optoelectronic devices and fibre optics are the basis of cutting-edge communication systems. This monograph deals with the various components of these systems, including lasers, amplifiers, modulators, converters, filters, sensors, and more.




Semiconductor Material and Device Characterization


Book Description

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.




Silicon Epitaxy


Book Description

Since its inception in 1966, the series of numbered volumes known as Semiconductors and Semimetals has distinguished itself through the careful selection of well-known authors, editors, and contributors. The Willardson and Beer series, as it is widely known, has succeeded in producing numerous landmark volumes and chapters. Not only did many of these volumes make an impact at the time of their publication, but they continue to be well-cited years after their original release. Recently, Professor Eicke R. Weber of the University of California at Berkeley joined as a co-editor of the series. Professor Weber, a well-known expert in the field of semiconductor materials, will further contribute to continuing the series' tradition of publishing timely, highly relevant, and long-impacting volumes. Some of the recent volumes, such as Hydrogen in Semiconductors, Imperfections in III/V Materials, Epitaxial Microstructures, High-Speed Heterostructure Devices, Oxygen in Silicon, and others promise that this tradition will be maintained and even expanded.




WDM Technologies: Passive Optical Components


Book Description

The communications industry is at the onset of new expansion of WDM technology necessary to meet the new demand for bandwidth. This is the second of a four reference books that will cover this technology comprehensively with all of the major topics covered by a separate volumes - i.e. active components, passive components, systems and networks. This book is the first which covers all key passive optical components required for current and next generation optical communication systems. World-renowned authors, who are pioneers in their research area, have written the chapters in their area of expertise. The book highlights not only the principle of operation and characteristics of the passive optical components, but also provides an in-depth account of the state-of-the-art system applications.- Helps the reader to choose the right device for a given system application.- Provides the reader with insight and understanding for key passive optical components frequently being / to be used in the optical communication systems, essential building blocks of today's/next generation fiber optic networks.- Allows engineers working in different optical communication areas(i.e. from system to component), to understand the principle and mechanics of each key component they deal with for optical system design.- Covers Planar lightwave circuit (PLC) based router, different optical switches technologies (based on MEMS, thermo-optic, and electro-optic) and different optical amplifier technologies (based on semiconductor optical amplifier, EDFA ,and raman amplifier). - Highlights the operating principle of each component, system applications, and also future opportunities.




Sensing and Monitoring Technologies for Mines and Hazardous Areas


Book Description

Sensing and Monitoring Technologies for Mines and Hazardous Areas: Monitoring and Prediction Technologies presents the fundamentals of mining related geotechnical risk and how the latest advances in sensing and data communication can be used both to prevent accidents and provide early warnings. Opencast mining operations involve huge quantities of overburden removal, dumping, and backfilling in excavated areas. Substantial increases in the rate of accumulation of waste dumps in recent years has resulted in greater height of dumps and also has given rise to the danger of dump failures as steeper open pit slopes are prone to failure. These failures lead to loss of valuable human lives and damage to mining machinery. This book presents the most recent advances in gas sensors, methane detectors, and power cut-off systems. It also introduces monitoring of the gas strata and environment, and an overview of the use of Internet of Things and cloud computing for mining sensing and surveillance purposes. Targeted at geotechnical and mining engineers, this volume covers the latest findings and technology to prevent mining accidents and mitigate the inherent risk of the activity. - Presents complete details of a real-time slope stability monitoring system using wireless sensor networking and prediction technique based on multivariate statistical analysis of various parameters and analytical hierarchy process methods - Discusses innovative ideas and new concepts of sensing technologies, mine transport surveillance, digital mining, and cloud computing to improve safety and productivity in mining industry - Includes slope stability prediction software, downloadable through a companion website, which can be used for monitoring, analyzing, and storing different sensors and providing audio-visual, SMS, and email alerts - Covers the latest findings and technology to prevent mining accidents and mitigate the inherent risk




Semiconductor Device Reliability


Book Description

This publication is a compilation of papers presented at the Semiconductor Device Reliabi lity Workshop sponsored by the NATO International Scientific Exchange Program. The Workshop was held in Crete, Greece from June 4 to June 9, 1989. The objective of the Workshop was to review and to further explore advances in the field of semiconductor reliability through invited paper presentations and discussions. The technical emphasis was on quality assurance and reliability of optoelectronic and high speed semiconductor devices. The primary support for the meeting was provided by the Scientific Affairs Division of NATO. We are indebted to NATO for their support and to Dr. Craig Sinclair, who admin isters this program. The chapters of this book follow the format and order of the sessions of the meeting. Thirty-six papers were presented and discussed during the five-day Workshop. In addi tion, two panel sessions were held, with audience participation, where the particularly controversial topics of bum-in and reliability modeling and prediction methods were dis cussed. A brief review of these sessions is presented in this book.