The Boundary — Scan Handbook


Book Description

In February of 1990, the balloting process for the IEEE proposed standard P1149.1 was completed creating IEEE Std 1149.1-1990. Later that summer, in record time, the standard won ratification as an ANSI standard as well. This completed over six years of intensive cooperative effort by a diverse group of people who share a vision on solving some of the severe testing problems that exist now and are steadily getting worse. Early in this process, someone asked me if 1 thought that the P1l49.l effort would ever bear fruit. 1 responded somewhat glibly that "it was anyone's guess". Well, it wasn't anyone's guess, but rather the faith of a few individuals in the proposition that many testing problems could be solved if a multifaceted industry could agree on a standard for all to follow. Four of these individuals stand out; they are Harry Bleeker, Colin Maunder, Rodham Tulloss, and Lee Whetsel. In that I am convinced that the 1149.1 standard is the most significant testing development in the last 20 years, I personally feel a debt of gratitude to them and all the people who labored on the various Working Groups in its creation.




Embedded Systems Handbook


Book Description

Embedded systems are nearly ubiquitous, and books on individual topics or components of embedded systems are equally abundant. Unfortunately, for those designers who thirst for knowledge of the big picture of embedded systems there is not a drop to drink. Until now. The Embedded Systems Handbook is an oasis of information, offering a mix of basic a




Artificial Intelligence Research and Development


Book Description

The main scope of this publication is to promote collaborations among research groups in the community and to interchange ideas, allowing researchers to get a quick overview of the state of the art. This volume looks at topics including robotics and computer vision and multiagent systems.




Information Technology


Book Description

This book contains a selection of tutorials on hot topics in information technology, which were presented at the IFIP World Computer Congress. WCC2004 took place at the Centre de Congrès Pierre Baudis, in Toulouse, France, from 22 to 27 August 2004. The 11 chapters included in the book were chosen from tutorials proposals submitted to WCC2004. These papers report on several important and state-of-the-art topics on information technology such as: Quality of Service in Information Networks Risk-Driven Development of Security-Critical Systems Using UMLsec Developing Portable Software Formal Reasoning About Systems, Software and Hardware Using Functionals, Predicates and Relations The Problematic of Distributed Systems Supervision Software Rejuvenation - Modeling and Analysis Test and Design-for-Test of Mixed-Signal Integrated Circuits Web Services Applications of Multi-Agent Systems Discrete Event Simulation Human-Centered Automation We hereby would like to thank IFIP and more specifically WCC2004 Tutorials Committee and the authors for their contribution. We also would like to thank the congress organizers who have done a great job. Ricardo Reis Editor QUALITY OF SERVICE IN INFORMATION NETWORKS Augusto Casaca IST/INESC, R. Alves Redol, 1000-029, Lisboa, Portugal. Abstract: This article introduces the problems concerned with the provision of end-- end quality of service in IP networks, which are the basis of information networks, describes the existing solutions for that provision and presents some of the current research items on the subject. Key words: Information networks, IP networks, Integrated Services, Differentiated Services, Multiprotocol Label Switching, UMTS.




Electronic Design Automation for IC System Design, Verification, and Testing


Book Description

The first of two volumes in the Electronic Design Automation for Integrated Circuits Handbook, Second Edition, Electronic Design Automation for IC System Design, Verification, and Testing thoroughly examines system-level design, microarchitectural design, logic verification, and testing. Chapters contributed by leading experts authoritatively discuss processor modeling and design tools, using performance metrics to select microprocessor cores for integrated circuit (IC) designs, design and verification languages, digital simulation, hardware acceleration and emulation, and much more. New to This Edition: Major updates appearing in the initial phases of the design flow, where the level of abstraction keeps rising to support more functionality with lower non-recurring engineering (NRE) costs Significant revisions reflected in the final phases of the design flow, where the complexity due to smaller and smaller geometries is compounded by the slow progress of shorter wavelength lithography New coverage of cutting-edge applications and approaches realized in the decade since publication of the previous edition—these are illustrated by new chapters on high-level synthesis, system-on-chip (SoC) block-based design, and back-annotating system-level models Offering improved depth and modernity, Electronic Design Automation for IC System Design, Verification, and Testing provides a valuable, state-of-the-art reference for electronic design automation (EDA) students, researchers, and professionals.




Design of Systems on a Chip: Design and Test


Book Description

This book is the second of two volumes addressing the design challenges associated with new generations of semiconductor technology. The various chapters are compiled from tutorials presented at workshops in recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip.




Integrated Circuit Test Engineering


Book Description

Using the book and the software provided with it, the reader can build his/her own tester arrangement to investigate key aspects of analog-, digital- and mixed system circuits Plan of attack based on traditional testing, circuit design and circuit manufacture allows the reader to appreciate a testing regime from the point of view of all the participating interests Worked examples based on theoretical bookwork, practical experimentation and simulation exercises teach the reader how to test circuits thoroughly and effectively




Handbook of Semiconductor Manufacturing Technology


Book Description

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.




Wafer-Level Testing and Test During Burn-In for Integrated Circuits


Book Description

Wafer-level testing refers to a critical process of subjecting integrated circuits and semiconductor devices to electrical testing while they are still in wafer form. Burn-in is a temperature/bias reliability stress test used in detecting and screening out potential early life device failures. This hands-on resource provides a comprehensive analysis of these methods, showing how wafer-level testing during burn-in (WLTBI) helps lower product cost in semiconductor manufacturing. Engineers learn how to implement the testing of integrated circuits at the wafer-level under various resource constraints. Moreover, this unique book helps practitioners address the issue of enabling next generation products with previous generation testers. Practitioners also find expert insights on current industry trends in WLTBI test solutions.