TFET Integrated Circuits


Book Description

This book describes the physical operation of the Tunnel Field-effect Transistor (TFET) and circuits built with this device. Whereas the majority of publications on TFETs describe in detail the device, its characteristics, variants and performance, this will be the first book addressing TFET integrated circuits (TFET ICs). The authors describe the peculiarities of TFET ICs and their differences with MOSFETs. They also develop and analyze a number of logic circuits and memories. The discussion also includes complex circuits combining CMOS and TFET, as well as a potential fabrication process in Silicon.




Integrated Circuit and System Design. Power and Timing Modeling, Optimization, and Simulation


Book Description

This book constitutes the refereed proceedings of the 20th International Conference on Integrated Circuit and System Design, PATMOS 2010, held in Grenoble, France, in September 2010. The 24 revised full papers presented and the 9 extended abstracts were carefully reviewed and are organized in topical sections on design flows; circuit techniques; low power circuits; self-timed circuits; process variation; high-level modeling of poweraware heterogeneous designs in SystemC-AMS; and minalogic.




Ageing of Integrated Circuits


Book Description

This book provides comprehensive coverage of the latest research into integrated circuits’ ageing, explaining the causes of this phenomenon, describing its effects on electronic systems, and providing mitigation techniques to build ageing-resilient circuits.




Three-Dimensional Integrated Circuit Design


Book Description

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization




Three-Dimensional Design Methodologies for Tree-based FPGA Architecture


Book Description

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.




Design of 3D Integrated Circuits and Systems


Book Description

Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D Integrated Circuits and Systems tackles all aspects of 3D integration, including 3D circuit and system design, new processes and simulation techniques, alternative communication schemes for 3D circuits and systems, application of novel materials for 3D systems, and the thermal challenges to restrict power dissipation and improve performance of 3D systems. Containing contributions from experts in industry as well as academia, this authoritative text: Illustrates different 3D integration approaches, such as die-to-die, die-to-wafer, and wafer-to-wafer Discusses the use of interposer technology and the role of Through-Silicon Vias (TSVs) Presents the latest improvements in three major fields of thermal management for multiprocessor systems-on-chip (MPSoCs) Explores ThruChip Interface (TCI), NAND flash memory stacking, and emerging applications Describes large-scale integration testing and state-of-the-art low-power testing solutions Complete with experimental results of chip-level 3D integration schemes tested at IBM and case studies on advanced complementary metal–oxide–semiconductor (CMOS) integration for 3D integrated circuits (ICs), Design of 3D Integrated Circuits and Systems is a practical reference that not only covers a wealth of design issues encountered in 3D integration but also demonstrates their impact on the efficiency of 3D systems.




Proceedings of Eighth International Congress on Information and Communication Technology


Book Description

This book gathers selected high-quality research papers presented at the Eighth International Congress on Information and Communication Technology, held at Brunel University, London, on 20–23 February 2023. It discusses emerging topics pertaining to information and communication technology (ICT) for managerial applications, e-governance, e-agriculture, e-education and computing technologies, the Internet of Things (IoT) and e-mining. Written by respected experts and researchers working on ICT, the book offers a valuable asset for young researchers involved in advanced studies. The work is presented in four volumes.




Boolean Circuit Rewiring


Book Description

Demonstrates techniques which will allow rewiring rates ofover 95%, enabling adoption of deep sub-micron chips for industrialapplications Logic synthesis is an essential part of the modern digital ICdesign process in semi-conductor industry. This book discusses alogic synthesis technique called “rewiring” and itslatest technical advancement in term of rewirability. Rewiringtechnique has surfaced in academic research since 1993 and there iscurrently no book available on the market which systematically andcomprehensively discusses this rewiring technology. The authorscover logic transformation techniques with concentration onrewiring. For many decades, the effect of wiring on logicstructures has been ignored due to an ideal view of wires and theirnegligible role in the circuit performance. However intoday’s semiconductor technology wiring is the major playerin circuit performance degeneration and logic synthesis engines canbe improved to deal with this through wire-based transformations.This book introduces the automatic test pattern generation(ATPG)-based rewiring techniques, which are recently active in therealm of logic synthesis/verification of VLSI/SOC designs. Unique comprehensive coverage of semiconductor rewiringtechniques written by leading researchers in the field Provides complete coverage of rewiring from an introductory tointermediate level Rewiring is explained as a flexible technique for Boolean logicsynthesis, introducing the concept of Boolean circuittransformation and testing, with examples Readers can directly apply the described techniques toreal-world VLSI design issues Focuses on the automatic test pattern generation (ATPG) basedrewiring methods although some non-ATPG based rewiring methods suchas graph based alternative wiring (GBAW), and “set of pairsof functions to be distinguished” (SPFD) based rewiring arealso discussed A valuable resource for researchers and postgraduate students inVLSI and SoC design, as well as digital design engineers, EDAsoftware developers, and design automation experts that specializein the synthesis and optimization of logical circuits.




Hardware Protection through Obfuscation


Book Description

This book introduces readers to various threats faced during design and fabrication by today’s integrated circuits (ICs) and systems. The authors discuss key issues, including illegal manufacturing of ICs or “IC Overproduction,” insertion of malicious circuits, referred as “Hardware Trojans”, which cause in-field chip/system malfunction, and reverse engineering and piracy of hardware intellectual property (IP). The authors provide a timely discussion of these threats, along with techniques for IC protection based on hardware obfuscation, which makes reverse-engineering an IC design infeasible for adversaries and untrusted parties with any reasonable amount of resources. This exhaustive study includes a review of the hardware obfuscation methods developed at each level of abstraction (RTL, gate, and layout) for conventional IC manufacturing, new forms of obfuscation for emerging integration strategies (split manufacturing, 2.5D ICs, and 3D ICs), and on-chip infrastructure needed for secure exchange of obfuscation keys- arguably the most critical element of hardware obfuscation.




Physical Design for 3D Integrated Circuits


Book Description

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.