Pool Boiling Heat Transfer with Highly-wetting Dielectric Fluids
Author : Seung Mun You
Publisher :
Page : 670 pages
File Size : 19,4 MB
Release : 1990
Category :
ISBN :
Author : Seung Mun You
Publisher :
Page : 670 pages
File Size : 19,4 MB
Release : 1990
Category :
ISBN :
Author : Abhay Ashok Watwe
Publisher :
Page : 504 pages
File Size : 33,76 MB
Release : 1996
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ISBN :
Author : Victor Joseph Lepere (Jr)
Publisher :
Page : 97 pages
File Size : 35,67 MB
Release : 1980
Category :
ISBN :
Experimental results of the heat transfer performance of three enhanced surfaces, a Union Carbide, Linde High Flux, a Hitachi Thermoexcel-E, a Wieland Gewa-T, and a plain copper surface in the nucleate pool boiling regime in R-113 and FC-72 are presented. Prior to obtaining the data, each of the surfaces was subjected to one of three initial conditions, and the effect of past history on boiling incipience was observed. The data showed that all the surfaces behaved in a similar manner prior to the onset of boiling. Temperature overshoots were most pronounced for the initial condition in which the surfaces were submerged in the liquid pool overnight. All of the enhanced surfaces exhibited a two to tenfold increase in the heat transfer coefficient when compared to the plain surface. The High Flux surface was most effective over a broad range of heat fluxes. The Hitachi surface showed a similar gain in heat transfer coefficient to that of the High Flux surface below 10 kW/sq m, while the Gewa-T surface was not as effective as the other surfaces at low heat fluxes. At high fluxes, the Gewa-T surface performed in a comparable if not better manner. (Author).
Author : Mehmet Arik
Publisher :
Page : 462 pages
File Size : 14,80 MB
Release : 2001
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Author : Young I. Cho
Publisher : Academic Press
Page : 459 pages
File Size : 17,70 MB
Release : 2011-11-23
Category : Science
ISBN : 0123815304
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. - Provides an overview of review articles on topics of current interest - Bridges the gap between academic researchers and practitioners in industry - A long-running and prestigious series
Author : Eric Christopher Forrest
Publisher :
Page : 130 pages
File Size : 36,35 MB
Release : 2009
Category :
ISBN :
(Cont.) Results indicate that the low global warming potential fluorinated ketone may be a viable alternative in the cooling of electronic devices. Additionally, results demonstrate that enhancement of boiling heat transfer is possible for well-wetting dielectric fluids, with 40% enhancement in the critical heat flux using dilute suspensions of aluminum or silica nanoparticles in the fluorinated ketone.
Author : Ephraim M. Sparrow
Publisher : Academic Press
Page : 360 pages
File Size : 25,87 MB
Release : 2013-11-19
Category : Science
ISBN : 0124079326
Advances in Heat Transfer fills the information gap between regularly scheduled journals and university-level textbooks by providing in-depth review articles over a broader scope than in journals or texts. The articles, which serve as a broad review for experts in the field, will also be of great interest to non-specialists who need to keep up-to-date with the results of the latest research. This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry. - This serial is essential reading for all mechanical, chemical and industrial engineers working in the field of heat transfer, graduate schools or industry
Author : C.J. Hoogendoorn
Publisher : Springer Science & Business Media
Page : 334 pages
File Size : 33,96 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401110824
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Author : Sadik Kakaç
Publisher : Springer Science & Business Media
Page : 953 pages
File Size : 35,86 MB
Release : 2012-12-06
Category : Technology & Engineering
ISBN : 9401110905
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Author : N. Zuber
Publisher :
Page : 216 pages
File Size : 37,18 MB
Release : 1959
Category : Heat
ISBN :